Loading and Healing method to study liquid-assisted healing properties of cyclic failed bulk solder | IEEE Conference Publication | IEEE Xplore

Loading and Healing method to study liquid-assisted healing properties of cyclic failed bulk solder


Abstract:

This work presents a damage-healing protocol on SnBi bulk solder samples. After tensile-cycling a cylindrical sample until failure, the effect of liquid-assisted healing ...Show More

Abstract:

This work presents a damage-healing protocol on SnBi bulk solder samples. After tensile-cycling a cylindrical sample until failure, the effect of liquid-assisted healing is utilized in the healing step. In the course of the protocol, the mechanical performance and the residual stress-force curves after healing are obtained and converted into significant parameters for further evaluation. The presentation of mechanical performance after the healing regime is paramount in the presented test protocol. The work concludes with a discussion of damage-healing results of the studied Sn-40wt%Bi alloy.
Date of Conference: 05-08 July 2020
Date Added to IEEE Xplore: 30 July 2020
ISBN Information:
Conference Location: Cracow, Poland
References is not available for this document.

1. Introduction

Since the development of microelectronic devices requires increasingly integrated designs, the number of components attached to decreasing substrate areas, increases, the solder joint reliability grows because of the vast field of duty as electrical, mechanical and thermal link between component and substrate. The integration of components in the confined design space leads to increasing demands for solder joints reliability with focus on thermal and mechanical loads. The majority of studies in literature deal with improving material properties through alloying of the solder or improving the solder-substrate interface strength [1–4]. Using the distinct environment in microelectronic devices with varying temperature and, thereby, induced mechanical forces on the component/solder/substrate compound, to heal the solder material is a novel strategy to extend the reliability and lifetime of solder joints under service conditions. Healing in metals is still gaining interest among various material classes [5,6,7]. Two different healing mechanisms can be initiated: healing through precipitation [8] or solid-liquid phase transformation [9], which both lead to an effective regain of material cross-section and material stiffness. Specific Sn-Bi alloys were reported to show liquid-assisted healing effects under compressive forces and at elevated temperatures through local melting [10,11]. For further development of solders with healing properties, investigation of a solder under the last-mentioned load is important. The study of such properties needs, therefore, a suitable “damage-healing” test procedure.

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References

References is not available for this document.