Janusz Grzyb received the M.Sc. (cum laude) degree in electronic engineering (with a major in the synthesis and design of analog CMOS and BiCMOS circuits with an individual study program) from the integrated Circuits Laboratory, Gdansk University of Technology, Gdansk, Poland, in 1998, and the Ph.D. degree from the Swiss Federal Institute of Technology, Zurich, Switzerland, in 2004.
In 1999, he joined the Electronics Labs, Swiss Federal Institute of Technology, where he performed pioneering work in the area of low-cost large-area panel processing multichip-module-based system-in-package solutions for 60-GHz, 77-GHz, and 94-GHz applications. He was a Research Assistant with the Gdansk University of Technology from 1998 to 1999. From 2004 to 2006, he was with the Communication System Design and High-Speed/Optical Packaging Groups, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA, where he was involved in the development of the low-cost packaged highly integrated SiGe transceiver for 60-GHz Gb/s wireless data communication. From 2006 to 2009, he was with the Research and Development Group, Huber&Suhner, Pfaffikon ZH, Switzerland, where he brought onto the market the world's first commercially available point-to-point 60-GHz links: the Sensity Link System. Since 2009, he has been with the Institute for High-Frequency and Communication Technology (IHCT), University of Wuppertal, Germany. His current research interests include all aspects of silicon-integrated THz electronics.
Dr. Grzyb was a co-recipient of the 2006 Lewis Winner Award for Outstanding Paper of the IEEE International Solid-State Circuit Conference, the 2006 IBM Pat Goldberg Memorial Best Paper Award, the 2012 and 2018 Jan Van Vessem Award for Outstanding European Paper of the IEEE International Solid-State Circuits Conference, the 2014 Best Paper Award of the European Conference on Antennas and Propagation, and the Microwave Prize 2017 of the IEEE Microwave Theory and Techniques Society.
Janusz Grzyb received the M.Sc. (cum laude) degree in electronic engineering (with a major in the synthesis and design of analog CMOS and BiCMOS circuits with an individual study program) from the integrated Circuits Laboratory, Gdansk University of Technology, Gdansk, Poland, in 1998, and the Ph.D. degree from the Swiss Federal Institute of Technology, Zurich, Switzerland, in 2004.
In 1999, he joined the Electronics Labs, Swiss Federal Institute of Technology, where he performed pioneering work in the area of low-cost large-area panel processing multichip-module-based system-in-package solutions for 60-GHz, 77-GHz, and 94-GHz applications. He was a Research Assistant with the Gdansk University of Technology from 1998 to 1999. From 2004 to 2006, he was with the Communication System Design and High-Speed/Optical Packaging Groups, IBM T. J. Watson Research Center, Yorktown Heights, NY, USA, where he was involved in the development of the low-cost packaged highly integrated SiGe transceiver for 60-GHz Gb/s wireless data communication. From 2006 to 2009, he was with the Research and Development Group, Huber&Suhner, Pfaffikon ZH, Switzerland, where he brought onto the market the world's first commercially available point-to-point 60-GHz links: the Sensity Link System. Since 2009, he has been with the Institute for High-Frequency and Communication Technology (IHCT), University of Wuppertal, Germany. His current research interests include all aspects of silicon-integrated THz electronics.
Dr. Grzyb was a co-recipient of the 2006 Lewis Winner Award for Outstanding Paper of the IEEE International Solid-State Circuit Conference, the 2006 IBM Pat Goldberg Memorial Best Paper Award, the 2012 and 2018 Jan Van Vessem Award for Outstanding European Paper of the IEEE International Solid-State Circuits Conference, the 2014 Best Paper Award of the European Conference on Antennas and Propagation, and the Microwave Prize 2017 of the IEEE Microwave Theory and Techniques Society.View more 
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