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CMOS-Integrable Piston-Type Micro-Mirror Array for Adaptive Optics Made of Mono-Crystalline Silicon using 3-D Integration | IEEE Conference Publication | IEEE Xplore

CMOS-Integrable Piston-Type Micro-Mirror Array for Adaptive Optics Made of Mono-Crystalline Silicon using 3-D Integration


Abstract:

This paper presents a novel CMOS-compatible fabrication process and evaluations of a micro mirror array (MMA) made of mono-crystalline silicon (m-Si) for adaptive optic (...Show More

Abstract:

This paper presents a novel CMOS-compatible fabrication process and evaluations of a micro mirror array (MMA) made of mono-crystalline silicon (m-Si) for adaptive optic (AO) applications. The m-Si mirror layer is transfer bonded from a silicon-on-insulator (SOI) donor wafer with adhesive wafer bonding towards an intermediate patterned polymer spacer layer and clamped with metal plating. We present a CMOS compatible, bond alignment-free fabrication scheme offering the potential for high air gap distances between substrate and mirrors and we show first measurements of the fabricated mirrors.
Date of Conference: 25-29 January 2009
Date Added to IEEE Xplore: 27 March 2009
ISBN Information:
Print ISSN: 1084-6999
Conference Location: Sorrento, Italy
References is not available for this document.

INTRODUCTION

Micro-mirrors have found a wide range of applications in the past decades, e.g. in projection systems [1], optical scanners [2], optical switches [3] and maskless lithography systems [4] to mention a few examples.

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1.
P. F. van Kessel, L. J. Hombeck, R. E. Meier, M. R. Douglass, "A MEMS-Based Projection Display", Proc. of the IEEE, Vol. 86, No. 8, pp.1687-1704, 1998
2.
R. A. Miller, G. W. Burr, Y. C. Tai, D. Psaltis, "Magnetically actuated MEMS scanning mirror", Proc. of SPIE, Vol. 2687, pp. 47-52, 1996
3.
M. F. Dautartas, A. M. Benzoni, Y. C. Chen, G. E. Blonder, B. H. Johnson, C. R. Paola, E. Rice, Y. H. Wong, "A silicon-based moving-mirror optical switch", J. of Lightwave Technology, Vol. 8, pp. 1078-1085, 1992 (Pubitemid 23618158)
4.
N. Choksi, D. S. Pickard, M. McCord, R. F. D. Pease, Y. Shroff, Y. Chen, W. Oldham, D. Markle, "Maskless extreme ultraviolet lithography", J. of Vacuum Science and Technology, Vol. 17, pp. 3047-3051, 1999 (Pubitemid 129494283)
5.
J. U. Schmidt, M. Friedrichs, T. Bakke, B. Voelker, D. Rudloff, H. Lakner, "Technology development for micromirror arrays with high optical fill factor and stable analogue deflection integrated on CMOS substrates", Proc. ofSPIE, Vol. 6993, pp. 69930D-1 - 6993OD-7, 2008
6.
J.U. Schmidt, J. Knobbe, A. Gehner, H. Lakner, "CMOS integrable micro mirrors with highly improved drift-stability", Proc. of SPIE, Vol. 6467, pp. 64670R-1 - 64670R-11, 2007 (Pubitemid 46761906)
7.
H. Ehrenreich, H. R. Philipp, B. Segall, "Optical Properties of Aluminum", J. Physical Review, Vol. 132, pp. 1918-1928, 1963
8.
I. W. Jung, U. Krishnamoorthy, O. Solgaard, "High fill-factor two-axis gimbaled tip-tilt-piston micromirror array actuated by self-Aligned vertical electrostatic combdrives", J. of Microelectromechanical Systems, Vol. 15, pp. 563-571, 2006 (Pubitemid 43895743)
9.
M. A. Michalicek, V. M. Bright, "Flip-chip fabrication of advanced micromirror arrays", Sensors and Actuators, Vol. 95, pp. 152-167, 2002 (Pubitemid 34061303)
10.
F. Niklaus, G. Stemme, J.Q. Lu, R.J. Gutmann, "Adhesive wafer bonding", J. of Applied Physics, Vol. 99, pp. 031101-1 - 031101-28, 2006
11.
S. van der Groeny, M. Rosmeulen, K. Baert, P. Jansen, L. Deferm, "Substrate bonding techniques for CMOS processed wafers", J. of Micromechanics and Microengineering, Vol. 7, pp. 108-110, 1997 (Pubitemid 127607053)
12.
T. Bakke, M. Friedrichs, B. Voelker, M. Reiche, L. Leonardsson, H. Schenk, H. K Lakner, "Spatial light modulators with monocrystalline silicon micromirrors made by wafer bonding", Proc. SPIE, Vol. 5715, pp. 69-79, 2005
13.
F. Niklaus, S. Haasl, G. Stemme, "Arrays of monocrystalline silicon micromirrors fabricated using CMOS compatible transfer bonding", J. of Microelectromechanical Systems, Vol. 12, pp. 465-469 2003
14.
M. Populin, A. Decharat, F. Niklaus, G. Stemme, "Thermosetting nano-imprint resists: novel materials for adhesive wafer bonding", Proc. of MEMS, pp. 239-242, 2007
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References

References is not available for this document.