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Boron diffusion in silicon


Abstract:

Well-defined control of high-and low-temperature anneals of boron implanted in silicon is important in the calculation of shallow p-n junction profiles used in MOSFET's. ...Show More

Abstract:

Well-defined control of high-and low-temperature anneals of boron implanted in silicon is important in the calculation of shallow p-n junction profiles used in MOSFET's. Here, a sample matrix of boron implanted into silicon over a range of fluences and annealing temperatures is considered. The matrix of samples was measured by SIMS (secondary ion mass spectrometry). The measured profiles were compared with simulations from an annealing/diffusion model. Calculations of the annealed profiles were found to be in agreement with the SIMS data at temperatures greater than 1000°C. At lower temperatures, the profiles exhibit effects due to implantation damage which are not included in the diffusion model.
Published in: IEEE Transactions on Electron Devices ( Volume: 32, Issue: 11, November 1985)
Page(s): 2322 - 2330
Date of Publication: 30 November 1985

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Cites in Papers - |

Cites in Papers - IEEE (6)

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1.
K. Shenai, "Diffusion profiles of boron implanted into plasma-etched silicon surfaces", IEEE Transactions on Electron Devices, vol.39, no.5, pp.1242-1245, 1992.
2.
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5.
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6.
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Cites in Papers - Other Publishers (10)

1.
H. Bracht, N. A. Stolwijk, "2 Diffusion in Si - References", Diffusion in Semiconductors, vol.33A, pp.196, 1998.
2.
H. Bracht, N. A. Stolwijk, "2 Diffusion in Si", Diffusion in Semiconductors, vol.33A, pp.12, 1998.
3.
S.A. Campbell, "Critical review of the epitaxial growth of semiconductors by rapid thermal chemical vapor deposition", Materials Science and Engineering: R: Reports, vol.20, no.1, pp.1, 1997.
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Richar.B. Fair, "Junction Formation in Silicon by Rapid Thermal Annealing", Rapid Thermal Processing, pp.169, 1993.
5.
Richard B. Fair, "Junction Formation in Silicon by Rapid Thermal Annealing", MRS Proceedings, vol.303, 1993.
6.
O.W. Holland, J. Narayan, "Model for boron diffusion in Si at high concentrations", Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, vol.40-41, pp.537, 1989.
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Richard B. Fair, "The role of transient damage annealing in shallow junction formation", Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, vol.37-38, pp.371, 1989.
8.
O. W. Holland, "New mechanism for diffusion of ion‐implanted boron in Si at high concentration", Applied Physics Letters, vol.54, no.9, pp.798, 1989.
9.
K. Shenai, N. Lewis, C. A. Smith, B. J. Baliga, "Effect of Ion Bombardment on the Dopant Diffusion During Reactive Ion Etching (RIE) of Dielectric Films Deposited on Silicon", MRS Proceedings, vol.128, 1988.
10.
J. F. Marchiando, John Albers, "Effects of ion‐implantation damage on two‐dimensional boron diffusion in silicon", Journal of Applied Physics, vol.61, no.4, pp.1380, 1987.

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