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Jongho Woo - IEEE Xplore Author Profile

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We perform a comprehensive study of memory retention characteristics in ferroelectric field-effect transistors with different engineered gate stacks designed to achieve a large memory window (MW) for NAND storage applications. Through this study, we show that the widely reported retention loss in these band-engineered FEFETs can be mitigated by optimizing the position of the dielectric insert. Spe...Show More
We present an experimental study optimizing a band-engineered gate-stack by incorporating both a tunnel dielectric layer (TDL) and a gate blocking layer (GBL) for ferroelectric (FE) nand flash applications, with a total thickness budget of 18 nm. Using Hf $_{{0}.{5}}$ Zr $_{{0}.{5}}$ O2 (HZO) as the FE material, we explore Al2O3, SiO2, Si3N4, and HfO2 as TDL and GBL materials. By systematically va...Show More
We reveal the origin of disturbance issues in ferroelectric FETs (FeFETs) with a metal-gate interlayer (G.IL)-ferroelectric (FE)-channel interlayer (Ch.IL)-Si (MIFIS) stack. To achieve both low-voltage operation and disturbance immunity, we introduce a multi-functional $\text{TiO}_{2}$ layer, positioned between the G.IL and FE layer. $\text{TiO}_{2}$ multi-functional layer (MFL) serves two pivotal...Show More
For the first time, we demonstrate an in-depth analysis on a novel multi-layered gate-interfacial-layer (G.IL) and high-k channel-interfacial-layer (Ch.IL) in metal-insulator-ferroelectric-insulator-silicon (MIFIS) gate stack FeFETs, using simulations and experimental validation. By exploring materials with varying energy barrier heights between the gate metal and G.IL to control the tunneling of ...Show More
We study the disturb characteristics of ferroelectric field-effect transistors (FEFETs) with band-engineered gate stacks. We demonstrate that integrating a dielectric Al2O3 layer within the ferroelectric (FE) Hf $_{{0}.{5}}$ Zr $_{{0}.{5}}$ O2 layer in the gate stack significantly enhances the memory window (MW), achieving levels suitable for quad-level cell operation (approximately 7.5 V) while o...Show More
In this work, we experimentally demonstrate a remarkable performance improvement, boosted by the interaction of charge trapping & ferroelectric (FE) switching effects in metal-band engineered gate interlayer (BE-G.IL)- FE-channel interlayer (Ch.IL)-Si (MIFIS) FeFET. The MIFIS with BE-G.IL (BE-MIFIS) facilitates the maximized ‘positive feedback’ (Posi. FB.) of dual effects, leading to low operation...Show More
We present an experimental study to compare the impacts of different dielectric materials - Al2O3 and SiO2 used as the tunnel dielectric layer (TDL) and the gate blocking layer (GBL) on the performance of ferroelectric gate stacks for NAND storage applications. We considered the maximum memory window (MW) and the incremental step program pulse (ISPP) slope as the key performance metrics. In a gate...Show More
We report a framework for designing a ferroelectric gate stack for vertical NAND with efficient multi-bit performance by evaluating various gate stacks, including those with a tunnel dielectric layer (TDL), a gate blocking layer (GBL), different post-metallization annealing (PMA) temperatures and nanolaminates. Using the Memory Window (MW) slope as the primary design metric, our study reveals that...Show More
For the first time, we investigate a drain current (read current) degradation in Ferroelectric field effect transistor (Fe-FET). This phenomenon is due to trapping/de-trapping charge rather than charged remnant polarization (Pr) of ferroelectric layer. That is explained as a de-trapped compensation charge from the channel-side interfacial layer (IL), and a trapped charge from substrate silicon cha...Show More
Read-After-Write-Delay (RAWD) is an important show-stopper (S.S) in ferroelectric based VNAND (Fe-VNAND) because the read speed is fundamentally limited by neutralization time of trapped charges between the ferroelectric layer and the interfacial oxide layer. We investigated the RAWD time (tRAWD) in Metal-Ferro-Insulator-Silicon (MFIS) gate stack and extended the analysis to Laminate-MFIS (LaMFIS)...Show More
For the first time, a comprehensive guideline is proposed for a gate stack design of ferroelectric vertical NAND (Fe-VNAND), based on in-depth analytical modeling and experiments. Based on the guideline, the metal-insulator-ferroelectric (FE)-insulator-silicon (MIFIS) gate stack has been demonstrated, showcasing its benefits in all three aspects of reliability (endurance, retention, and disturb ch...Show More