Ernst Kozeschnik - IEEE Xplore Author Profile

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This work presents a damage-healing protocol on SnBi bulk solder samples. After tensile-cycling a cylindrical sample until failure, the effect of liquid-assisted healing is utilized in the healing step. In the course of the protocol, the mechanical performance and the residual stress-force curves after healing are obtained and converted into significant parameters for further evaluation. The prese...Show More
The effect of liquid-assisted healing (LAH) of solder materials is investigated by means of experiments and numerical modelling. An in-situ heating experiment shows the material transport due to viscous flow into a surface cavity and, thus, motivates the development of the semi-solid viscous flow model. The mechanical healing effect is illustrated through a damage-healing experiment, where cylindr...Show More
This paper introduces a numerical approach dealing with self-healing of solder materials, with detailed discussion of the damage and healing behavior of solder joints through creep deformation. The description of damage- and subsequent healing processes was done within the continuum damage mechanics (CDM) framework, assuming the formation of voids in the material due to creep deformation. The pres...Show More