Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits

Abstract:

We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via flip-chip bonding.

We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via flip-chip bonding.

Published in: IEEE Photonics Technology Letters ( Volume: 11, Issue: 1, January 1999)

Page(s): 128 - 130

Date of Publication: 31 January 1999

DOI: 10.1109/68.736418

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