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Gunn Hwang - IEEE Xplore Author Profile
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Gunn Hwang

Publications
6
Citations
16
Publications by Year
19992009
Co-Authors:
Show All Co-Authors (23)
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Gunn Hwang

Affiliation

Advanced i-MEMS team, Electrical and Telecommunications Research Institute, South Korea

Publication Topics

Biography

Gunn Hwang received the B.S. degree from the Korea University, in 1983, and the M.S. and Ph.D. degrees in mechanical engineering from the Korea Advanced Institute of Science and Technology, Taejon, in 1985 and 1999, respectively.,He is a Leader of the Electronics Packaging Technology Team, Electronics and Telecommunications Research Institute (ETRI), Taejon, where he has been employed for 16 years. His current work centers around packaging of electronics system, especially developing cooling techniques using heat pipe.(Based on document published on 7 August 2002).
Publications
6
Citations
16
Publications by Year
19992009
Co-Authors:
Show All Co-Authors (23)
Author's Published Works

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Chip scale packaging with surface mountable solder ball terminals for microsensors

Ahra Lee;SangChul Lee;Sungsik Lee;Chang Han Je;Sunghae Jung;Myoung-Lae Lee;Gunn Hwang;Byoung-Gon Yu;Chang Auck Choi

2009 4th IEEE International Conference on Nano/Micro Engineered and Molecular Systems
Year: 2009 | Conference Paper |
Cited by: Papers (2)
This paper presents a simple and low-cost flip chip bumping method with vertical feedthroughs for MEMS WLCSP. The vertical feedthroughs are fabricated on glass wafer using sand-blasting, and these provide inherent aligning jig for micro-ball arrangement. The experimental evaluations using MEMS accelerometer are also presented. The proposed method can be a more cost-effective solution by eliminatin...Show More

Chip scale packaging with surface mountable solder ball terminals for microsensors

Ahra Lee;SangChul Lee;Sungsik Lee;Chang Han Je;Sunghae Jung;Myoung-Lae Lee;Gunn Hwang;Byoung-Gon Yu;Chang Auck Choi

Year: 2009 | Conference Paper |

Capacitive micro inclinometer with scalloping-free and footing-free vertical electrodes using crystalline etching of (110) silicon

Sung-Sik Yun;Dae-Hun Jeong;Jae-Yong An;Minho Jun;Jong-Hyun Lee;Chang-Han Je;Myung-Lae Lee;Gunn Hwang;Chang-Auk Choi

SENSORS, 2008 IEEE
Year: 2008 | Conference Paper |
A micromachined capacitive inclinometer has been developed to detect inclination angles for a position sensing application. In order to enhance resolution, a (110) crystalline silicon-on-patterned-insulator (COPI) process has been proposed to remove the morphologic defects such as footing and scalloping which were formed from silicon deep reactive ion etching (DRIE) process. The sidewalls fabricat...Show More

Capacitive micro inclinometer with scalloping-free and footing-free vertical electrodes using crystalline etching of (110) silicon

Sung-Sik Yun;Dae-Hun Jeong;Jae-Yong An;Minho Jun;Jong-Hyun Lee;Chang-Han Je;Myung-Lae Lee;Gunn Hwang;Chang-Auk Choi

Year: 2008 | Conference Paper |

Development of the micro capillary pumped loop for electronic cooling

Seok-Hwan Moon;Gunn Hwang

2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC)
Year: 2007 | Conference Paper |
Cited by: Papers (2)
Electronic devices have been minimized but the performance of those is becoming better and better. Therefore it is needed to develop new cooling methods suitable for a thin packaging structure with high thermal density. The thin flat plate type micro CPL(capillary pumped loop) with the thickness less than 2mm was developed in this study. The proposed micro CPL has two staged grooves in evaporator ...Show More

Development of the micro capillary pumped loop for electronic cooling

Seok-Hwan Moon;Gunn Hwang

Year: 2007 | Conference Paper |

Experimental study on the performance of miniature heat pipes with woven-wire wick

Seok Hwan Moon;Ho Gyeong Yun;Gunn Hwang;Tae Goo Choy

IEEE Transactions on Components and Packaging Technologies
Year: 2001 | Volume: 24, Issue: 4 | Journal Article |
Cited by: Papers (9)
The thermal density of electronic system has been increased continuously because high speed and high density are required for them. The heat dissipation of CPU for a notebook PC has been recently increased to be more than 10 W, but, on the other hand, the available packaging space has been decreased. Therefore, it has become inevitable to perform cooling by using miniature heat pipes (MHPs). In th...Show More

Experimental study on the performance of miniature heat pipes with woven-wire wick

Seok Hwan Moon;Ho Gyeong Yun;Gunn Hwang;Tae Goo Choy

Year: 2001 | Volume: 24, Issue: 4 | Journal Article |

Experimental study on performance of a miniature heat pipe with woven-wired wick

Seok Hwan Moon;Choon Gi Choi;Gunn Hwang;Tae Coo Choy

ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)
Year: 2000 | Conference Paper |
Cited by: Papers (1)
The thermal density of electronic parts and systems has been increased continuously as high speed and high density are required for them. The heat generation of the CPU of a notebook PC of higher than the Pentium-II grade has been recently increased to be more than 10 W, and the available packaging space has been compacted. Therefore, it has become inevitable to perform cooling by using miniature ...Show More

Experimental study on performance of a miniature heat pipe with woven-wired wick

Seok Hwan Moon;Choon Gi Choi;Gunn Hwang;Tae Coo Choy

Year: 2000 | Volume: 2 | Conference Paper |

IP mobility support over wireless ATM

Youngsong Mun;Youngyuk Kim;Yong Jin Kim;Gunn Hwang

1999 IEEE International Conference on Communications (Cat. No. 99CH36311)
Year: 1999 | Conference Paper |
Cited by: Papers (2)
Increasing user demand for more bandwidth over wireless communications has motivated a new challenge to utilize the benefits of wireless ATM technology. This paper focuses on how to provide IP services to a mobile user over wireless ATM networks. It seems to be able to support the mobility by combining the existing schemes developed by the IETF and ATM Forum such as Mobile IP, IP over ATM, Next Ho...Show More

IP mobility support over wireless ATM

Youngsong Mun;Youngyuk Kim;Yong Jin Kim;Gunn Hwang

Year: 1999 | Volume: 1 | Conference Paper |

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