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Partial Discharge Inception in Ceramic Substrates Embedded in Silicone Liquid, Silicone Gel, and Mineral Oil at Fast Voltage Rise and Sinusoidal Voltage | IEEE Journals & Magazine | IEEE Xplore

Partial Discharge Inception in Ceramic Substrates Embedded in Silicone Liquid, Silicone Gel, and Mineral Oil at Fast Voltage Rise and Sinusoidal Voltage


Abstract:

This article summarizes experiments that were carried out on insulating ceramic substrates and a needle-plane arrangement with the purpose of characterizing the inception...Show More

Abstract:

This article summarizes experiments that were carried out on insulating ceramic substrates and a needle-plane arrangement with the purpose of characterizing the inception of partial discharges (PDs) in the insulation of high-voltage semiconductors. PD measurement results obtained on substrates are correlated with the high-field preinception currents measured in a needle-plane electrode arrangement in liquids and gel. The tested substrates were embedded in either silicone liquid, silicone gel, or mineral oil. The PD inception was measured at sinusoidal and switched voltage of different polarities and rise times. For all test objects, the PD inception voltage (PDIV) is significantly lower under switched voltage compared to the sinusoidal voltage. Silicone gel and silicone liquid as insulating media surrounding the substrate are similar in terms of the PDIV. The PDIV is lower for substrates placed in mineral oil, particularly under switched voltage. Silicone gel and liquid are characterized by very low preinception currents measured at a high electric field. In contrast, a higher preinception current is observed in mineral oil. These results are consistent with the hypothesis that the high predischarge current in the more conductive mineral oil leads to space charge build-up in the high-field region that, by deforming the electric field, affects the PD inception probability.
Published in: IEEE Transactions on Dielectrics and Electrical Insulation ( Volume: 31, Issue: 4, August 2024)
Page(s): 1721 - 1728
Date of Publication: 13 June 2024

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I. Introduction

In order to utilize the improved electrical and thermal properties of wide bandgap semiconductors such as SiC and GaN, a reliable packaging technology for power modules must be developed for higher electric and thermal stresses. Currently, the high-voltage insulation of power modules consists of three main components: insulating ceramic substrates, silicone gel filling, and the insulating housing [1], [2]. Additionally, polymeric passivation materials can be applied [3]. The use of nonlinear field grading materials in the triple point has been actively discussed [4], [5]. Aluminum nitride is used for insulated gate bipolar transistors (IGBTs) with the highest power rating. The production of the substrates includes a step where parts of the copper conductors are removed by chemical etching. This procedure creates very sharp metallic protrusions along the contour of the copper conductors. During operation, electrical discharges may start at such protrusions due to very high local electric fields [6], [7]. Such discharges may propagate deeper into the insulation along the interface between the ceramic and silicone gel.

Select All
1.
M. Ghassemi, "PD measurements failure analysis and control in high-power IGBT modules", High Voltage, vol. 3, no. 3, pp. 170-178, Sep. 2018.
2.
Z. Valdez-Nava, D. Kenfaui, M.-L. Locatelli, L. Laudebat and S. Guillemet, "Ceramic substrates for high voltage power electronics: Past present and future", Proc. IEEE Int. Workshop Integr. Power Packag. (IWIPP), pp. 91-96, Apr. 2019.
3.
I. Semenov, I. F. Gunheim, K. Niayesh, H. K. H. Meyer and L. Lundgaard, "Investigation of partial discharges in AlN substrates under fast transient voltages", IEEE Trans. Dielectr. Electr. Insul., vol. 29, no. 2, pp. 745-752, Apr. 2022.
4.
M. M. Tousi and M. Ghassemi, "Combined geometrical techniques and applying nonlinear field dependent conductivity layers to address the high electric field stress issue in high voltage high-density wide bandgap power modules", IEEE Trans. Dielectr. Electr. Insul., vol. 27, no. 1, pp. 305-313, Feb. 2020.
5.
L. Donzel and J. Schuderer, "Nonlinear resistive electric field control for power electronic modules", IEEE Trans. Dielectr. Electr. Insul., vol. 19, no. 3, pp. 955-959, Jun. 2012.
6.
M. Sato, A. Kumada, K. Hidaka, K. Yamashiro, Y. Hayase and T. Takano, "Surface discharges in silicone gel on AlN substrate", IEEE Trans. Dielectr. Electr. Insul., vol. 23, no. 1, pp. 494-500, Feb. 2016.
7.
P. Adhikari and M. Ghassemi, "A review of insulation challenges and mitigation strategies in (U)WBG power modules packaging", Proc. IEEE Texas Power Energy Conf. (TPEC), pp. 1-6, 2024.
8.
J.-L. Auge, O. Lesaint and A. T. V. Thi, "Partial discharges in ceramic substrates embedded in liquids and gels", IEEE Trans. Dielectr. Electr. Insul., vol. 20, no. 1, pp. 262-274, Feb. 2013.
9.
J. Deltour, M.-L. Locatelli, S. Dinculescu, D. Malec and D. Meyer, "Partial discharges and AC breakdown voltage tests on thick metallized aluminum nitride substrates for high voltage power modules", Proc. IEEE Elect. Insul. Conf. (EIC), pp. 1-5, Jun. 2023.
10.
X. Liu et al., "Characteristics and identification of partial discharge for insulation structures in high voltage IGBT modules under positive square wave voltage", IEEE Trans. Power Electron., vol. 38, no. 4, pp. 5347-5359, Apr. 2023.
11.
B. Zhang et al., "Dielectric properties characterization and evaluation of commercial silicone gels for high-voltage high-power power electronics module packaging", IEEE Trans. Dielectr. Electr. Insul., vol. 30, no. 1, pp. 210-219, Feb. 2023.
12.
Y. Ding, Y. Wang, H. Sun and Y. Yin, "High-temperature partial discharge characteristics of power module packaging insulation under square pulse with high dv/dt based on down-mixing method", IEEE Trans. Ind. Electron., vol. 70, no. 7, pp. 7334-7342, Jul. 2023.
13.
M. T. Do, O. Lesaint and J.-L. Auge, "Partial discharges and streamers in silicone gel used to encapsulate power electronic components", Proc. Annu. Rep.-Conf. Elect. Insul. Dielectric Phenomena, pp. 155-158, Oct. 2007.
14.
W. Yabuuchi et al., "Electric field strength and tree propagation speed for electrical treeing in silicone gel", Proc. Int. Symp. Electr. Insulating Mater. (ISEIM), pp. 474-477, Sep. 2020.
15.
S. Nakamura et al., "Electrical treeing in silicone gel under repetitive voltage impulses", IEEE Trans. Dielectr. Electr. Insul., vol. 26, no. 6, pp. 1919-1925, Dec. 2019.
16.
A. A. Abdelmalik, A. Nysveen and L. Lundgaard, "Influence of fast rise voltage and pressure on partial discharges in liquid embedded power electronics", IEEE Trans. Dielectr. Electr. Insul., vol. 22, no. 5, pp. 2770-2779, Oct. 2015.
17.
IEC, 61287-1, "Railway Applications-Power Converters Installed on Board Rolling Stock—Part 1: Characteristics and Test Methods", 2014.
18.
Moisture Measurement and Assessment in Transformer Insulation—Evaluation of Chemical Methods and Moisture Capacitive Sensors, CIGRE TB 741:WG D152, Paris, 2018.
19.
Ø. L. Hestad, L. E. Lundgaard and D. Linhjell, "New experimental system for the study of the effect of temperature and liquid to solid transition on streamers in dielectric liquids: Application to cyclohexane", IEEE Trans. Dielectr. Electr. Insul., vol. 17, no. 3, pp. 764-774, Jun. 2010.
20.
L. Dumitrescu, O. Lesaint, N. Bonifaci, A. Denat and P. Notingher, "Study of streamer inception under impulse voltage in liquid cyclohexane", Proc. Annu. Rep. Conf. Electr. Insul. Dielectric Phenomena, pp. 300-303, Oct. 2000.
21.
Ø. L. Hestad, T. G. Aakre and L. E. Lundgaard, "Conduction and electric fields in dielectric liquids in Needle-to-Plane gaps", IEEE Trans. Dielectr. Electr. Insul..
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