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Optimum intrinsic device switching time for a 7.5-nm gate-length Si n-channel double-gate field-effect transistor (DGFET) in the limit of pure ballistic transport occurs when channel quantization/transport directions are aligned to the / crystallographic directions, respectively. The computed switching time of 0.123 ps is 5% less than the value obtained with the more "conventional" a...Show More
Circuit with double gates using independently controlled gates have been proposed to reduce the number of gates and to increase the logic densities per area. This paper introduces a vertical slit FET (double gate transistor) which has been demonstrated with the help of figures with unique independent double gate properties to demonstrate the possible advantages for independent double gate circuits...Show More
Circuits with transistors using independently controlled gates have been designed to reduce the number of transistors and to increase the logic density per area. This paper proposed a full adder and substractor circuit with novel Vertical Slit Field Effect Transistor and unique independent double gate properties to demonstrate the possible advantages for independent double gate circuits. With the ...Show More
In this paper we investigate the possibility of power reduction in DGFET devices by means of Vth control technique applied for domino logics. Previously the effectiveness of Vth control method by means of back gate biasing has been investigated. In this paper we show that by special using back gate to control the threshold voltage we can save not only significant standby power but even considerabl...Show More
A planar lateral Vacuum Field Emission Triode (VFET) with a double gate structure is proposed to improve the gate modulation characteristics in this letter. The preparation of this double gate structure is obtained by using the mature bottom gate VFET manufacturing process without any additional dedicated masks. The emission characteristics of the fabricated VFET under vacuum and atmosphere condit...Show More
A universal compact potential model for all types of double-gate MOSFETs is presented. An analytical closed-form solution to a 2D Poisson's equation is obtained with the approximation that a vertical channel potential distribution is a cubic function of position. As a result, an analytical equation for the threshold voltage is derived from the proposed potential model. Different gate work function...Show More
The rapid increase in interest on Negative capacitance Field Effect Transistors(NCFETs) is due to its Low power applications. NCFETs stepsup the voltage between the oxide and ferroelectric capacitance due to reversing (i.e, amplification) effect of a ferroelectric (fe) layer[1]. These are designed in a way such that its Subthreshold swing overcomes the boltzmann limit. According to the Boltzmann t...Show More
NCFETs(Negative Capacitance Field Effect Transistors) are commonly known for their Low Power Consumption[4]. As the name itself suggests that it uses a Negative Capacitance For the Voltage Amplification. This Amplification is due to the polarisation in the ferroelectric material, which is used as Negative Capacitance[5]. Due to the Orderly Alignment of the Dipoles in Ferroelectric material when an...Show More
This paper presents an in depth study and analysis which shows that the Double gate MOSFET has emerged as one of the most favorable devices due to short channel effect immunity, off-current reduction ability and more scaling possibility. The devices with less than 0.1 μm gate length can maintain near ideal subthreshold factor. This paper also presents some new modifications in the existing devices...Show More
With the objective to achieve high drain current at lesser dimension in CMOS technology, device dimension reaches to Sub Nm region and undesirable effect such as short channel effect, high leakage current, DIBL are get introduced. And the desired characteristics become disturbed. As a solution to these problems, we have proposed a structure of Double material Double Gate strained n- MOSFET in this...Show More
In this letter, a sub-10-nm n-type GaSb-InAs heterojuction tunnel field-effect transistor (Het-j TFET), having n+-doped underlap layer of InAs between source and channel is proposed, which exhibits low subthreshold swing (SS) over a large range of currents. The proposed device is compared with conventional p-i-n GaSb-InAs Het-j TFET having the same physical gate length of 9 nm. Using ballistic tig...Show More
This paper examines the potential of double gate (DG) inter-band tunnel FETs (TFET) in 3 different material systems, Si, Ge and InAs, for logic circuit applications down to 0.25 V supply voltage (VCC). Based on two-dimensional numerical drift-diffusion simulations, we show that 30 nm gate length (LG) InAs (indium arsenide) based TFETs can achieve Ion/Ioff of >4x10<...Show More
This work reports on the physical definition and extraction of threshold voltage in tunnel FETs based on numerical simulation data. It is shown that the tunnel FET has the outstanding property of having two threshold voltages: one in terms of gate voltage, VTG, and one in terms of drain voltage, VTD. These threshold voltages can be physically defined based on the saturation of the barrier width na...Show More
Based on the complex bandstructure obtained by local empirical pseudopotential method (LEPM), we have developed a Band to Band Tunneling model (BTBT), which captures band structure information, all possible transitions between different valleys, energy quantization and quantized density of states. Theoretical model is verified by experimental study on tunnel diodes on various semiconductors. BTBT ...Show More
A stacked three-dimensional six transistor SRAM cell using a novel vertical slit field effect transistor with two independently controlled gates is proposed. A compact stacked 3D memory cell topology with a highly regular layout is presented and a significant memory cell area reduction can be achieved. Utilization of independent double gate transistors enhances the robustness for read and write op...Show More
Tunneling field effect transistors (FET), consisting of gate tunable p-i-n (p-type-intrinsic-n-type) device structures, represent an attractive and realistic paradigm that can potentially provide relief to the increasing power dissipation in high performance electronic applications. Such devices possess a subthreshold slope (SS) smaller than the thermally limited 60 mV/decade, but also can suffer ...Show More
We have developed new band to band tunneling (BTBT) model, which captures band structure information, all possible transitions between different valleys, energy quantization and quantized density of states (DOS). Minimum standby off-state currents (IOFF,MIN) are investigated in double gate (DG) MOSFETs with various high mobility materials, like GaAs, InAs, Ge and strained Si/Ge (s-Si/s-Ge) using t...Show More
This paper reports on the fabrication, experimental characterization and data transmission application of a double-gate movable body FET. As its name suggests, the proposed movable-body Micro-Electro-Mechanical FET (MB-MEMFET) is a hybrid MEMS-semiconductor device that, in contrast with previously reported Suspended-Gate MOSFET, has a movable body separated by nano-size air gaps from two lateral f...Show More
Silicon Nanowire (Si NW) FETs with semi gate-around structures suitable for integration were fabricated using conventional planar CMOS processes. With the use of SiO2 pedestal and SiN sidewalls, lithography and etching steps over NW can be easily processed. A large on-current of 49.6 muA at Vg- Vth=1.0 V has been obtained. This value is one of the highest current per nanowire, even though the gate...Show More
We present a novel Depletion-Mode Double-Gate (DMDG) FET. As opposed to the conventional, un-doped body, double-gate MOSFETs, the DMDG device confines the carriers to the center of the device for all applied gate voltages. The device exhibits high mobility due to the carrier confinement in the very low E-field region in the center of the device. Simulations show very high I/sub on//I/sub off/ rati...Show More
Planar double-gate field effect transistors with asymmetric (p++/n++) independent gates down to 55nm physical gate lengths are successfully fabricated. A fabrication concept, epi-before-bonding, is introduced and demonstrated to be highly successful in achieving ultra-thin and planar Si bodies. Various modes of operations are extensively analyzed and compared to 2D simulations. It is experimentall...Show More
Extremely high potential barrier height and gate turn-on voltage of a novel GaAs field-effect transistor with n/sup +//p/sup +//n/sup +//p/sup +//n double camel-like gate structure are demonstrated. The maximum electric field and potential barrier height of the double camel-like gate are substantially enhanced by the addition of another n/sup +//p/sup +/ layers in gate region, as compared with the...Show More
We have examined the potential of double gate (DG) inter-band tunnel FETs (TFET) in 3 different material systems, Si, Ge and InAs, for logic circuit applications down to 0.25 V supply voltage (VCC). Based on the two-dimensional numerical drift-diffusion simulations, we conclude that 30 nm gate length InAs (indium arsenide) based TFETs can achieve Ion/Ioff of > 4x104 with < 1 ps intrinsic delay at ...Show More
A new type of field effect transistor (FET), the double doping polysilicon gate (DDPG) Lightly-doped-drain (LDD) MOSFET, is proposed and demonstrated. The gate of the DDPG LDD MOSFET adopts gate engineering. This novel gate structure takes advantage of material work function. The arrangement is such that the gate near the source is comprised of P-type polysilicon and the gate near the drain is N-t...Show More
We report a global power minimization methodology for future transistors and use it as a comparison standard to quantify the relative and absolute impact of material and structural innovations on power and speed. In addition, we put the relative tradeoffs of device design in perspective of global metrics. In the process, we also develop and verify two key enabling models: (1) to calculate inverter...Show More