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Powering Up Dark Silicon: Mitigating the Limitation of Power Delivery via Dynamic Pin Switching | IEEE Journals & Magazine | IEEE Xplore

Powering Up Dark Silicon: Mitigating the Limitation of Power Delivery via Dynamic Pin Switching


Abstract:

The end of Dennard scaling has led to a large amount of inactive or significantly underclocked transistors on modern chip multiprocessors in order to comply with the powe...Show More

Abstract:

The end of Dennard scaling has led to a large amount of inactive or significantly underclocked transistors on modern chip multiprocessors in order to comply with the power budget and prevent the processors from overheating. This so-called dark silicon is one of the most critical constraints that will hinder the scaling with Moore's Law in future. While advanced cooling techniques, such as liquid cooling, can effectively decrease the chip temperature and alleviate the power constraints, the peak performance, determined by the maximum number of transistors, which are allowed to switch simultaneously, is still confined by the amount of power pins on the chip package. In this paper, we propose a novel mechanism to power up the dark silicon by dynamically switching a portion of I/O pins to power pins when off-chip communications are less frequent. By enabling extra cores or increasing processor frequency, the proposed strategy can significantly boost the performance compared with the traditional designs.
Published in: IEEE Transactions on Emerging Topics in Computing ( Volume: 3, Issue: 4, December 2015)
Page(s): 489 - 501
Date of Publication: 16 July 2015

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I. Introduction

The continuous shrinking of modern semiconductors has stalled Dennard scaling, which has hitherto sustained the achievement of Moore’s Law over the past few decades. That is, the supply voltage of a transistor – hence the per-transistor switch energy - is no longer scaled with its geometric dimensions [32]. Since the on chip transistor density doubles every 18 months, the chip power is increasing faster than the power delivery system can handle. Consequently, a large portion of transistors need to be significantly under-clocked or even completely turned off to enclose the processor power consumption within a reasonable envelope. This phenomenon, which is termed “utilization wall” or “dark silicon” [20], is predicted to be one of the most critical constraints preventing us from obtaining commensurate performance benefits by adding transistors in the future.

Select All
1.
Mentor Graphics SPICE Simulator ELDO, Jul. 2015, [online] Available: http://www.mentor.com/products/ic_nanometer_design/analog-mixed-signalverification/eldo/.
2.
COMSOL Multiphysics, Jul. 2015, [online] Available: http://www.comsol.com/.
3.
4-Bit Parallel-to-Serial Converter, Jul. 2015, [online] Available: http://www.micrel.com/_PDF/HBW/sy10-100e446.pdf.
4.
4-Bit Serial-to-Parallel Converter, Jul. 2015, [online] Available: http://www.micrel.com/_PDF/HBW/sy10-100e445.pdf.
5.
Intel Xeon Processor E5-2450L, Jul. 2015, [online] Available: http://ark.intel.com/products/64610/Intel-Xeon-Processor-E5-2450L-20M-Cache-1_80-GHz-8_00-GTs-Intel-QPI.
6.
ITRS Assembly and Packaging Technical Working Group, Jul. 2015, [online] Available: http://www.itrs.net/Links/2012ITRS/2012Tables/AssemblyPkg_2012Tables.xlsx.
7.
HotSpot, Jul. 2015, [online] Available: http://lava.cs.virginia.edu/HotSpot/.
8.
Modified SPLASH-2 Benchmarks, Jul. 2015, [online] Available: http://www.capsl.udel.edu/splash/.
9.
Model for a 16 nm 0.9 V Process, Jul. 2015, [online] Available: http://ptm.asu.edu/modelcard/LP/16nm_LP.pm.
10.
SPEC CPU 2006, Jul. 2006), [online] Available: http://spec.org/cpu2006/.
11.
et al., "Heat sink integrated power delivery and distribution for integrated circuits", May 2012.
12.
C. Bienia, S. Kumar, J. P. Singh and K. Li, "The PARSEC benchmark suite: Characterization and architectural implications", Proc. 17th Int. Conf. Parallel Archit. Compilation (PACT), pp. 72-81, 2008.
13.
N. Binkert et al., "The gem5 simulator", ACM SIGARCH Comput. Archit., vol. 39, no. 2, pp. 1-7, 2011.
14.
S. Chen et al., "Increasing off-chip bandwidth in multi-core processors with switchable pins", Proc. 41st Annu. Int. Symp. Comput. Archit. (ISCA), pp. 385-396, 2014.
15.
H. David, C. Fallin, E. Gorbatov, U. R. Hanebutte and O. Mutlu, "Memory power management via dynamic voltage/frequency scaling", Proc. 8th ACM Int. Conf. Auto. Comput. (ICAC), pp. 31-40, 2011.
16.
Y. Deng and J. Liu, "Optimization and evaluation of a high-performance liquid metal CPU cooling product", IEEE Trans. Compon. Packag. Manuf. Technol., vol. 3, no. 7, pp. 1171-1177, Jul. 2013.
17.
L. Duan, B. Li and L. Peng, "Versatile prediction and fast estimation of architectural vulnerability factor from processor performance metrics", Proc. IEEE 15th Int. Symp. High Perform. Comput. Archit. (HPCA), pp. 129-140, Feb. 2009.
18.
H. Esmaeilzadeh, E. Blem, R. S. Amant, K. Sankaralingam and D. Burger, "Dark silicon and the end of multicore scaling", Proc. 38th Annu. Int. Symp. Comput. Archit. (ISCA), pp. 365-376, 2011.
19.
J. H. Friedman and N. I. Fisher, "Bump hunting in high-dimensional data", Statist. Comput., vol. 9, no. 2, pp. 123-143, 1999.
20.
N. Goulding-Hotta et al., "The GreenDroid mobile application processor: An architecture for silicon’s dark future", IEEE Micro, vol. 31, no. 2, pp. 86-95, Mar./Apr. 2011.
21.
N. Hardavellas, M. Ferdman, A. Ailamaki and B. Falsafi, "Power scaling: The ultimate obstacle to 1 K-core chips", 2010.
22.
N. Hardavellas, M. Ferdman, B. Falsafi and A. Ailamaki, "Toward dark silicon in servers", IEEE Micro, vol. 31, no. 4, pp. 6-15, Jul./Aug. 2011.
23.
B. Jacob, S. W. Ng and D. T. Wang, Memory Systems: Cache DRAM Disk, Amsterdam, The Netherlands:Elsevier, 2008.
24.
R. Jakushokas, M. Popovich, A. V. Mezhiba, S. Köse and E. G. Friedman, Power Distribution Networks With On-Chip Decoupling Capacitors, New York, NY, USA:Springer-Verlag, 2011.
25.
D. H. Kim et al., "3D-MAPS: 3D Massively parallel processor with stacked memory", IEEE Int. Solid-State Circuits Conf. Dig. Tech. Papers (ISSCC), pp. 188-190, Feb. 2012.
26.
J. Kim, J. Shim, J. S. Pak and J. Kim, "Modeling of chip-package-PCB hierarchical power distribution network based on segmentation method", Proc. Elect. Design Adv. Packag. Syst. Symp., pp. 85-88, Dec. 2008.
27.
W. Kim, D. M. Brooks and G.-Y. Wei, "A fully-integrated 3-level DC/DC converter for nanosecond-scale DVS with fast shunt regulation", IEEE Int. Solid-State Circuits Conf. Dig. Tech. Papers (ISSCC), pp. 268-270, Feb. 2011.
28.
K. L. Kishore and V. S. V. Prabhakar, VLSI Design, New Delhi, India:I.K. International Publishing House, 2009.
29.
S. Li, J. H. Ahn, R. D. Strong, J. B. Brockman, D. M. Tullsen and N. P. Jouppi, "McPAT: An integrated power area and timing modeling framework for multicore and manycore architectures", Proc. 42nd Annu. IEEE/ACM Int. Symp. Microarchitecture (MICRO), pp. 469-480, Dec. 2009.
30.
M.-L. Li, R. Sasanka, S. V. Adve, Y.-K. Chen and E. Debes, "The ALPBench benchmark suite for multimedia applications", Jul. 2005.

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References

References is not available for this document.