Abstract:
A passive micro strain gauge based on the strain magnification technique has been designed, demonstrated, and characterized. This strain gauge can be fabricated in situ a...Show MoreMetadata
Abstract:
A passive micro strain gauge based on the strain magnification technique has been designed, demonstrated, and characterized. This strain gauge can be fabricated in situ along with active micro sensors or actuators on the same chip for monitoring residual strain effects. Both tensile or compressive strain could be easily observed under optical microscopes and the resolution of strains as small as 0.001% could be achieved. The residual strain study of RTA (rapid thermal annealing) polysilicon is reported.<>
Published in: [1993] Proceedings IEEE Micro Electro Mechanical Systems
Date of Conference: 10-10 February 1993
Date Added to IEEE Xplore: 06 August 2002
Print ISBN:0-7803-0957-X
Citations are not available for this document.
Cites in Patents (2)Patent Links Provided by 1790 Analytics
1.
Gianchandani, Yogesh B., "MICROMACHINED STRAIN SENSOR"
Inventors:
Gianchandani, Yogesh B.
Abstract:
A micromachined strain sensor can be incorporated in a sealed package with other microelectrical and micromechanical components, with the residual strain being monitored electronically from outside the package to allow strain to be monitored during production and during the life of the component. The strain sensor includes at least one microstructural beam member anchored to a substrate at one position and having a portion which is freed from the substrate during formation to displace as a result of the strain in the beam member. At least one electrically conductive displaceable tine is connected to the beam member to be displaced as it is freed. A mating electrically conductive tine is mounted to the substrate adjacent to the displaceable tine such that a capacitor is formed between the adjacent tines. A plurality of displaceable tines and mating tines may be formed to increase the overall capacitance of the device. The mating tines and displaceable tines are connected to leads extending from the package to allow the change in capacitance caused by displacement of the beam member to be measured from outside the package. The strain sensors may be configured with the beam members connected to the top and bottoms of support beams that carry the displaceable tines, with multiple structures formed adjacent to each other to increase the overall capacitance of the sensor and to increase the displacement of the tines in response to the built-in compressive or tensile strain in the microstructural material of the beam members, and to allow differential capacitive readout.
Assignee:
WISCONSIN ALUMNI RESEARCH FOUNDATION
Filing Date:
15 January 1999
Grant Date:
19 August 2003
Patent Classes:
Current U.S. Class:
073777000
Current International Class:
G01B0071600000, G01L0010000000
2.
GIANCHANDANI, Yogesh, B., "MICROMACHINED STRAIN SENSOR"
Inventors:
GIANCHANDANI, Yogesh, B.
Abstract:
A micromachined strain sensor to be incorporated in a sealed package with other microelectrical and micromechanical components, with the residual strain being monitored electronically from outside the package to allow strain to be monitored during production and during the life of the component. The strain sensor includes at least one microstructural beam member anchored to a substrate at one position and having a portion which is freed from the substrate during formation to displace as a result of the strain in the beam member. At least one electrically conductive displaceable tine is connected to the beam member to be displaced as it is freed. A mating electrically conductive tine is mounted to the substrate adjacent to the displaceable tine such that a capacitor is formed between the adjacent tines.
Assignee:
WISCONSIN ALUMNI RESEARCH FOUNDATION
Filing Date:
03 November 1999
Grant Date:
18 May 2000
Patent Classes:
Current International Class:
G01B0071600000, G01L0050000000
