Showing 1-25 of 8,492 resultsfor "Index Terms":optimization module
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Study on Interconnect Test Generation ofMCM based on Particle Swarm Optimization Algorithm
2006 7th International Conference on Electronic Packaging Technology
Year: 2006 | Conference Paper |
With rapid development of very large scale integration (VLSI), multichip module (MCM) and multilayer printed circuit boards (MPCB), interconnect test technology has become a bottleneck in the application of these circuits. This paper presents a novel optimized approach based on particle swarm optimization (PSO) algorithm for MCM interconnect test generation. By combing the characteristics of inter...Show More
The optimization of thermal performance in power electronics modules
Paul Evans;Alberto Castellazzi;C Mark Johnson;Hua Lu;Chris Bailey
2014 15th International Conference on Electronic Packaging Technology
Year: 2014 | Conference Paper |
Cited by: Papers (1)
The development of a framework for the analysis and design optimization of power electronics module is described in this paper. This framework consists of analysis software that is capable of carrying out detailed dynamic as well as steady state electric and thermal analysis on power modules using finite difference numerical method and a black-box optimization solver that is based on the Mesh Adap...Show More
A Comparative Study on Optimization Algorithms in PowerSynth 2
Mehran Sanjabiasasi;Imam Al Razi;H. Alan Mantooth;Yarui Peng
2023 IEEE Design Methodologies Conference (DMC)
Year: 2023 | Conference Paper |
Multi-Chip Power Modules (MCPM) are a critical component in power conversion applications. Power modules and their layout optimization have been considered a crucial step to achieving maximum performance. PowerSynth 2 (PS2) is an electronic design automation (EDA) tool for the generation and optimization of power module layouts. Currently, v2.0 uses NSGA-II and Randomization for layout optimizatio...Show More
Review of power module automatic layout optimization methods in electric vehicle applications
The layout of power modules is a crucial design consideration, especially for silicon carbide devices. For electrical layout, optimizing the parasitic parameters can improving switching loss and dynamic behavior. For thermal layout, reducing the thermal resistance and controlling thermal capacitance can reduce the local hot point. Conventional layout design iterations are based on human knowledge ...Show More
Thermal Chips Layout Method in MCM Based on an Improved Particle Swarm Algorithm
2019 Chinese Control And Decision Conference (CCDC)
Year: 2019 | Conference Paper |
Cited by: Papers (3)
The emergence of Multichip Module(MCM) means that the development of component technology is greatly improved in number, speed and performance. Research on thermal layout optimization methods for MCM can promote its reliability, this paper established a numerical relationship model between junction temperature and coordinates of each chip. and uses ANSYS to simulate and analyze the temperature pro...Show More
Study on MCM interconnect test generation using ant algorithm and particle swarm optimization algorithm
2008 International Conference on Electronic Packaging Technology & High Density Packaging
Year: 2008 | Conference Paper |
A new approach based on ant algorithm (AA) and particle swarm optimization (PSO) algorithm is proposed for Multi-chip Module (MCM) interconnect test generation in this paper. Using the pheromone-updating rule and state transition rule, AA generates the initial candidate test vectors. PSO is employed to evolve the candidates generated by AA. The optimized search is guided by the swarm intelligent g...Show More
Concerning layout synthesis for power electronic multi-chip modules
Naveed Hingora;Xiangyu Liu;Brice McPherson;Yongfeng Feng;H. Alan Mantooth
2010 IEEE 12th Workshop on Control and Modeling for Power Electronics (COMPEL)
Year: 2010 | Conference Paper |
Cited by: Papers (6)
Multi-chip power module design requires simultaneous analysis of thermal, electrical, and mechanical parameters to design an optimal layout. The current design process being used by package designers involves a sequential procedure that is time-consuming and requires multiple design runs. The existing Power-CAD methodology that automates the module design process and optimizes the layout has been ...Show More
PSO and WOA Algorithm Based Optimal Control for Photovoltaic Solar System
2023 3rd International Conference on Emerging Frontiers in Electrical and Electronic Technologies (ICEFEET)
Year: 2023 | Conference Paper |
Cited by: Papers (1)
This paper proposes an improved photovoltaic solar system controller and the MPPT (maximum power point tracking from the photovoltaic (PV) module. It is retrieved using the P&O (perturb and observe) technique since the solar power production varies on the ambient factors, such as irradiance and atmospheric temperature. Particle Swarm optimization (PSO), Whale optimization algorithm (WOA) and stand...Show More
Algorithmic Optimization and Synthesis Strategies for High-Performance Computing Integrated Circuit Design
M Mudhu Krishnan;T. Muthamizhan;Mohammad Aijaz;Guna. G;Anusharani V
2024 Second International Conference Computational and Characterization Techniques in Engineering & Sciences (IC3TES)
Year: 2024 | Conference Paper |
The objective of this research is to develop new algorithmic optimization and synthesis techniques in the IC design topography to enhance performance of High Performance Computing Platform. The Design employs GA and PSO algorithms for optimization to obtain enhanced desirable attributes like speed, power and area. The research demonstrates notable results: The proposed architectural enhancements p...Show More
Search-based software module clustering techniques: A review article
2017 IEEE 4th International Conference on Knowledge-Based Engineering and Innovation (KBEI)
Year: 2017 | Conference Paper |
Cited by: Papers (3)
A software module clustering is a technique of organizing software entities into clusters to enhance the quality of a software system. It provides easier navigation and easier tracking among software parts and enhances comprehension. Therefore, a good distribution of the module facilitates the development and maintenance of a software system. The software module clustering problem is often solved ...Show More
The Module Design of Intelligent Allocating Storage Space in Container Freight Station
2009 First International Workshop on Database Technology and Applications
Year: 2009 | Conference Paper |
Cited by: Papers (2)
Intelligent Management Information System is an important approach to improve the work efficiency and degree of satisfaction of the container freight station. And the module of intelligent allocating storage space is the core of the Intelligent Management Information System. The paper has described the importance and process of the module designing for intelligent allocating storage space in conta...Show More
FSO based MPPT Algorithm for Maximizing Power Output in PV System under Partial Shading Conditions
2023 5th International Conference on Smart Systems and Inventive Technology (ICSSIT)
Year: 2023 | Conference Paper |
The Power-Voltage characteristics of photovoltaic (PV) systems have multiple peak points under partial shading conditions (PSC). Consequently, to get the most power possible, it is essential to find the global maximum peak point (GMPP). The regular maximum power point tracking (MPPT) algorithms get captured by the local maximum peak point (LMPP) under PSCs. This article introduces an MPPT techniqu...Show More
MCM Interconnect Test Scheme Based on Ant Colony Algorithm and Particle Swarm Optimization Algorithm
2009 Third International Conference on Genetic and Evolutionary Computing
Year: 2009 | Conference Paper |
Cited by: Patents (1)
A novel scheme based on ant colony algorithm (ACA) and particle swarm optimization (PSO) algorithm is proposed for Multi-chip Module (MCM) interconnect test generation in this paper. By combing the characteristics of MCM interconnect test, the velocity updating equation and position updating equation of PSO is designed for automatic test generation. PSO generates the initial candidate test vectors...Show More
PowerSynth Design Automation Flow for Hierarchical and Heterogeneous 2.5-D Multichip Power Modules
Imam Al Razi;Quang Le;Tristan M. Evans;Shilpi Mukherjee;H. Alan Mantooth;Yarui Peng
As a critical energy-conversion system component, power semiconductor modules and their layout optimization has been identified as a crucial step in achieving the maximum performance and density for wide bandgap technologies (i.e., GaN and SiC). New packaging technologies are also introduced to produce reliable and efficient multichip power module (MCPM) designs to push the current limits. The com...Show More
PowerSynth 2: Physical Design Automation for High-Density 3-D Multichip Power Modules
Imam Al Razi;Quang Le;Tristan M. Evans;H. Alan Mantooth;Yarui Peng
Moving toward an electrified world requires ultrahigh-density power converters. With the adoption of wide-bandgap semiconductors (e.g., SiC and GaN), the next-generation power converters are on the horizon. However, the complexity of compact and high-speed converters is beyond the current industry-standard design flow based on manual and iterative steps. Therefore, research on design automation an...Show More
Identification of function modules in protein-protein interaction networks by modularity optimization method
2015 International Conference on Machine Learning and Cybernetics (ICMLC)
Year: 2015 | Conference Paper |
Cited by: Papers (2)
It is of great significance to understand the organization and function of the biological system by identifying function modules in protein-protein interaction (PPI) networks. One of important features of PPI networks is large-scale. In this paper, we propose the modules detection method for PPI networks based on modularity optimization. The biolbiologicalogical explanations of the función modules...Show More
Optimization Design of Silicon Carbide Power Module Based on Neural Network
2022 9th International Forum on Electrical Engineering and Automation (IFEEA)
Year: 2022 | Conference Paper |
Cited by: Papers (1)
Compared with Silicon materials, Silicon Carbide (SiC) devices are widely used due to their advantages of higher voltage resistance, higher temperature resistance, faster switching speed and bottom loss. Due to the low current carrying capacity of a single SiC chip, it is often necessary to apply multiple chips in parallel to improve the power level of the module. For the multi-chip parallel modul...Show More
ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design
Hyunsu Chae;Keren Zhu;Bhyrav Mutnury;Douglas E. Wallace;Douglas S. Winterberg;Daniel de Araujo;Jay Reddy;Adam Klivans;David Z. Pan
The future of computing requires heterogeneous integration, including the recent adoption of chiplet methodology, where high-speed cross-chip interconnects and packaging are critical for the overall system performance. As an example of advanced packaging, a high-density interconnect (HDI) printed circuit board (PCB) has been widely used in complex electronics ranging from cell phones to computing ...Show More
Grey Wolf Optimization Based MPPT Algorithm for Solar PV System with SEPIC Converter
2019 4th International Conference on Power Electronics and their Applications (ICPEA)
Year: 2019 | Conference Paper |
Cited by: Papers (12)
In this study, the Grey Wolf Optimization (GWO) based maximum power point tracking (MPPT) algorithm with a single-ended primary-inductor converter (SEPIC) converter is proposed for solar photovoltaic (PV) systems. SEPIC converter which has voltage step-up and step-down capability removes the non-operational zones related about the input voltage. The PV module current and voltage are used as inputs...Show More
Performance Optimization of Aluminum Fin Heat Sinks for Cooling Power Modules in Railway Transportation Control Equipment
2023 IEEE 8th International Conference on Intelligent Transportation Engineering (ICITE)
Year: 2023 | Conference Paper |
The purpose of this work is to discuss the problem of the low heat dissipation efficiency of the control equipment in rail transit trains. The research aim was to develop a power module for the train control apparatus that makes use of aluminum fin heat sinks. The design of the heat sink was altered to increase the efficiency of heat dissipation by creating a thermal simulation model, and the succ...Show More
Simulation and optimization of interconnect delay and crosstalk in multi-chip modules
Proceedings 1992 IEEE Multi-Chip Module Conference MCMC-92
Year: 1992 | Conference Paper |
Cited by: Papers (6)
As signal speeds increase, interconnect effects such as delay, distortion and crosstalk become the dominant factor limiting the overall performance of a multichip module. The authors outline efficient techniques recently developed for addressing three specific aspects of the high-speed interconnect problem, namely, simulation, sensitivity analysis and performance optimization. These techniques acc...Show More
Design of Software for Real-Time Optimizing of the Multi-Module High-Temperature Gas-Cooled Reactor Nuclear Power Plant
2023 China Automation Congress (CAC)
Year: 2023 | Conference Paper |
The modular high-temperature gas-cooled reactor is a promising technology in fourth-generation nuclear energy systems. It adopts the structure of multiple nuclear steam supply system modules driving a common steam turbine generator. Due to its complex structure and stringent safety requirements, its operation needs to be optimized in real time. In this paper, we design a set of software, which inc...Show More
Multi-objective Parametric Approach to Numerical Optimization of Stacked Packages
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007
Year: 2007 | Conference Paper |
Cited by: Papers (2)
The main aim for development of small electronic packages is supported by an ongoing development of portable communications devices. Thin silicon dies are believed to improve as device performance as its reliability. Additionally, novel packaging techniques as stacked packaging reduce packaging cost, size, improve functionality and reliability. In case of the stacked packages, wafers are stacked t...Show More
Optimal Design of Pin-Fin Heatsinks for SiC Power Modules Based on Analytical Thermal Modeling and TLBO Algorithm
Linke Zhou;Mohamed Hefny;Yuhang Yang;Di Wang;Samantha Jones-Jackson;Giorgio Pietrini;Ali Emadi
2023 IEEE Transportation Electrification Conference & Expo (ITEC)
Year: 2023 | Conference Paper |
Cited by: Papers (2)
Thermal management has always been one of the leading technical challenges in high-power power modules. Especially in the current trend of seeking high power density of devices, optimized thermal design is crucial. This paper presents an optimal design method for pin-fin heatsinks for SiC power modules, based on analytical thermal models and Teaching Learning Based Optimization (TLBO) algorithm. F...Show More
Multicluster-based particle swarm optimization algorithm for photovoltaic maximum power point tracking
2015 IEEE 2nd International Future Energy Electronics Conference (IFEEC)
Year: 2015 | Conference Paper |
Cited by: Papers (2)
In this paper, a multi-cluster-based particle swarm optimization (MC-PSO) algorithm for photovoltaic (PV) maximum power point tracking (MPPT) is proposed to promote the MPPT performance in the partial shading condition. During the tracking process, each PV module is viewed as a particle and the PV modules with similar characteristics are put into the same cluster. The particles in the same cluster...Show More
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