I. Introduction
The applications of high-speed integrated circuit (IC) are increasing rapidly nowadays. In this context, the electromagnetic interference (EMI) becomes an important issue to evaluate the performance of the IC. Near field scanning [1]–[5] is a popular and effective technique to detect the near field and evaluate the electromagnetic (EM) emission of an IC. A common method to map the near field of the surface of IC is standardized in [6], in which a probe is installed on a movable platform and detects the electromagnetic field along the surface spot by spot. A 2-D magnetic field distribution is usually extracted for further evaluation and diagnosis of EMI. For example, by detecting the magnetic field along a clock generator IC, the common-mode EMI current can be localized from one particular power to another particular ground pin, even though the IC contains many pairs of power and ground pins [7]. With a miniature magnetic field probe the cryptographic circuit can be targeted [8] in a cryptographic large-scale IC. Especially, magnetic field probe is applied [9] recently to evaluate the electromagnetic field shielding effectiveness of the metallic shielding materials in system-in-package device.