An In-Depth Analysis of Power-System-in-Inductor (PSI2) Technology for Power Module Packaging

This paper provides a thorough analysis of the power-system-in-inductor (PSI²) packaging for power modules through FEA simulation and experimentation of electrical and thermal performance. To sufficiently analyze the PSI² packaging, all tests conducted compare performance of PSI² to conventional plastic epoxy packaging using identical buck power modules. PSI² uses magnetic material as both the power module packaging and magnetic inductor core to increase inductor winding size and thermal conductivity of the package. In experimental testing the PSI² package achieves 2.82% greater efficiency, 0.48W less loss, 23.9°C lower top temperature, and 3.5°C lower bottom temperature at full load compared to the plastic package. Constant loss experimentation reveals approximately one third of the surface temperature difference is the result of the PSI² improved thermal conductivity at full load.