1 Introduction
Recently the power electronic modules has grown rapidly for efficient power conversion [1]. Figure 1 shows a cross section view of a power electronic module [2]. There are wire bonds in the modules for electrical connections between the chip and output pins [3]. The wire bonds can easily be pulled off because of thermomechanical stresses. Silicone gel is used to encapsulate the modules because of its good characteristics such as adherence, elasticity to absorb mechanical stress, non-combustibility and self-healing.