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Jianchi Zhou - IEEE Xplore Author Profile

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Author details

Jianchi Zhou

Also published under: Jianchi ZhOU, J. Zhou, Jian-Chi Zhou

Publications

29

Citations

199

Publications by Year

20162024

Co-Authors:

Kenji ArakiDaryl BeetnerAniket BhandareSergej BubJun Fan

Show All Co-Authors (64)

Jianchi Zhou

Also published under: Jianchi ZhOU, J. Zhou, Jian-Chi Zhou

Affiliation

Apple Inc.

Cupertino

CA, USA

Publication Topics

Peak Current,
Electrostatic Discharge,
Discharge Point,
Rise Time,
Corona Discharge,
Discharge Current,
Discharge Voltage,
Glass Surface,
Test Board,
Thick Glass,
Arc Length,
Central Patch

Biography

Jianchi Zhou (S’14) received the B.S. degree in electrical engineering from the Huazhong University of Science and Technology, Wuhan, China, in 2015, and is currently working toward the Ph.D. degree in electrical engineering in the Electromagnetic Compatibility Laboratory, Missouri University of Science and Technology, Rolla, MO, USA.,Her current research interests include electrostatic discharge testing, numerical simulation, and RF measurements.(Based on document published on 7 August 2019).

Publications

29

Citations

199

Publications by Year

20162024

Co-Authors:

Kenji Araki
Daryl Beetner
Aniket Bhandare
Sergej Bub
Jun Fan

Show All Co-Authors (64)

Author's Published Works

Search History

Showing 1-25 of 29 results

Conferences (18)

Journals (11)

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Single Year
David Pommerenke(26)
Jianchi Zhou(26)
Steffen Holland(7)
Sergej Bub(7)
Yang Xu(6)
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA(11)
Graz University of Technology, Graz, Austria(6)
Nexperia Germany GmbH, Hamburg, Germany(5)
Institute of Electronics Graz University of Technology & SAL Graz EMC lab, Graz, Austria(3)
EMC Laboratory, Missouri University of Science and Technology, Rolla, USA(3)
IEEE Transactions on Electromagnetic Compatibility(10)
2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)(3)
2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)(3)
2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)(2)
2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)(1)
IEEE(29)
Media(1)
Tucson, AZ, USA(3)
Washington, DC, USA(3)
Ottawa, ON, Canada(2)
Reno, NV, USA(2)
Ginowan, Okinawa, Japan(1)
Electrostatic Discharge(16)
Peak Current(14)
Rise Time(14)
Discharge Current(13)
Air Discharge(9)

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Results

A Model for Corona Streamer Propagation on Glass During an Air Discharge

Zhekun Peng;Jianchi Zhou;Darryl Kostka;David Pommerenke;Daryl Beetner

2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

Year: 2024 | Conference Paper |

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Corona discharge to a glass surface is challenging to model due to a poorly understood air and surface ionization process. A modeling methodology based on the transmission line modeling (TLM) approach is proposed to simulate the streamer propagation process. The time-changing corona streamer resistance is estimated using the Rompe and Weizel spark model. The streamer is represented using small seg...Show More

A Model for Corona Streamer Propagation on Glass During an Air Discharge

Zhekun Peng;Jianchi Zhou;Darryl Kostka;David Pommerenke;Daryl Beetner

2024 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

Year: 2024 | Conference Paper |

Dust Figure Guided Modeling of Corona Discharge on Touchscreen Surface

Zhekun Peng;Jianchi Zhou;Darryl Kostka;David Pommerenke;Daryl Beetner

2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

Year: 2024 | Conference Paper |

Cited by: Papers (1)

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Electrostatic discharge to a touchscreen display leads to a corona discharge which creates corona streamers that| propagate along the glass surface. The streamers couple energy to touch sensors underneath the glass which may then cause failure. Modeling the ionized air resistance and the current distribution on the glass surface from corona discharge is challenging. A new methodology is proposed f...Show More

Dust Figure Guided Modeling of Corona Discharge on Touchscreen Surface

Zhekun Peng;Jianchi Zhou;Darryl Kostka;David Pommerenke;Daryl Beetner

2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

Year: 2024 | Conference Paper |

Characterization and Modeling of Sparkless Discharge to a Touch Screen Display

Jianchi Zhou;Cheung-Wei Lam;Zhekun Peng;Daryl Beetner;David Pommerenke

2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)

Year: 2023 | Conference Paper |

Cited by: Papers (2)

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Although corona discharge to a touchscreen display is not associated with the spark, it could cause soft and hard failures due to electromagnetic coupling to sensitive electronics beneath the glass. Experimental data were obtained to characterize these sparkless discharges and an equivalent circuit model was constructed to predict the resulting coupling to touchscreen electronics. Measurements and...Show More

Characterization and Modeling of Sparkless Discharge to a Touch Screen Display

Jianchi Zhou;Cheung-Wei Lam;Zhekun Peng;Daryl Beetner;David Pommerenke

2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)

Year: 2023 | Conference Paper |

Improved SEED Modeling of an ESD Discharge to a USB Cable

Yang Xu;Jianchi Zhou;Sergej Bub;Steffen Holland;Javad Soleiman Meiguni;David Pommerenke;Daryl G. Beetner

IEEE Transactions on Electromagnetic Compatibility

Year: 2023 | Volume: 65, Issue: 3 | Journal Article |

Cited by: Papers (6)

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Integrated circuits (ICs) connected to a universal serial bus (USB) interface require robust electrostatic discharge (ESD) protection strategies due to the nature of the high-speed interface and the regular access by users. System-efficient ESD design (SEED) simulations can help predict the level of ESD stress seen by the IC when protected by a transient voltage suppressor (TVS). In the following ...Show More

Improved SEED Modeling of an ESD Discharge to a USB Cable

Yang Xu;Jianchi Zhou;Sergej Bub;Steffen Holland;Javad Soleiman Meiguni;David Pommerenke;Daryl G. Beetner

IEEE Transactions on Electromagnetic Compatibility

Year: 2023 | Volume: 65, Issue: 3 | Journal Article |

Modeling an ESD Gun Discharge to a USB Cable

Yang Xu;Jianchi Zhou;Daryl Beetner;Javad Meiguni;David Pommerenke;Sergej Bub;Steffen Holland

2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2022 | Conference Paper |

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When an electrostatic discharge (ESD) gun discharges to a USB cable, the routing and quality of the cable impacts the waveform seen at the printed circuit board (PCB) connected to the cable and the ability of an on-board transient voltage suppressor (TVS) to protect sensitive electronics. The impact of cable configurations during ESD gun contact discharge tests was investigated for multiple cable ...Show More

Modeling an ESD Gun Discharge to a USB Cable

Yang Xu;Jianchi Zhou;Daryl Beetner;Javad Meiguni;David Pommerenke;Sergej Bub;Steffen Holland

2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2022 | Conference Paper |

Transient Response of ESD Protection Devices for a High-Speed I/O Interface

Jianchi Zhou;Yang Xu;Sergej Bub;Steffen Holland;Javad Soleiman Meiguni;David Pommerenke;Daryl G. Beetner

IEEE Transactions on Electromagnetic Compatibility

Year: 2022 | Volume: 64, Issue: 4 | Journal Article |

Cited by: Papers (9)

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System-efficient electrostatic discharge (ESD) design (SEED) models of a diode and transient voltage suppressor (TVS) were developed to study their transient response in a high-speed input/output interface. Previously reported SEED models were improved to strengthen their convergence stability and facilitate accurate predictions over a wide range of conditions. These improvements were required to ...Show More

Transient Response of ESD Protection Devices for a High-Speed I/O Interface

Jianchi Zhou;Yang Xu;Sergej Bub;Steffen Holland;Javad Soleiman Meiguni;David Pommerenke;Daryl G. Beetner

IEEE Transactions on Electromagnetic Compatibility

Year: 2022 | Volume: 64, Issue: 4 | Journal Article |

SEED Modeling of an ESD Gun Discharge to a USB Cable Surrogate

Yang Xu;Jianchi Zhou;Javad Meiguni;Daryl G. Beetner;Sergej Bub;Steffen Holland;David Pommerenke

2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

Year: 2021 | Conference Paper |

Cited by: Papers (1)

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An IC protected by a transient voltage suppression (TVS) diode may fail if the TVS device does not turn on or does not turn on quickly enough, causing the IC to take the full brunt of the ESD event. System Efficient ESD Design (SEED) simulation can help predict when the TVS will turn on and the level of ESD stress seen by the IC. In the following paper, models are developed to predict the voltage ...Show More

SEED Modeling of an ESD Gun Discharge to a USB Cable Surrogate

Yang Xu;Jianchi Zhou;Javad Meiguni;Daryl G. Beetner;Sergej Bub;Steffen Holland;David Pommerenke

2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

Year: 2021 | Conference Paper |

Investigations Into Unintended ESD Generator Artifacts: Prepulse and Postpulse

Jianchi Zhou;Pengyu Wei;Li Shen;Xin Yan;Giorgi Maghlakelidze;Guido Notermans;Sergej Bub;Steffen Holland;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2021 | Volume: 63, Issue: 6 | Journal Article |

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An electrostatic discharge (ESD) generator may create pre- and postpulses in addition to the main pulse. These artifacts can cause additional device under test (DUT) failures. The origin and magnitude of these pulses were investigated in four commercial generators using measurements and simulation. Two types of unwanted pulses were identified. One is caused by the reignition of the spark, and the ...Show More

Investigations Into Unintended ESD Generator Artifacts: Prepulse and Postpulse

Jianchi Zhou;Pengyu Wei;Li Shen;Xin Yan;Giorgi Maghlakelidze;Guido Notermans;Sergej Bub;Steffen Holland;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2021 | Volume: 63, Issue: 6 | Journal Article |

Transient Analysis of ESD Protection Circuits for High-Speed ICs

Javad Soleiman Meiguni;Jianchi Zhou;Giorgi Maghlakelidze;Yang Xu;Omid Hoseini Izadi;Shubhankar Marathe;Li Shen;Sergej Bub;Steffen Holland;Daryl G. Beetner;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2021 | Volume: 63, Issue: 5 | Journal Article |

Cited by: Papers (19)

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Electrostatic discharge (ESD) failures in high-speed integrated circuits (ICs) cause critical reliability problems in electronic devices. Transient voltage suppressor (TVS) diodes are installed on high-speed I/O traces to improve system-level ESD protection. To protect the circuit, the majority of ESD current must flow into the external TVS diode rather than into the IC, but due to turn-on behavio...Show More

Transient Analysis of ESD Protection Circuits for High-Speed ICs

Javad Soleiman Meiguni;Jianchi Zhou;Giorgi Maghlakelidze;Yang Xu;Omid Hoseini Izadi;Shubhankar Marathe;Li Shen;Sergej Bub;Steffen Holland;Daryl G. Beetner;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2021 | Volume: 63, Issue: 5 | Journal Article |

Design of an Artificial Dummy for Human Metal Model ESD

Guang-Xiao Luo;Ke Huang;Jian-Chi Zhou;Wei Zhang;David Pommerenke;Jimmy Holliman

IEEE Transactions on Electromagnetic Compatibility

Year: 2021 | Volume: 63, Issue: 1 | Journal Article |

Cited by: Papers (7)

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Electrostatic discharge (ESD) generators do not match each other, nor do the currents and fields from the discharge of a human via a piece of metal match those from ESD generators. A more realistic characterization of the field performance of a device under test (DUT) can be achieved using human subjects. To avoid using actual humans, while still achieving similar results, a full-size dummy has be...Show More

Design of an Artificial Dummy for Human Metal Model ESD

Guang-Xiao Luo;Ke Huang;Jian-Chi Zhou;Wei Zhang;David Pommerenke;Jimmy Holliman

IEEE Transactions on Electromagnetic Compatibility

Year: 2021 | Volume: 63, Issue: 1 | Journal Article |

Race Conditions Among Protection Devices for a High Speed I/O Interface

Jianchi Zhou;Javad Meiguni;Sergej Bub;Steffen Holland;Guido Notermans;Yang Xu;Giorgi Maghlakelidze;David Pommerenke;Daryl Beetner

2020 42nd Annual EOS/ESD Symposium (EOS/ESD)

Year: 2020 | Conference Paper |

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The ESD coupling path and on-board impedances strongly affect the ESD rise time seen on a PCB trace. Possible race conditions between external and on-die ESD protection were studied using measurement-based models of the transient response and on-board passives. Results show the interplay of rise time and protection turn-on can prevent the external TVS from responding in time.Show More

Race Conditions Among Protection Devices for a High Speed I/O Interface

Jianchi Zhou;Javad Meiguni;Sergej Bub;Steffen Holland;Guido Notermans;Yang Xu;Giorgi Maghlakelidze;David Pommerenke;Daryl Beetner

2020 42nd Annual EOS/ESD Symposium (EOS/ESD)

Year: 2020 | Conference Paper |

Detection of ESD-Induced Soft Failures by Analyzing Linux Kernel Function Calls

Xiaorui Liu;Giorgi Maghlakelidze;Jianchi Zhou;Omid Hoseini Izadi;Li Shen;Martin Pommerenke;Shuzhi Sam Ge;David Pommerenke

IEEE Transactions on Device and Materials Reliability

Year: 2020 | Volume: 20, Issue: 1 | Journal Article |

Cited by: Papers (5)

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Electrostatic discharge (ESD) into a functioning system can cause temporary upsets – soft failures. Subtle soft failures can reduce the reliability of system and cannot be detected by conventional methods based on external equipment or operation system (OS) log. This paper presents a proof of concept for a novel methodology for detection of ESD-induced soft failures through analyzing kernel functi...Show More

Detection of ESD-Induced Soft Failures by Analyzing Linux Kernel Function Calls

Xiaorui Liu;Giorgi Maghlakelidze;Jianchi Zhou;Omid Hoseini Izadi;Li Shen;Martin Pommerenke;Shuzhi Sam Ge;David Pommerenke

IEEE Transactions on Device and Materials Reliability

Year: 2020 | Volume: 20, Issue: 1 | Journal Article |

Measurement Techniques to Identify Soft Failure Sensitivity to ESD

Jianchi Zhou;Yuandong Guo;Satyajeet Shinde;Ahmad Hosseinbeig;Abhishek Patnaik;Omid Hoseini Izadi;Chen Zeng;Jun Shi;Junji Maeshima;Hideki Shumiya;Kenji Araki;David J. Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2020 | Volume: 62, Issue: 4 | Journal Article |

Cited by: Papers (10)

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Electrostatic discharge (ESD)-induced soft failures are a critical issue for electronic systems as the failures are mostly found after the hardware design is completed. Any changes applied to the hardware may delay the project. Diagnostic tools capable of identifying soft failure-induced malfunctions in an early stage of product design help to reduce the risk of late stage ESD-induced project dela...Show More

Measurement Techniques to Identify Soft Failure Sensitivity to ESD

Jianchi Zhou;Yuandong Guo;Satyajeet Shinde;Ahmad Hosseinbeig;Abhishek Patnaik;Omid Hoseini Izadi;Chen Zeng;Jun Shi;Junji Maeshima;Hideki Shumiya;Kenji Araki;David J. Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2020 | Volume: 62, Issue: 4 | Journal Article |

Electrostatic Charging of a Human Body Caused by Activities and Material Combinations in Hospitals

Mehdi Kohani;David Pommerenke;Lane Kinslow;Aniket Bhandare;Li Guan;Jianchi Zhou;Christopher Spencer;Michael G. Pecht

IEEE Transactions on Electromagnetic Compatibility

Year: 2020 | Volume: 62, Issue: 2 | Journal Article |

Cited by: Papers (8)

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Electrostatic charging of hospital personnel and patients during various activities increases the risk of electrostatic discharge (ESD) malfunctions of medical devices and the likelihood of patients' adverse events. Therefore, the test level for ESD immunity of medical devices, specified in the IEC 60601-1-2 standard needs to reflect the reasonably maximum electrostatic voltages during usage. This...Show More

Electrostatic Charging of a Human Body Caused by Activities and Material Combinations in Hospitals

Mehdi Kohani;David Pommerenke;Lane Kinslow;Aniket Bhandare;Li Guan;Jianchi Zhou;Christopher Spencer;Michael G. Pecht

IEEE Transactions on Electromagnetic Compatibility

Year: 2020 | Volume: 62, Issue: 2 | Journal Article |

TVS Devices Transient Behavior Modeling Framework and Application to SEED

Li Shen;Shubhankar Marathe;Javad Meiguni;Guangxiao Luo;Jianchi Zhou;David Pommerenke

2019 41st Annual EOS/ESD Symposium (EOS/ESD)

Year: 2019 | Conference Paper |

Cited by: Papers (13)

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The transient behavior for four different types of TVS (non-snapback, snapback, spark gap, varistor) is modeled using the same modeling framework. By a 10 ns VF-TLP, the quasi-static I-V curve and the transient turn-on are captured and modeled in ADS. The models are applied in a SEED simulation to investigate the strengths and weaknesses of the modeling frame.Show More

TVS Devices Transient Behavior Modeling Framework and Application to SEED

Li Shen;Shubhankar Marathe;Javad Meiguni;Guangxiao Luo;Jianchi Zhou;David Pommerenke

2019 41st Annual EOS/ESD Symposium (EOS/ESD)

Year: 2019 | Volume: EOS-41 | Conference Paper |

Investigations into Methods to Stabilize the Spark in Air Discharge ESD

Jianchi Zhou;Keyu Zhou;Xin Yan;Li Shen;David Pommerenke;Guang-xiao Luo

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

Year: 2019 | Conference Paper |

Cited by: Papers (2)

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In the interest of improving the reproducibility of air discharge during IEC 61000-4-2 ESD testing, different methods are investigated that reduce the variation of the spark current during air discharge. As the variation is caused by the interplay of the statistical time lag and the approach speed, methods are investigated that provide initial charge carriers for the avalanche initiation at the be...Show More

Investigations into Methods to Stabilize the Spark in Air Discharge ESD

Jianchi Zhou;Keyu Zhou;Xin Yan;Li Shen;David Pommerenke;Guang-xiao Luo

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

Year: 2019 | Conference Paper |

Methodology for Analyzing ESD-Induced Soft Failure Using Full-Wave Simulation and Measurement

Ahmad Hosseinbeig;Omid Hoseini Izadi;Sudarshan Solanki;Tejasweeni D. Lingayat;Bala P. Subramanya;Ajay Kumar Vaidhyanathan;Jianchi Zhou;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2019 | Volume: 61, Issue: 1 | Journal Article |

Cited by: Papers (11)

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An analysis methodology is presented to investigate soft failures in electronic devices. This methodology combines transmission line pulse (TLP) full-wave simulations with system-level and TLP measurements. Information on susceptible parts in the device under test (DUT) and/or soft failure sensitivity of the integrated circuits (ICs) are obtained from the measurements. Then, the TLP current spread...Show More

Methodology for Analyzing ESD-Induced Soft Failure Using Full-Wave Simulation and Measurement

Ahmad Hosseinbeig;Omid Hoseini Izadi;Sudarshan Solanki;Tejasweeni D. Lingayat;Bala P. Subramanya;Ajay Kumar Vaidhyanathan;Jianchi Zhou;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2019 | Volume: 61, Issue: 1 | Journal Article |

An Application of System Level Efficient ESD Design for HighSpeed USB3.x Interface

Pengyu Wei;Giorgi Maghlakelidze;Jianchi Zhou;Harald Gossner;David Pommerenke

2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

Year: 2018 | Conference Paper |

Cited by: Papers (10)

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A high-speed USB3.x IO is analyzed using the System level efficient ESD design methodology [1] using on-board current and voltage measurements for the TX and RX pins. The interactions between external ESD protection device and the on-chip ESD protection circuit is investigated in measurement and simulation.Show More

An Application of System Level Efficient ESD Design for HighSpeed USB3.x Interface

Pengyu Wei;Giorgi Maghlakelidze;Jianchi Zhou;Harald Gossner;David Pommerenke

2018 40th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

Year: 2018 | Conference Paper |

A 20 GHz Landing Probe Design Based on Pogo-pins

Xin Yan;Yansheng Wang;Jianchi ZhOU;Tun Li;Jun Fan

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)

Year: 2018 | Conference Paper |

Cited by: Papers (3)

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A landing probe design is proposed in this paper based on pogo-pins. Landing probes are usually used to obtain TDR and S-parameters of the device under test (DUT) so that the performance of the DUT can be evaluated. This design has two major advantages. First, it is durable. Second, it can be easily integrated into automated testing systems. The designed probe works well up to 20 GHz, which is val...Show More

A 20 GHz Landing Probe Design Based on Pogo-pins

Xin Yan;Yansheng Wang;Jianchi ZhOU;Tun Li;Jun Fan

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)

Year: 2018 | Conference Paper |

Characterization of ESD Risk for Wearable Devices

Jianchi Zhou;Kaustav Ghosh;Shaojie Xiang;Xin Yan;Ahmad Hosseinbeig;Jongsung Lee;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2018 | Volume: 60, Issue: 5 | Journal Article |

Cited by: Papers (19)

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The core difference between the posture assumed for IEC 61000-4-2 human metal discharge and a discharge to a wearable device is the impedance between the charged body and the grounded structure discharged to. Especially for a waist-worn device, a larger portion of the body is close to the grounded structure; thus the geometry forms much lower impedance which will lead to higher currents. Despite t...Show More

Characterization of ESD Risk for Wearable Devices

Jianchi Zhou;Kaustav Ghosh;Shaojie Xiang;Xin Yan;Ahmad Hosseinbeig;Jongsung Lee;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2018 | Volume: 60, Issue: 5 | Journal Article |

ESD Spark Behavior and Modeling for Geometries Having Spark Lengths Greater Than the Value Predicted by Paschen's Law

Jianchi Zhou;Yingjie Gan;Hang Jin;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2018 | Volume: 60, Issue: 1 | Journal Article |

Cited by: Papers (4)

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The insulation of plastic enclosures provides protection against direct electrostatic discharge (ESD) discharges to the system inside. However, seams between plastic parts are often unavoidable. To increase the voltage at which an ESD will penetrate the structure of the seam can be modified. Four plastic arrangements are constructed to investigate the spark length and current derivatives and to un...Show More

ESD Spark Behavior and Modeling for Geometries Having Spark Lengths Greater Than the Value Predicted by Paschen's Law

Jianchi Zhou;Yingjie Gan;Hang Jin;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2018 | Volume: 60, Issue: 1 | Journal Article |

Human body impedance modelling for ESD simulations

I. Oganezova;D. Pommerenke;J. Zhou;K. Ghosh;A. Hosseinbeig;J. Lee;N. Tsitskishvili;T. Jobava;Z. Sukhiashvili;R. Jobava

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2017 | Conference Paper |

Cited by: Papers (5)

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Motivated by understanding the ESD-induced currents from body-worn, wire and hose connected medical equipment is exposed to, a computer simulation is presented to estimate the impedance of a human body relative to ground. This 3D model is the basis for transient field calculation. A Method of Moments (MoM) frequency domain solution is transformed into time domain via IFFT for further circuit level...Show More

Human body impedance modelling for ESD simulations

I. Oganezova;D. Pommerenke;J. Zhou;K. Ghosh;A. Hosseinbeig;J. Lee;N. Tsitskishvili;T. Jobava;Z. Sukhiashvili;R. Jobava

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2017 | Conference Paper |

A simple frequency response compensation method for current probe measurements of ESD currents

Sen Yang;Jianchi Zhou;David Pommerenke;Dazhao Liu

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2017 | Conference Paper |

Cited by: Papers (22)

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The transfer impedance of a current probe is typically not constant within the current probe's operational frequency range. As it is based on induction, it will suffer from reduced sensitivity at lower frequencies. Thus, a current probe cannot be used directly in a time domain measurement. The low frequency roll-off of a current probe can severely distort the actual waveform. A simple frequency re...Show More

A simple frequency response compensation method for current probe measurements of ESD currents

Sen Yang;Jianchi Zhou;David Pommerenke;Dazhao Liu

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2017 | Conference Paper |

ESD susceptibility evaluation on capacitive fingerprint module

Pengyu Wei;Shubhankar Marathe;Jianchi Zhou;David Pommerenke

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2017 | Conference Paper |

Cited by: Papers (5)

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This paper reports on an investigation of ESD stresses on a fingerprint module. It shows that sparking to the flex connector, dielectric breakdown of the insulating layers, and transient electric and magnetic fields can cause damage. Test methods and simulation models are shown. An ESD generator and ESD field probe were used to expose the fingerprint module to currents and electromagnetic fields. ...Show More

ESD susceptibility evaluation on capacitive fingerprint module

Pengyu Wei;Shubhankar Marathe;Jianchi Zhou;David Pommerenke

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2017 | Conference Paper |

Transient electromagnetic co-simulation of electrostatic air discharge

Darwin Zhang Li;Jianchi Zhou;Ahmad Hosseinbeig;David Pommerenke

2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

Year: 2017 | Conference Paper |

Cited by: Papers (5)

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Transient electromagnetic co-simulation is used to simulate the currents in a discharging rod. The simulation model simultaneously solves Maxwell's equation and the arc resistance equations in time domain to estimate the currents and fields for a given geometry, charge voltage and arc length. The Rompe-Weizel model is used to obtain the time dependent arc resistance, and results from different sim...Show More

Transient electromagnetic co-simulation of electrostatic air discharge

Darwin Zhang Li;Jianchi Zhou;Ahmad Hosseinbeig;David Pommerenke

2017 39th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)

Year: 2017 | Conference Paper |

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