I. Introduction
One method to achieve ESD robust electronic system design is to prevent sparking into the system. This can be achieved by a sufficiently insulating barrier. While even 0.3-mm plastic is usually not penetrated by ESD up to 25 kV difficulties are introduced by seams between plastic parts and openings that expose the inner circuits. The design choice can influence the tightness of adjacent plastic parts, the plastic materials, the wall thickness, and the distance to the electronics. Further the designer can shape the seams of adjacent plastic parts such that detours lengthen the spark path, or introduce fold-back structures that force the spark to develop against the electrostatic field direction. This article analyzes the effect of such design choices and provides an improved simulation model for the spark resistance which also includes situations in which the spark develops parallel to plastic surfaces.