Author details

Sandrick Le Maguer

Also published under: S. Le Maguer

Affiliation

Sprezzatura, Brest, France

Publication Topics

Biography

Sandrick Le Maguer photograph and biography not available at time of publication.(Based on document published on 10 April 2012).

Publications

Citations

167

Publications by Year

20012012

Co-Authors:

Show All Co-Authors (16)

Author's Published Works

Showing 1-25 of 2,108 resultsfor "Index Terms":Residual Strain

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Analysis of Thermal Residual Stress/Strain in REBCO Coated Conductor Tapes

John Ryan C. Dizon;Arman Ray N. Nisay;Marlon James A. Dedicatoria;Rodrigo C. Munoz;Hyung-Seop Shin;Sang-Soo Oh

IEEE Transactions on Applied Superconductivity

Year: 2014 | Volume: 24, Issue: 3 | Journal Article |

Cited by: Papers (18)

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Analysis of Thermal Residual Stress/Strain in REBCO Coated Conductor Tapes

John Ryan C. Dizon;Arman Ray N. Nisay;Marlon James A. Dedicatoria;Rodrigo C. Munoz;Hyung-Seop Shin;Sang-Soo Oh

IEEE Transactions on Applied Superconductivity

Year: 2014 | Volume: 24, Issue: 3 | Journal Article |

Numerical Analysis on Residual Stress Field of Brake Discs by Ultrasonic Shot Peening

Shanjin Niu;Chong Su;Xiaozhen Mi

2019 IEEE 23rd International Conference on Computer Supported Cooperative Work in Design (CSCWD)

Year: 2019 | Conference Paper |

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Numerical Analysis on Residual Stress Field of Brake Discs by Ultrasonic Shot Peening

Shanjin Niu;Chong Su;Xiaozhen Mi

2019 IEEE 23rd International Conference on Computer Supported Cooperative Work in Design (CSCWD)

Year: 2019 | Conference Paper |

High temperature full-field strain measurement based on digital image correlation during arc welding

X. Zhou;H. B. Chen;J. Chen;S. B. Chen;Zhili Feng

2016 IEEE Workshop on Advanced Robotics and its Social Impacts (ARSO)

Year: 2016 | Conference Paper |

Cited by: Papers (2)

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High temperature full-field strain measurement based on digital image correlation during arc welding

X. Zhou;H. B. Chen;J. Chen;S. B. Chen;Zhili Feng

2016 IEEE Workshop on Advanced Robotics and its Social Impacts (ARSO)

Year: 2016 | Conference Paper |

Improvement of Reversible Strain Limit for Critical Current of DI-BSCCO Due to Lamination Technique

Kozo Osamura;S. Machiya;H. Suzuki;S. Ochiai;H. Adachi;N. Ayai;K. Hayashi;K. Sato

IEEE Transactions on Applied Superconductivity

Year: 2009 | Volume: 19, Issue: 3 | Journal Article |

Cited by: Papers (28)

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Improvement of Reversible Strain Limit for Critical Current of DI-BSCCO Due to Lamination Technique

Kozo Osamura;S. Machiya;H. Suzuki;S. Ochiai;H. Adachi;N. Ayai;K. Hayashi;K. Sato

IEEE Transactions on Applied Superconductivity

Year: 2009 | Volume: 19, Issue: 3 | Journal Article |

Neutron Diffraction Study on Prebending Effects for Bronze Route$rm Nb_3rm Sn$Wires Without Reinforcement

S. Awaji;H. Oguro;G. Nishijima;P. Badica;K. Watanabe;S. Harjo;T. Kamiyama;K. Katagiri

IEEE Transactions on Applied Superconductivity

Year: 2006 | Volume: 16, Issue: 2 | Journal Article |

Cited by: Papers (19)

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Neutron Diffraction Study on Prebending Effects for Bronze Route$rm Nb_3rm Sn$Wires Without Reinforcement

S. Awaji;H. Oguro;G. Nishijima;P. Badica;K. Watanabe;S. Harjo;T. Kamiyama;K. Katagiri

IEEE Transactions on Applied Superconductivity

Year: 2006 | Volume: 16, Issue: 2 | Journal Article |

Modeling of residual strain in BGA-PCB assemblies for pad cratering control

Qiming Zhang;Jeffery C. C. Lo;S. W. Ricky Lee

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Year: 2017 | Conference Paper |

Cited by: Papers (3)

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Modeling of residual strain in BGA-PCB assemblies for pad cratering control

Qiming Zhang;Jeffery C. C. Lo;S. W. Ricky Lee

2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Year: 2017 | Conference Paper |

Influence of Deviatoric Strain for Superconducting Parameters of $\hbox{Nb}_{3}\hbox{Sn}$ Wires

Hidetoshi Oguro;Satoshi Awaji;Gen Nishijima;Petre Badica;Fumihito Shikanai;Takashi Kamiyama;Kazumune Katagiri;Kazuo Watanabe

IEEE Transactions on Applied Superconductivity

Year: 2008 | Volume: 18, Issue: 2 | Journal Article |

Cited by: Papers (6)

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Influence of Deviatoric Strain for Superconducting Parameters of $\hbox{Nb}_{3}\hbox{Sn}$ Wires

Hidetoshi Oguro;Satoshi Awaji;Gen Nishijima;Petre Badica;Fumihito Shikanai;Takashi Kamiyama;Kazumune Katagiri;Kazuo Watanabe

IEEE Transactions on Applied Superconductivity

Year: 2008 | Volume: 18, Issue: 2 | Journal Article |

Prebending Effect on Three-Dimensional Strain in ${\rm CuNb}/({\rm Nb},\ {\rm Ti})_{3}{\rm Sn}$ Wires Under a Tensile Load

Kohki Takahashi;Hidetoshi Oguro;Satoshi Awaji;Kazuo Watanabe;Stefanus Harjo;Kazuya Aizawa;Shutaro Machiya;Hiroshi Suzuki;Kozo Osamura

IEEE Transactions on Applied Superconductivity

Year: 2012 | Volume: 22, Issue: 3 | Journal Article |

Cited by: Papers (4)

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Prebending Effect on Three-Dimensional Strain in ${\rm CuNb}/({\rm Nb},\ {\rm Ti})_{3}{\rm Sn}$ Wires Under a Tensile Load

Kohki Takahashi;Hidetoshi Oguro;Satoshi Awaji;Kazuo Watanabe;Stefanus Harjo;Kazuya Aizawa;Shutaro Machiya;Hiroshi Suzuki;Kozo Osamura

IEEE Transactions on Applied Superconductivity

Year: 2012 | Volume: 22, Issue: 3 | Journal Article |

Bi-stable analysis of strain hardening shells

Yaopeng Wu;Guoliang Bai

2011 International Conference on Electric Technology and Civil Engineering (ICETCE)

Year: 2011 | Conference Paper |

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Bi-stable analysis of strain hardening shells

Yaopeng Wu;Guoliang Bai

2011 International Conference on Electric Technology and Civil Engineering (ICETCE)

Year: 2011 | Conference Paper |

Quantitative photoelastic characterization of residual strains in LEC-grown indium phosphide [100] wafers

M. Yamada;M. Fukuzawa;Y. Yabuhara;M. Yokogawa

1993 (5th) International Conference on Indium Phosphide and Related Materials

Year: 1993 | Conference Paper |

Cited by: Papers (5)

Quantitative photoelastic characterization of residual strains in LEC-grown indium phosphide [100] wafers

M. Yamada;M. Fukuzawa;Y. Yabuhara;M. Yokogawa

1993 (5th) International Conference on Indium Phosphide and Related Materials

Year: 1993 | Conference Paper |

Effect of Residual Stress After Reflow Soldering of Ball Grid Array Mixed Solder Joint on Thermal Cycling Reliability

Fangzhou Chen;Jiahao Liu;Jianyu Wu;Hao Zhao;Hui Xiao;Tao Lu

2023 14th International Conference on Reliability, Maintainability and Safety (ICRMS)

Year: 2023 | Conference Paper |

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Effect of Residual Stress After Reflow Soldering of Ball Grid Array Mixed Solder Joint on Thermal Cycling Reliability

Fangzhou Chen;Jiahao Liu;Jianyu Wu;Hao Zhao;Hui Xiao;Tao Lu

2023 14th International Conference on Reliability, Maintainability and Safety (ICRMS)

Year: 2023 | Conference Paper |

Simulation on Residual Stress Field for Aluminum Alloy 7050-T7451 of Ultrasonic Rolling Process

Feng Wang;Xiuli Fu;Xiaoying Xi;Yongzhi Pan

2019 IEEE International Conference on Real-time Computing and Robotics (RCAR)

Year: 2019 | Conference Paper |

Cited by: Papers (1)

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Simulation on Residual Stress Field for Aluminum Alloy 7050-T7451 of Ultrasonic Rolling Process

Feng Wang;Xiuli Fu;Xiaoying Xi;Yongzhi Pan

2019 IEEE International Conference on Real-time Computing and Robotics (RCAR)

Year: 2019 | Conference Paper |

Three-Dimensional Strain Model on the Superconducting Properties Under the Strain for ${\rm Nb}_{3}{\rm Sn}$ Wires

Hidetoshi Oguro;Satoshi Awaji;Gen Nishijima;Kazuo Watanabe

IEEE Transactions on Applied Superconductivity

Year: 2010 | Volume: 20, Issue: 3 | Journal Article |

Cited by: Papers (9)

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Three-Dimensional Strain Model on the Superconducting Properties Under the Strain for ${\rm Nb}_{3}{\rm Sn}$ Wires

Hidetoshi Oguro;Satoshi Awaji;Gen Nishijima;Kazuo Watanabe

IEEE Transactions on Applied Superconductivity

Year: 2010 | Volume: 20, Issue: 3 | Journal Article |

Research on Inherent Strain Distribution in Welded Low-Alloy Components

Li Yazhi

2014 Sixth International Conference on Measuring Technology and Mechatronics Automation

Year: 2014 | Conference Paper |

Cited by: Papers (2)

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Research on Inherent Strain Distribution in Welded Low-Alloy Components

Li Yazhi

2014 Sixth International Conference on Measuring Technology and Mechatronics Automation

Year: 2014 | Conference Paper |

A passive, in situ micro strain gauge

L.-L. Lin;R.T. Howe;A.P. Pisano

[1993] Proceedings IEEE Micro Electro Mechanical Systems

Year: 1993 | Conference Paper |

Cited by: Papers (22) | Patents (2)

A passive, in situ micro strain gauge

L.-L. Lin;R.T. Howe;A.P. Pisano

[1993] Proceedings IEEE Micro Electro Mechanical Systems

Year: 1993 | Conference Paper |

Effect of welded residual stresses on the fatigue life of structural components in two-dimensional state

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Tsinghua Science and Technology

Year: 1997 | Volume: 2, Issue: 2 | Journal Article |

Effect of welded residual stresses on the fatigue life of structural components in two-dimensional state

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Tsinghua Science and Technology

Year: 1997 | Volume: 2, Issue: 2 | Journal Article |

A Method of the Residual Stress Dynamic Measurement Research

Xiaohang Wan;Zhaowei Dong;Hongwei Ma

2010 International Conference on Intelligent System Design and Engineering Application

Year: 2010 | Conference Paper |

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A Method of the Residual Stress Dynamic Measurement Research

Xiaohang Wan;Zhaowei Dong;Hongwei Ma

2010 International Conference on Intelligent System Design and Engineering Application

Year: 2010 | Volume: 1 | Conference Paper |

High-spatial-resolution characterization of residual strain in commercial LEC-grown InP(100) wafers

M. Fukuzawa;M. Yamada

Seventh International Conference on Indium Phosphide and Related Materials

Year: 1995 | Conference Paper |

Cited by: Papers (3)

High-spatial-resolution characterization of residual strain in commercial LEC-grown InP(100) wafers

M. Fukuzawa;M. Yamada

Seventh International Conference on Indium Phosphide and Related Materials

Year: 1995 | Conference Paper |

Residual Stress Analysis of a Cu2ZnSnS4 Thin Film

Sungwook Hong;Chan Kim

2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC)

Year: 2018 | Conference Paper |

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Residual Stress Analysis of a Cu2ZnSnS4 Thin Film

Sungwook Hong;Chan Kim

2018 IEEE 7th World Conference on Photovoltaic Energy Conversion (WCPEC) (A Joint Conference of 45th IEEE PVSC, 28th PVSEC & 34th EU PVSEC)

Year: 2018 | Conference Paper |

Multicyclic modelling of softening in biological tissue

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IMA Journal of Applied Mathematics

Year: 2014 | Volume: 79, Issue: 6 | Journal Article |

Multicyclic modelling of softening in biological tissue

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IMA Journal of Applied Mathematics

Year: 2014 | Volume: 79, Issue: 6 | Journal Article |

Accuracy Improvement of Residual Stress Measurement by Chirp Compensation of FBG

Yao Xu;Chao Duan;Zhuoshu Li;Tao Tan;Chengjun Qiu;Gui Xiao;Ye Tian;Weibin Zhang;Jianzhong Zhang

IEEE Transactions on Instrumentation and Measurement

Year: 2021 | Volume: 70 | Journal Article |

Cited by: Papers (2)

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Accuracy Improvement of Residual Stress Measurement by Chirp Compensation of FBG

Yao Xu;Chao Duan;Zhuoshu Li;Tao Tan;Chengjun Qiu;Gui Xiao;Ye Tian;Weibin Zhang;Jianzhong Zhang

IEEE Transactions on Instrumentation and Measurement

Year: 2021 | Volume: 70 | Journal Article |

Study of Strain and Residual Stress Distribution in the Thickness Direction by Layer Removal Method and X-Ray Diffraction

Tran Minh Tien;Nguyen Vinh Phoi;Le Chi Cuong;Luu Anh Tuyen;La Ly Nguyen

2016 3rd International Conference on Green Technology and Sustainable Development (GTSD)

Year: 2016 | Conference Paper |

Cited by: Papers (1)

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Study of Strain and Residual Stress Distribution in the Thickness Direction by Layer Removal Method and X-Ray Diffraction

Tran Minh Tien;Nguyen Vinh Phoi;Le Chi Cuong;Luu Anh Tuyen;La Ly Nguyen

2016 3rd International Conference on Green Technology and Sustainable Development (GTSD)

Year: 2016 | Conference Paper |

Strain Gauge Method for Evaluating a Three-Dimensional Residual Strain State in ${\rm Nb}_{3}{\rm Sn}$ Wires

K. Watanabe;H. Oguro;K. Minegishi;S. Awaji;G. Nishijima

IEEE Transactions on Applied Superconductivity

Year: 2010 | Volume: 20, Issue: 3 | Journal Article |

Cited by: Papers (10)

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Strain Gauge Method for Evaluating a Three-Dimensional Residual Strain State in ${\rm Nb}_{3}{\rm Sn}$ Wires

K. Watanabe;H. Oguro;K. Minegishi;S. Awaji;G. Nishijima

IEEE Transactions on Applied Superconductivity

Year: 2010 | Volume: 20, Issue: 3 | Journal Article |

Simulation and Analysis of Residual Stress and Tool Wear in Mechanical Repeated Ruling Process

Chaochao Shi;Guangfeng Shi;Guoquan Shi

2019 IEEE International Conference on Mechatronics and Automation (ICMA)

Year: 2019 | Conference Paper |

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Simulation and Analysis of Residual Stress and Tool Wear in Mechanical Repeated Ruling Process

Chaochao Shi;Guangfeng Shi;Guoquan Shi

2019 IEEE International Conference on Mechatronics and Automation (ICMA)

Year: 2019 | Conference Paper |

Measurements of the Strain Dependence of Critical Current of Commercial REBCO Tapes at 15 T Between 4.2 and 40 K for High Field Magnets

Federica Pierro;Mario Delgado;Luisa Chiesa;Xiaorong Wang;Soren O. Prestemon

IEEE Transactions on Applied Superconductivity

Year: 2019 | Volume: 29, Issue: 5 | Journal Article |

Cited by: Papers (8)

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Measurements of the Strain Dependence of Critical Current of Commercial REBCO Tapes at 15 T Between 4.2 and 40 K for High Field Magnets

Federica Pierro;Mario Delgado;Luisa Chiesa;Xiaorong Wang;Soren O. Prestemon

IEEE Transactions on Applied Superconductivity

Year: 2019 | Volume: 29, Issue: 5 | Journal Article |

Sandrick Le Maguer

Sandrick Le Maguer

Affiliation

Publication Topics

Biography

Showing 1-25 of 2,108 resultsfor "Index Terms":Residual Strain

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