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Sub-Micron Mems Accelerometer with Handle-Layer Patterning for Damping Enhancement Using Time Transduction | IEEE Conference Publication | IEEE Xplore

Sub-Micron Mems Accelerometer with Handle-Layer Patterning for Damping Enhancement Using Time Transduction


Abstract:

A very high-resolution SOI (silicon-on-insulator) MEMS (Micro-Electro-Mechanical Systems) accelerometer for geodetic space grade applications using pull-in time measureme...Show More

Abstract:

A very high-resolution SOI (silicon-on-insulator) MEMS (Micro-Electro-Mechanical Systems) accelerometer for geodetic space grade applications using pull-in time measurements is presented here. Parallelplates implemented in the handle-layer are used to provide the necessary squeeze-film damping, while increasing the effective-mass. Large mass (126 mg) devices with low-Q (quality factor of 0.53) have been fabricated and tested using time transduction. The high measured sensitivity of 1.9 ns/ng enables the use of the device in ultra-high resolution and low-dynamic range applications.
Date of Conference: 23-27 June 2019
Date Added to IEEE Xplore: 22 August 2019
ISBN Information:

ISSN Information:

Conference Location: Berlin, Germany

INTRODUCTION

In the aerospace industry, CubeSat satellites aim to be small and miniaturized, low-power, inexpensive versions of flagship satellite missions like GRACE (Gravity Recovery and Climate Experiment [1]). GRACE missions have been instrumental in understanding the extent and consequences of the ongoing climatic changes. Nevertheless, to enable this type of missions using CubeSats, geodetic grade accelerometers with a small size, reduced power consumption and low fabrication costs are required.

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References

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