Abstract:
Well-defined control of high-and low-temperature anneals of boron implanted in silicon is important in the calculation of shallow p-n junction profiles used in MOSFET's. ...Show MoreMetadata
Abstract:
Well-defined control of high-and low-temperature anneals of boron implanted in silicon is important in the calculation of shallow p-n junction profiles used in MOSFET's. Here, a sample matrix of boron implanted into silicon over a range of fluences and annealing temperatures is considered. The matrix of samples was measured by SIMS (secondary ion mass spectrometry). The measured profiles were compared with simulations from an annealing/diffusion model. Calculations of the annealed profiles were found to be in agreement with the SIMS data at temperatures greater than 1000°C. At lower temperatures, the profiles exhibit effects due to implantation damage which are not included in the diffusion model.
Published in: IEEE Transactions on Electron Devices ( Volume: 32, Issue: 11, November 1985)
Semiconductor Devices and Circuits Division, National Bureau of Standards, Washington D.C., DC, USA
Semiconductor Devices and Circuits Division, National Bureau of Standards, Washington D.C., DC, USA
Semiconductor Devices and Circuits Division, National Bureau of Standards, Washington D.C., DC, USA
Semiconductor Devices and Circuits Division, National Bureau of Standards, Washington D.C., DC, USA
Semiconductor Devices and Circuits Division, National Bureau of Standards, Washington D.C., DC, USA
Semiconductor Devices and Circuits Division, National Bureau of Standards, Washington D.C., DC, USA