I. Introduction
In order to utilize the improved electrical and thermal properties of wide bandgap semiconductors such as SiC and GaN, a reliable packaging technology for power modules must be developed for higher electric and thermal stresses. Currently, the high-voltage insulation of power modules consists of three main components: insulating ceramic substrates, silicone gel filling, and the insulating housing [1], [2]. Additionally, polymeric passivation materials can be applied [3]. The use of nonlinear field grading materials in the triple point has been actively discussed [4], [5]. Aluminum nitride is used for insulated gate bipolar transistors (IGBTs) with the highest power rating. The production of the substrates includes a step where parts of the copper conductors are removed by chemical etching. This procedure creates very sharp metallic protrusions along the contour of the copper conductors. During operation, electrical discharges may start at such protrusions due to very high local electric fields [6], [7]. Such discharges may propagate deeper into the insulation along the interface between the ceramic and silicone gel.