Loading and Healing method to study liquid-assisted healing properties of cyclic failed bulk solder | IEEE Conference Publication | IEEE Xplore

Loading and Healing method to study liquid-assisted healing properties of cyclic failed bulk solder


Abstract:

This work presents a damage-healing protocol on SnBi bulk solder samples. After tensile-cycling a cylindrical sample until failure, the effect of liquid-assisted healing ...Show More

Abstract:

This work presents a damage-healing protocol on SnBi bulk solder samples. After tensile-cycling a cylindrical sample until failure, the effect of liquid-assisted healing is utilized in the healing step. In the course of the protocol, the mechanical performance and the residual stress-force curves after healing are obtained and converted into significant parameters for further evaluation. The presentation of mechanical performance after the healing regime is paramount in the presented test protocol. The work concludes with a discussion of damage-healing results of the studied Sn-40wt%Bi alloy.
Date of Conference: 05-08 July 2020
Date Added to IEEE Xplore: 30 July 2020
ISBN Information:
Conference Location: Cracow, Poland
TU Wien, Institute of Materials Science and Technology, Getreidemarkt 9, Wien, Austria
Materials Center Leoben Forschung GmbH, Roseggerstraße 12, Leoben, Austria
Materials Center Leoben Forschung GmbH, Roseggerstraße 12, Leoben, Austria
ZKW Elektronik GmbH, Samuel Morse-Straße 18, Wiener Neustadt, Austria
TU Wien, Institute of Materials Science and Technology, Getreidemarkt 9, Wien, Austria

TU Wien, Institute of Materials Science and Technology, Getreidemarkt 9, Wien, Austria
Materials Center Leoben Forschung GmbH, Roseggerstraße 12, Leoben, Austria
Materials Center Leoben Forschung GmbH, Roseggerstraße 12, Leoben, Austria
ZKW Elektronik GmbH, Samuel Morse-Straße 18, Wiener Neustadt, Austria
TU Wien, Institute of Materials Science and Technology, Getreidemarkt 9, Wien, Austria

References

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