Abstract:
An electrostatic discharge (ESD) generator may create pre- and postpulses in addition to the main pulse. These artifacts can cause additional device under test (DUT) fail...Show MoreMetadata
Abstract:
An electrostatic discharge (ESD) generator may create pre- and postpulses in addition to the main pulse. These artifacts can cause additional device under test (DUT) failures. The origin and magnitude of these pulses were investigated in four commercial generators using measurements and simulation. Two types of unwanted pulses were identified. One is caused by the reignition of the spark, and the other relates to the relay contacting for charging the main capacitor. These pulses cause strong high-frequency signals, partially surpassing the radio frequency content of the main pulse. The spectrum of the pre- and postpulses varies greatly between different generators. These differences and the fact that some DUTs may react to the pre- or postpulse instead of the main pulse lead to repeatability problems between test sites. The other artifact that has been investigated is the leakage current in contact discharge mode. The charge accumulated on the gun tip by the leakage current can contribute to a short (few nanoseconds) fast-rising pulse (<500 ps) that occurs the moment the tip is contacted, thus, before the main pulse in contact mode.
Published in: IEEE Transactions on Electromagnetic Compatibility ( Volume: 63, Issue: 6, December 2021)
Funding Agency:
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
Jianchi Zhou (Student Member, IEEE) received the B.S. degree in electrical engineering from the Huazhong University of Science and Technology, Wuhan, China, in 2015. She is currently working toward the Ph.D. degree in electrical engineering with EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA.
Her current research interests include system-level ESD, numerical simulation, and RF measurements.
Jianchi Zhou (Student Member, IEEE) received the B.S. degree in electrical engineering from the Huazhong University of Science and Technology, Wuhan, China, in 2015. She is currently working toward the Ph.D. degree in electrical engineering with EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA.
Her current research interests include system-level ESD, numerical simulation, and RF measurements.View more
Amazon Lab126, Sunnyvale, CA, USA
Pengyu Wei (Student Member, IEEE) received the B.E. degree in electronics and telecommunication from Jilin University, Changchun, China, in 2006, and the M.S. degree in electrical engineering with the Electromagnetic Compatibility (EMC) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA, in 2018.
He was a Senior EMC/electrostatic discharge (ESD) Engineer with Nokia/Microsoft, China, from 2013 to 2016...Show More
Pengyu Wei (Student Member, IEEE) received the B.E. degree in electronics and telecommunication from Jilin University, Changchun, China, in 2006, and the M.S. degree in electrical engineering with the Electromagnetic Compatibility (EMC) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA, in 2018.
He was a Senior EMC/electrostatic discharge (ESD) Engineer with Nokia/Microsoft, China, from 2013 to 2016...View more
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
Xin Yan (Student Member, IEEE) received the B.S. degree in applied physics in 2015 from Beihang University, Beijing, China, and the M.S. degree in electrical engineering in 2018 from the Missouri University of Science and Technology, Rolla, MO, USA, where he is currently working toward the Ph.D. degree with the Electromagnetic Compatibility Laboratory.
His research interests include radio frequency interference and defense...Show More
Xin Yan (Student Member, IEEE) received the B.S. degree in applied physics in 2015 from Beihang University, Beijing, China, and the M.S. degree in electrical engineering in 2018 from the Missouri University of Science and Technology, Rolla, MO, USA, where he is currently working toward the Ph.D. degree with the Electromagnetic Compatibility Laboratory.
His research interests include radio frequency interference and defense...View more
Cisco, San Jose, CA, USA
Giorgi Maghlakelidze (Student Member, IEEE) received the B.S.E.E. degree from Tbilisi State University, Tbilisi, Georgia, in 2013. He is currently working toward the Ph.D. degree with EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA.
During 2011–2013, he worked on numerical methods in EM as a Junior Scientist with EMCoS, Ltd. The year 2016 was devoted to studying signal integrity and on co-op w...Show More
Giorgi Maghlakelidze (Student Member, IEEE) received the B.S.E.E. degree from Tbilisi State University, Tbilisi, Georgia, in 2013. He is currently working toward the Ph.D. degree with EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA.
During 2011–2013, he worked on numerical methods in EM as a Junior Scientist with EMCoS, Ltd. The year 2016 was devoted to studying signal integrity and on co-op w...View more
Nexperia Germany GmbH, Hamburg, Germany
Nexperia Germany GmbH, Hamburg, Germany
Sergej Bub (Member, IEEE) received the M.Sc. degree in electrical engineering from Technical University Hamburg, Hamburg, Germany, specialized in nanoelectronics and microsystem technic, in 2017.
He is a System-Level ESD Expert with Nexperia Germany GmbH, Hamburg. His university study was finished by writing a master thesis in cooperation between TUHH and Nexperia concerning “Investigations of secondary breakdown behavior ...Show More
Sergej Bub (Member, IEEE) received the M.Sc. degree in electrical engineering from Technical University Hamburg, Hamburg, Germany, specialized in nanoelectronics and microsystem technic, in 2017.
He is a System-Level ESD Expert with Nexperia Germany GmbH, Hamburg. His university study was finished by writing a master thesis in cooperation between TUHH and Nexperia concerning “Investigations of secondary breakdown behavior ...View more
Nexperia Germany GmbH, Hamburg, Germany
Steffen Holland (Member, IEEE) received the Ph.D. degree in physics from the University of Hamburg, Hamburg, Germany, in 2004.
He was a member of research with the university until 2005. Afterward, he joined the Process Development Group of Philips Semiconductors in Hamburg. Process and device simulations of discrete semiconductor devices including ESD and surge protection quickly became the focus of his work. In 2017, he ...Show More
Steffen Holland (Member, IEEE) received the Ph.D. degree in physics from the University of Hamburg, Hamburg, Germany, in 2004.
He was a member of research with the university until 2005. Afterward, he joined the Process Development Group of Philips Semiconductors in Hamburg. Process and device simulations of discrete semiconductor devices including ESD and surge protection quickly became the focus of his work. In 2017, he ...View more
David Pommerenke (Fellow, IEEE) received the Diploma and Ph.D. degree from the Technical University Berlin, Berlin, Germany, in 1990 and 1996 respectively.
After working with Hewlett Packard for five years, he joined the Electromagnetic Compatibility Laboratory at the Missouri University of S&T in 2001. In 2020, he moved to Graz, Austria, to join the Graz EMC Lab with the Graz University of Technology. He has authored or c...Show More
David Pommerenke (Fellow, IEEE) received the Diploma and Ph.D. degree from the Technical University Berlin, Berlin, Germany, in 1990 and 1996 respectively.
After working with Hewlett Packard for five years, he joined the Electromagnetic Compatibility Laboratory at the Missouri University of S&T in 2001. In 2020, he moved to Graz, Austria, to join the Graz EMC Lab with the Graz University of Technology. He has authored or c...View more
Contents EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
Jianchi Zhou (Student Member, IEEE) received the B.S. degree in electrical engineering from the Huazhong University of Science and Technology, Wuhan, China, in 2015. She is currently working toward the Ph.D. degree in electrical engineering with EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA.
Her current research interests include system-level ESD, numerical simulation, and RF measurements.
Jianchi Zhou (Student Member, IEEE) received the B.S. degree in electrical engineering from the Huazhong University of Science and Technology, Wuhan, China, in 2015. She is currently working toward the Ph.D. degree in electrical engineering with EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA.
Her current research interests include system-level ESD, numerical simulation, and RF measurements.View more
Amazon Lab126, Sunnyvale, CA, USA
Pengyu Wei (Student Member, IEEE) received the B.E. degree in electronics and telecommunication from Jilin University, Changchun, China, in 2006, and the M.S. degree in electrical engineering with the Electromagnetic Compatibility (EMC) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA, in 2018.
He was a Senior EMC/electrostatic discharge (ESD) Engineer with Nokia/Microsoft, China, from 2013 to 2016. He has been a Senior ESD Design Engineer with Amazon since 2020. His research interests include system-level ESD protection, EMC/RF measurements, circuit design, and simulation.
Pengyu Wei (Student Member, IEEE) received the B.E. degree in electronics and telecommunication from Jilin University, Changchun, China, in 2006, and the M.S. degree in electrical engineering with the Electromagnetic Compatibility (EMC) Laboratory, Missouri University of Science and Technology, Rolla, MO, USA, in 2018.
He was a Senior EMC/electrostatic discharge (ESD) Engineer with Nokia/Microsoft, China, from 2013 to 2016. He has been a Senior ESD Design Engineer with Amazon since 2020. His research interests include system-level ESD protection, EMC/RF measurements, circuit design, and simulation.View more
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA
Xin Yan (Student Member, IEEE) received the B.S. degree in applied physics in 2015 from Beihang University, Beijing, China, and the M.S. degree in electrical engineering in 2018 from the Missouri University of Science and Technology, Rolla, MO, USA, where he is currently working toward the Ph.D. degree with the Electromagnetic Compatibility Laboratory.
His research interests include radio frequency interference and defense analysis.
Xin Yan (Student Member, IEEE) received the B.S. degree in applied physics in 2015 from Beihang University, Beijing, China, and the M.S. degree in electrical engineering in 2018 from the Missouri University of Science and Technology, Rolla, MO, USA, where he is currently working toward the Ph.D. degree with the Electromagnetic Compatibility Laboratory.
His research interests include radio frequency interference and defense analysis.View more
Cisco, San Jose, CA, USA
Giorgi Maghlakelidze (Student Member, IEEE) received the B.S.E.E. degree from Tbilisi State University, Tbilisi, Georgia, in 2013. He is currently working toward the Ph.D. degree with EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA.
During 2011–2013, he worked on numerical methods in EM as a Junior Scientist with EMCoS, Ltd. The year 2016 was devoted to studying signal integrity and on co-op with the Signal Integrity Design Group at Cisco Systems, San Jose, CA, USA. In the Fall of 2018, he has interned with the ESD Development Group at Intel Mobile Communications GmbH, Neubiberg, Germany. His research interests include electrostatic discharge, ESD soft-failure characterization, signal integrity and EMI design in high-speed digital systems, numerical methods, computational electromagnetics, measurement methods, and automation.
Giorgi Maghlakelidze (Student Member, IEEE) received the B.S.E.E. degree from Tbilisi State University, Tbilisi, Georgia, in 2013. He is currently working toward the Ph.D. degree with EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA.
During 2011–2013, he worked on numerical methods in EM as a Junior Scientist with EMCoS, Ltd. The year 2016 was devoted to studying signal integrity and on co-op with the Signal Integrity Design Group at Cisco Systems, San Jose, CA, USA. In the Fall of 2018, he has interned with the ESD Development Group at Intel Mobile Communications GmbH, Neubiberg, Germany. His research interests include electrostatic discharge, ESD soft-failure characterization, signal integrity and EMI design in high-speed digital systems, numerical methods, computational electromagnetics, measurement methods, and automation.View more
Nexperia Germany GmbH, Hamburg, Germany
Nexperia Germany GmbH, Hamburg, Germany
Sergej Bub (Member, IEEE) received the M.Sc. degree in electrical engineering from Technical University Hamburg, Hamburg, Germany, specialized in nanoelectronics and microsystem technic, in 2017.
He is a System-Level ESD Expert with Nexperia Germany GmbH, Hamburg. His university study was finished by writing a master thesis in cooperation between TUHH and Nexperia concerning “Investigations of secondary breakdown behavior of power bipolar transistors for characterization of SOA.” His current research interests include modeling and simulation of high-speed application systems and discrete ESD protection components including its development and optimization.
Sergej Bub (Member, IEEE) received the M.Sc. degree in electrical engineering from Technical University Hamburg, Hamburg, Germany, specialized in nanoelectronics and microsystem technic, in 2017.
He is a System-Level ESD Expert with Nexperia Germany GmbH, Hamburg. His university study was finished by writing a master thesis in cooperation between TUHH and Nexperia concerning “Investigations of secondary breakdown behavior of power bipolar transistors for characterization of SOA.” His current research interests include modeling and simulation of high-speed application systems and discrete ESD protection components including its development and optimization.View more
Nexperia Germany GmbH, Hamburg, Germany
Steffen Holland (Member, IEEE) received the Ph.D. degree in physics from the University of Hamburg, Hamburg, Germany, in 2004.
He was a member of research with the university until 2005. Afterward, he joined the Process Development Group of Philips Semiconductors in Hamburg. Process and device simulations of discrete semiconductor devices including ESD and surge protection quickly became the focus of his work. In 2017, he became a System Architect for ESD protection devices. He currently works with Nexperia Semiconductors, Hamburg.
Steffen Holland (Member, IEEE) received the Ph.D. degree in physics from the University of Hamburg, Hamburg, Germany, in 2004.
He was a member of research with the university until 2005. Afterward, he joined the Process Development Group of Philips Semiconductors in Hamburg. Process and device simulations of discrete semiconductor devices including ESD and surge protection quickly became the focus of his work. In 2017, he became a System Architect for ESD protection devices. He currently works with Nexperia Semiconductors, Hamburg.View more
David Pommerenke (Fellow, IEEE) received the Diploma and Ph.D. degree from the Technical University Berlin, Berlin, Germany, in 1990 and 1996 respectively.
After working with Hewlett Packard for five years, he joined the Electromagnetic Compatibility Laboratory at the Missouri University of S&T in 2001. In 2020, he moved to Graz, Austria, to join the Graz EMC Lab with the Graz University of Technology. He has authored or coauthored more than 150 journal papers and is an inventor on 13 patents. His research interests include EMC, ESD, electronics, numerical simulations, measurement methods, and instrumentations.
Dr. Pommerenke is an Associated Editor for the IEEE Transactions on Electromagnetic Compatibility.
David Pommerenke (Fellow, IEEE) received the Diploma and Ph.D. degree from the Technical University Berlin, Berlin, Germany, in 1990 and 1996 respectively.
After working with Hewlett Packard for five years, he joined the Electromagnetic Compatibility Laboratory at the Missouri University of S&T in 2001. In 2020, he moved to Graz, Austria, to join the Graz EMC Lab with the Graz University of Technology. He has authored or coauthored more than 150 journal papers and is an inventor on 13 patents. His research interests include EMC, ESD, electronics, numerical simulations, measurement methods, and instrumentations.
Dr. Pommerenke is an Associated Editor for the IEEE Transactions on Electromagnetic Compatibility.View more
