1 Introduction
In a continuous effort to increase current drive and better control short-channel effects, MOS transistors have evolved from classical bulk single-gate devices into multi-gate devices. As the dimensions of transistors are shrinking, the close proximity between the source and drain reduces the ability of the gate electrode to control the potential distribution and the flow of current in the channel region, and undesirable effects, called “short channel effects” starts plaguing MOSFETs. For all practical perposes, it seems impossible to scale the dimensions of classical “bulk” MOSFETs below 20nm. In a bulk device (fig. 1(a)), the electric field lines propagate through the depletion regions associated with the junctions. Their influence on the channel can be reduced by increasing the doping concentration in the channel region. In very small devices, unfortunately, the doping concentration becomes too high for proper device operation.