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This paper presents a high power density LLC converter for Electric Vehicles (EVs) on-board low voltage DC-DC converter. The design specification imposes critical challenges on size and efficiency due to extremely high load current rating and wide input/output voltage range. The proposed design enables high switching frequency by using wide-band-gap (WBG) devices to significantly reduce the size o...Show More
A single stage 1.65kW AC-DC LLC converter with Power Factor Correction (PFC) for OBC application is proposed. A boost inductor is not required since the LLC converter serves as both the AC-DC and DC-DC stage which provides all the functions of rectification, PFC, output voltage regulation and galvanic isolation. A design methodology is proposed in this paper to maintain the output voltage regulati...Show More
It is desirable to connect several LLC converters in parallel in high-power and/or high-current applications. However, component tolerance among resonant tank of different phases causes severe unbalanced load sharing, leading to performance degrading. In this paper, full-wave Switch-Controlled Capacitor (SCC) is added into resonant tank to compensate component tolerance and to achieve load sharing...Show More
This paper presents a high efficiency high power-density LLC DC-DC converter for Electric Vehicles (EVs) on-board low voltage DC-DC converter (LDC) application. In the proposed LDC, primary switches achieve ZVS turn-on and secondary synchronous rectifier switches achieve ZVS turn-on and ZCS turn-off. To reduce current stress and improve efficiency, three phase interleaved LLC DC-DC converters are ...Show More
In low output voltage high load current LLC dc-dc converters, synchronous rectifiers are usually used to reduce the secondary loss. The proper conduction time of synchronous rectifiers (SRs) is key to improve efficiency and make the converter run more reliably and stably. In high load current LLC dc-dc converters, voltage ringing across SRs makes SRs turn-on early when the current flowing through ...Show More
This paper presents a new thermomechanical PCB design that uses a multi-PCB cooling (MPDC) structure to achieve higher power density while maintaining thermal performance. The new MPDC structure focusses on three design principles: multiple vertically stacked PCB's for more efficient use of space, component sorting based on losses for improved cooling, and integrated liquid cooling for maximum the...Show More
This paper proposes a new Integrated Multi-Layer Cooling (IMLC) thermomechanical structure for high power density applications. The IMLC structure includes three design objectives to maximize thermal performance while optimizing power density. First, multiple PCBs are stacked vertically to increase PCB surface area. Second, cold plate liquid cooling is integrated onto the bottom most PCB to increa...Show More
This paper presents a thermal analysis of the power-system-in-inductor (PSI2) packaging for power modules. PSI2 uses magnetic material as both the power module packaging and magnetic inductor core to increase inductor winding size and thermal conductivity of the package. Two identical buck power modules are designed using the new PSI2 package and traditional plastic packaging. A thermal equivalent...Show More
This paper provides a thorough analysis of the power-system-in-inductor (PSI2) packaging for power modules through FEA simulation and experimentation of electrical and thermal performance. To sufficiently analyze the PSI2 packaging, all tests conducted compare performance of PSI2 to conventional plastic epoxy packaging using identical buck power modules. PSI2 uses magnetic material as both the pow...Show More