High-speed (>100 Gbit/s) EADFB laser module using flip-chip interconnection technique

High-speed optical transmitters with a flip-chip interconnection were developed. The flip-chip interconnection technique can provide a high modulation bandwidth and low electrical crosstalk. We achieved 8 × 50-Gbit/s simultaneous operation with an EADFB laser array module and 100-Gbit/s operation with an EADFB laser module.

Introduction

Data center traffic has been increasing explosively because of the growth of cloud services. To cope with this trend, the Ethernet data rate has been increasing rapidly. In 2010, 100-gigabit Ethernet (100GbE) was standardized [1]. For long reach applications (such as 10- and 40-km single-mode-fiber (SMF) transmission), a multi-lane interface is employed with a data rate of 25.8 Gbit/s. Optical transmitters have been reported that meet this specification [2]–[5].