Abstract:
We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via flip-chip bonding.Metadata
Abstract:
We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via flip-chip bonding.
Published in: IEEE Photonics Technology Letters ( Volume: 11, Issue: 1, January 1999)
DOI: 10.1109/68.736418
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