I. Introduction
Recently, the near-field radio-frequency (RF) probes have become a hot topic due to the outstanding features of identifying unwanted RF electromagnetic interference (EMI) [1], [2], [3], [4], [5], [6]. Various manufactured techniques are proposed to design near-field RF probes with high performance, such as low-temperature co-fired ceramic technology [7], [8], printed circuit board (PCB) technology [9], [10], [11], [12], and the thin-film technique [13]. Compared with these manufactured techniques, the PCB technology is the most commonly used and the lowest cost to design the various near-field probes.