Vertical-cavity surface-emitting lasers flip-chip bonded to gigabit-per-second CMOS circuits

Abstract:

We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via flip-chip bonding.

We describe the first integration of vertical-cavity surface-emitting laser arrays with gigabit-per-second CMOS circuits via flip-chip bonding.

Published in: IEEE Photonics Technology Letters ( Volume: 11, Issue: 1, January 1999)

Page(s): 128 - 130

Date of Publication: 31 January 1999

DOI: 10.1109/68.736418

No metrics found for this document.

Usage

Select a Year

Total usage sinceFeb 2011:388

Year Total:1

Data is updated monthly. Usage includes PDF downloads and HTML views.

Citations

References is not available for this document.