Hiroaki Sanjoh - IEEE Xplore Author Profile
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Hiroaki Sanjoh

Also published under: H. Sanjoh

Publications
56
Citations
754
Publications by Year
19952017
Co-Authors:
Show All Co-Authors (69)
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Hiroaki Sanjoh

Also published under: H. Sanjoh

Affiliation

NTT Device Innovation Center
NTT Corporation
Atsugi, Kanagawa, Japan

Publication Topics

Biography

Authors' biographies not available at the time of publication.(Based on document published on 1 December 2016).
Publications
56
Citations
754
Publications by Year
19952017
Co-Authors:
Show All Co-Authors (69)
Author's Published Works

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214-Gb/s 4-PAM Operation of Flip-Chip Interconnection EADFB Laser Module

Shigeru Kanazawa;Hiroshi Yamazaki;Yasuhiko Nakanishi;Yuta Ueda;Wataru Kobayashi;Yoshifumi Muramoto;Hiroyuki Ishii;Hiroaki Sanjoh

Journal of Lightwave Technology
Year: 2017 | Volume: 35, Issue: 3 | Journal Article |
Cited by: Papers (60)
We fabricated a Hi-FIT LE-EADFB laser module. Hi-FIT, which is a wire-free interconnection technique, provides a higher modulation bandwidth and a flatter frequency response than a conventional wire interconnection technique. The fabricated module has a 3-dB bandwidth of about 59 GHz and a sufficiently flat frequency response of less than 45 GHz. Using this module, we demonstrated a single-wavelen...Show More

214-Gb/s 4-PAM Operation of Flip-Chip Interconnection EADFB Laser Module

Shigeru Kanazawa;Hiroshi Yamazaki;Yasuhiko Nakanishi;Yuta Ueda;Wataru Kobayashi;Yoshifumi Muramoto;Hiroyuki Ishii;Hiroaki Sanjoh

Year: 2017 | Volume: 35, Issue: 3 | Journal Article |

Equalizer-Free Transmission of 100-Gb/s 4-PAM Signal Generated by Flip-Chip Interconnection EADFB Laser Module

Shigeru Kanazawa;Yasuhiko Nakanishi;Satoshi Tsunashima;Hiroshi Yamazaki;Yuta Ueda;Wataru Kobayashi;Yoshifumi Muramoto;Hiroyuki Ishii;Hiroaki Sanjoh

Journal of Lightwave Technology
Year: 2017 | Volume: 35, Issue: 4 | Journal Article |
Cited by: Papers (12)
We fabricated a flip-chip interconnection lumped-electrode EADFB laser module and an optical receiver that includes a broadband electrical amplifier. Both have a 3-dB bandwidth of more than 50 GHz. Under 53.2-Gbaud 4-PAM (107 Gb/s) operation, clear eye openings were obtained without an equalizer even after a 2-km SMF transmission, and we obtained a BER of less than 2 × 10-4 under error-free condit...Show More

Equalizer-Free Transmission of 100-Gb/s 4-PAM Signal Generated by Flip-Chip Interconnection EADFB Laser Module

Shigeru Kanazawa;Yasuhiko Nakanishi;Satoshi Tsunashima;Hiroshi Yamazaki;Yuta Ueda;Wataru Kobayashi;Yoshifumi Muramoto;Hiroyuki Ishii;Hiroaki Sanjoh

Year: 2017 | Volume: 35, Issue: 4 | Journal Article |

High-speed (>100 Gbit/s) EADFB laser module using flip-chip interconnection technique

Shigeru Kanazawa;Yuta Ueda;Wataru Kobayashi;Hiroyuki Ishii;Hiroaki Sanjoh

2016 IEEE Photonics Conference (IPC)
Year: 2016 | Conference Paper |
Cited by: Papers (1)
High-speed optical transmitters with a flip-chip interconnection were developed. The flip-chip interconnection technique can provide a high modulation bandwidth and low electrical crosstalk. We achieved 8 × 50-Gbit/s simultaneous operation with an EADFB laser array module and 100-Gbit/s operation with an EADFB laser module.Show More

High-speed (>100 Gbit/s) EADFB laser module using flip-chip interconnection technique

Shigeru Kanazawa;Yuta Ueda;Wataru Kobayashi;Hiroyuki Ishii;Hiroaki Sanjoh

Year: 2016 | Conference Paper |

Flip-chip interconnection EA-DFB laser module for 100-Gbit/s/λ application

Shigeru Kanazawa;Satoshi Tsunashima;Yasuhiko Nakanishi;Yoshifumi Muramoto;Yuta Ueda;Hiromasa Tanobe;Hiroaki Sanjoh;Hiroshi Yamazaki;Wataru Kobayashi;Hiroyuki Ishii

2016 IEEE CPMT Symposium Japan (ICSJ)
Year: 2016 | Conference Paper |
Cited by: Papers (1)
We have developed a flip-chip interconnection technique to solve the problem of the degradation of the modulation bandwidth of an optical transmitter due to the parasitic inductance of bonding wire. And we have fabricated an LE-EA-DFB laser module that has a 3-dB bandwidth of 59 GHz thanks to our flip-chip interconnection technique. The fabricated optical receiver, which includes a wideband electr...Show More

Flip-chip interconnection EA-DFB laser module for 100-Gbit/s/λ application

Shigeru Kanazawa;Satoshi Tsunashima;Yasuhiko Nakanishi;Yoshifumi Muramoto;Yuta Ueda;Hiromasa Tanobe;Hiroaki Sanjoh;Hiroshi Yamazaki;Wataru Kobayashi;Hiroyuki Ishii

Year: 2016 | Conference Paper |

30-km Error-Free Transmission of Directly Modulated DFB Laser Array Transmitter Optical Sub-Assembly for 100-Gb Application

Shigeru Kanazawa;Wataru Kobayashi;Yuta Ueda;Takeshi Fujisawa;Kiyoto Takahata;Tetsuichiro Ohno;Toshihide Yoshimatsu;Hiroyuki Ishii;Hiroaki Sanjoh

Journal of Lightwave Technology
Year: 2016 | Volume: 34, Issue: 15 | Journal Article |
Cited by: Papers (26)
We fabricated the first compact 100-gigabit Ethernet (100GbE) transmitter optical sub-assembly (TOSA) using a directly modulated DFB laser (DML) array monolithically integrated with an optical multiplexer. Specially designed InGaAlAs/InGaAlAs multiple quantum wells make it possible to obtain a large gain in the 1295-1310-nm wavelength range and to operate at a high temperature of 55 °C. The four-c...Show More

30-km Error-Free Transmission of Directly Modulated DFB Laser Array Transmitter Optical Sub-Assembly for 100-Gb Application

Shigeru Kanazawa;Wataru Kobayashi;Yuta Ueda;Takeshi Fujisawa;Kiyoto Takahata;Tetsuichiro Ohno;Toshihide Yoshimatsu;Hiroyuki Ishii;Hiroaki Sanjoh

Year: 2016 | Volume: 34, Issue: 15 | Journal Article |

Compact Hybrid-Integrated 100-Gb/s TOSA Using EADFB Laser Array and AWG Multiplexer

Takaharu Ohyama;Yoshiyuki Doi;Wataru Kobayashi;Shigeru Kanazawa;Takuya Tanaka;Kiyoto Takahata;Atsushi Kanda;Takeshi Kurosaki;Tetsuichiro Ohno;Hiroaki Sanjoh;Toshikazu Hashimoto

IEEE Photonics Technology Letters
Year: 2016 | Volume: 28, Issue: 7 | Journal Article |
We have developed a compact hybrid-integrated four-lane $\times 25.8$ Gb/s transmitter optical sub-assembly (TOSA) for a 100 Gb/s transceiver for 40-km transmission. The TOSA has a simple configuration in which a four-channel electroabsorption modulator integrated distributed feedback (EADFB) laser array is directly attached to the input waveguide end-faces of a silica-based arrayed waveguide gr...Show More

Compact Hybrid-Integrated 100-Gb/s TOSA Using EADFB Laser Array and AWG Multiplexer

Takaharu Ohyama;Yoshiyuki Doi;Wataru Kobayashi;Shigeru Kanazawa;Takuya Tanaka;Kiyoto Takahata;Atsushi Kanda;Takeshi Kurosaki;Tetsuichiro Ohno;Hiroaki Sanjoh;Toshikazu Hashimoto

Year: 2016 | Volume: 28, Issue: 7 | Journal Article |

Compact Hybrid Integrated 100-Gb/s Transmitter Optical Sub-Assembly Using Optical Butt-Coupling Between EADFB Lasers and Silica-Based AWG Multiplexer

Takaharu Ohyama;Yoshiyuki Doi;Wataru Kobayashi;Shigeru Kanazawa;Kiyoto Takahata;Atsushi Kanda;Takeshi Kurosaki;Takuya Tanaka;Tetsuichiro Ohno;Hiroaki Sanjoh;Toshikazu Hashimoto

Journal of Lightwave Technology
Year: 2016 | Volume: 34, Issue: 3 | Journal Article |
A compact hybrid-integrated 100 Gb/s (4 lane × 25.78125 Gb/s) transmitter optical sub-assembly (TOSA) has been developed for a 100 Gb/s transceiver for 40-km transmission over a single-mode fiber. The TOSA has a simple configuration in which four electro-absorption modulator-integrated distributed feedback (EADFB) lasers are directly attached to the input waveguide end-face of a silica-based array...Show More

Compact Hybrid Integrated 100-Gb/s Transmitter Optical Sub-Assembly Using Optical Butt-Coupling Between EADFB Lasers and Silica-Based AWG Multiplexer

Takaharu Ohyama;Yoshiyuki Doi;Wataru Kobayashi;Shigeru Kanazawa;Kiyoto Takahata;Atsushi Kanda;Takeshi Kurosaki;Takuya Tanaka;Tetsuichiro Ohno;Hiroaki Sanjoh;Toshikazu Hashimoto

Year: 2016 | Volume: 34, Issue: 3 | Journal Article |

Flip-Chip Interconnection Technique for Beyond 100-Gb/s (4 × 25.8-Gb/s) EADFB Laser Array Transmitter

Shigeru Kanazawa;Takeshi Fujisawa;Kiyoto Takahata;Yuta Ueda;Hiroyuki Ishii;Ryuzo Iga;Wataru Kobayashi;Hiroaki Sanjoh

Journal of Lightwave Technology
Year: 2016 | Volume: 34, Issue: 2 | Journal Article |
Cited by: Papers (21)
We developed a flip-chip interconnection technique that is suitable for an EADFB laser array transmitter operating at more than 100 Gb/s (4 × 25 Gb/s). The flip-chip interconnection technique provides a good thermal flow comparable to that of the conventional wire interconnection technique but with a higher modulation bandwidth and lower electrical crosstalk. For a flip-chip interconnection 112-Gb...Show More

Flip-Chip Interconnection Technique for Beyond 100-Gb/s (4 × 25.8-Gb/s) EADFB Laser Array Transmitter

Shigeru Kanazawa;Takeshi Fujisawa;Kiyoto Takahata;Yuta Ueda;Hiroyuki Ishii;Ryuzo Iga;Wataru Kobayashi;Hiroaki Sanjoh

Year: 2016 | Volume: 34, Issue: 2 | Journal Article |

4 × 28 Gbaud PAM4 integrated ROSA with high-sensitivity APD

Yasuhiko Nakanishi;Tetsuichiro Ohno;Toshihide Yoshimatsu;Yoshiyuki Doi;Fumito Nakajima;Yoshifumi Muramoto;Hiroaki Sanjoh

2015 Opto-Electronics and Communications Conference (OECC)
Year: 2015 | Conference Paper |
Cited by: Papers (7)
We demonstrate the first 4 × 28 Gbaud PAM4 data reception with an integrated APD-ROSA. A minimum receiver sensitivity of ™21.2dBm OMA of the inner-eye was obtained, which enable us to achieve 30-km transmission, assuming a SSMF.Show More

4 × 28 Gbaud PAM4 integrated ROSA with high-sensitivity APD

Yasuhiko Nakanishi;Tetsuichiro Ohno;Toshihide Yoshimatsu;Yoshiyuki Doi;Fumito Nakajima;Yoshifumi Muramoto;Hiroaki Sanjoh

Year: 2015 | Conference Paper |

400-Gb/s operation of flip-chip interconnection EADFB laser array module

Shigeru Kanazawa;Takeshi Fujisawa;Kiyoto Takahata;Hiroaki Sanjoh;Ryuzo Iga;Yuta Ueda;Wataru Kobayashi;Hiroyuki Ishii

2015 Optical Fiber Communications Conference and Exhibition (OFC)
Year: 2015 | Conference Paper |
Cited by: Papers (6)
The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 × 50-Gb/s simultaneous operation.Show More

400-Gb/s operation of flip-chip interconnection EADFB laser array module

Shigeru Kanazawa;Takeshi Fujisawa;Kiyoto Takahata;Hiroaki Sanjoh;Ryuzo Iga;Yuta Ueda;Wataru Kobayashi;Hiroyuki Ishii

Year: 2015 | Conference Paper |

Flip-Chip Interconnection Lumped-Electrode EADFB Laser for 100-Gb/s/ $\lambda $ Transmitter

Shigeru Kanazawa;Takeshi Fujisawa;Kiyoto Takahata;Toshio Ito;Yuta Ueda;Wataru Kobayashi;Hiroyuki Ishii;Hiroaki Sanjoh

IEEE Photonics Technology Letters
Year: 2015 | Volume: 27, Issue: 16 | Journal Article |
We have achieved the 100-Gb/s/λ operation of a flip-chip interconnection 1.3-μm lumped-electrode electroabsorption modulator integrated with a distributed feedback laser module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-G...Show More

Flip-Chip Interconnection Lumped-Electrode EADFB Laser for 100-Gb/s/ $\lambda $ Transmitter

Shigeru Kanazawa;Takeshi Fujisawa;Kiyoto Takahata;Toshio Ito;Yuta Ueda;Wataru Kobayashi;Hiroyuki Ishii;Hiroaki Sanjoh

Year: 2015 | Volume: 27, Issue: 16 | Journal Article |

Low Driving Voltage Operation of MZI-Type EA Modulator Integrated With DFB Laser Using Optical Absorption and Interferometric Extinction

Yuta Ueda;Takeshi Fujisawa;Shigeru Kanazawa;Wataru Kobayashi;Kiyoto Takahata;Hiroaki Sanjoh;Hiroyuki Ishii;Masaki Kohtoku

IEEE Journal of Selected Topics in Quantum Electronics
Year: 2015 | Volume: 21, Issue: 6 | Journal Article |
We have developed a novel electroabsorption modulator (EAM)-integrated distributed feedback laser (EA-DFB laser), in which an EAM functioning as an external modulator is integrated in a Mach-Zehnder interferometer (MZI). The MZI-type EAM (MZEA) modulates light intensity by both optical absorption and interferometric extinction. As a result, it improves the extinction ratio (ER) of a conventional E...Show More

Low Driving Voltage Operation of MZI-Type EA Modulator Integrated With DFB Laser Using Optical Absorption and Interferometric Extinction

Yuta Ueda;Takeshi Fujisawa;Shigeru Kanazawa;Wataru Kobayashi;Kiyoto Takahata;Hiroaki Sanjoh;Hiroyuki Ishii;Masaki Kohtoku

Year: 2015 | Volume: 21, Issue: 6 | Journal Article |

High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique

Shigeru Kanazawa;Takeshi Fujisawa;Hiroyuki Ishii;Kiyoto Takahata;Yuta Ueda;Ryuzo Iga;Hiroaki Sanjoh

IEEE Journal of Selected Topics in Quantum Electronics
Year: 2015 | Volume: 21, Issue: 6 | Journal Article |
Cited by: Papers (11)
We fabricated a 400-G flip-chip interconnection eight-channel EADFB laser array module. The flip-chip interconnection technique provides a higher modulation bandwidth and lower electrical crosstalk than the wire interconnection technique. The 3-dB bandwidth of the flip-chip interconnection subassembly was about 50 GHz. And the electrical crosstalk of the flip-chip interconnection module was suppre...Show More

High-Speed (400 Gb/s) Eight-Channel EADFB Laser Array Module Using Flip-Chip Interconnection Technique

Shigeru Kanazawa;Takeshi Fujisawa;Hiroyuki Ishii;Kiyoto Takahata;Yuta Ueda;Ryuzo Iga;Hiroaki Sanjoh

Year: 2015 | Volume: 21, Issue: 6 | Journal Article |

Transmitter Optical Subassembly Using a Polarization Beam Combiner for 100 Gbit/s Ethernet over 40-km Transmission

Takaharu Ohyama;Akira Ohki;Kiyoto Takahata;Toshio Ito;Nobuhiro Nunoya;Hiroyasu Mawatari;Takeshi Fujisawa;Shigeru Kanazawa;Ryuzo Iga;Hiroaki Sanjoh

Journal of Lightwave Technology
Year: 2015 | Volume: 33, Issue: 10 | Journal Article |
Cited by: Papers (11)
A transmitter optical subassembly (TOSA) has been developed for a 100-Gbit/s Ethernet system for a long optical transmission distance over a 40-km single-mode fiber (SMF). To obtain a high optical output power and a high dynamic extinction ratio, the TOSA consists of two two-channel distributed feedback laser diode array chips integrated with electro-absorption modulators (EADFB laser array chips)...Show More

Transmitter Optical Subassembly Using a Polarization Beam Combiner for 100 Gbit/s Ethernet over 40-km Transmission

Takaharu Ohyama;Akira Ohki;Kiyoto Takahata;Toshio Ito;Nobuhiro Nunoya;Hiroyasu Mawatari;Takeshi Fujisawa;Shigeru Kanazawa;Ryuzo Iga;Hiroaki Sanjoh

Year: 2015 | Volume: 33, Issue: 10 | Journal Article |

8 x 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique

S. Kanazawa;T. Fujisawa;K. Takahata;H. Sanjoh;R. Iga;H. Ishii

2014 International Semiconductor Laser Conference
Year: 2014 | Conference Paper |
Cited by: Papers (1) | Patents (2)
We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.Show More

8 x 50-Gb/s simultaneous operation of EADFB laser array using flip-chip interconnection technique

S. Kanazawa;T. Fujisawa;K. Takahata;H. Sanjoh;R. Iga;H. Ishii

Year: 2014 | Conference Paper |

Successful Demonstration of Low-Voltage (1 Vpp) MZI-Type EAM-Integrated DFB Laser for 25.8-Gbit/s 40-km Transmission

Y. Ueda;T. Fujisawa;S. Kanazawa;W. Kobayashi;K. Takahata;H. Sanjoh;H. Ishii

2014 International Semiconductor Laser Conference
Year: 2014 | Conference Paper |
Cited by: Papers (1)
We developed a new type of EAM-integrated DFB laser that employs both optical absorption and interferometric extinction. And, we achieve a 25.8-Gbit/s 40Gbit/s 40-km transmission with the km novel laser at a modulation voltage of 1 Vpp.Show More

Successful Demonstration of Low-Voltage (1 Vpp) MZI-Type EAM-Integrated DFB Laser for 25.8-Gbit/s 40-km Transmission

Y. Ueda;T. Fujisawa;S. Kanazawa;W. Kobayashi;K. Takahata;H. Sanjoh;H. Ishii

Year: 2014 | Conference Paper |

40-Gbit/s EADFB laser integrated with short cavity SOA improving chirp characteristics with low power consumption

W. Kobayashi;M. Arai;T. Fujisawa;Y. Shibata;T. Sato;T. Ito;K. Hasebe;T. Yamanaka;H. Sanjoh

2014 The European Conference on Optical Communication (ECOC)
Year: 2014 | Conference Paper |
Cited by: Papers (4)
We demonstrate 40-Gbit/s operation by chirp control and increased output power employing an EADFB laser integrated with short-cavity SOA. We achieved 5-km SMF transmission in the 1.55-μm wavelength with lower power consumption than a stand-alone EADFB.Show More

40-Gbit/s EADFB laser integrated with short cavity SOA improving chirp characteristics with low power consumption

W. Kobayashi;M. Arai;T. Fujisawa;Y. Shibata;T. Sato;T. Ito;K. Hasebe;T. Yamanaka;H. Sanjoh

Year: 2014 | Conference Paper |

Compact Flip-Chip Interconnection 112-Gbit/s EADFB Laser Array Module With High Eye-Mask Margin

Shigeru Kanazawa;Takeshi Fujisawa;Nobuhiro Nunoya;Akira Ohki;Kiyoto Takahata;Hiroaki Sanjoh;Ryuzo Iga;Hiroyuki Ishii

Journal of Lightwave Technology
Year: 2014 | Volume: 32, Issue: 1 | Journal Article |
The first compact and high-performance optical transmitter using flip-chip interconnects has been developed for a 112-Gbit/s transceiver. The flip-chip interconnects provide lower crosstalk and a higher modulation bandwidth than wire interconnects. The flip-chip interconnection module has 3-dB frequency bandwidths of over 30 GHz. This value is up to 5 GHz better than that of a wire interconnection...Show More

Compact Flip-Chip Interconnection 112-Gbit/s EADFB Laser Array Module With High Eye-Mask Margin

Shigeru Kanazawa;Takeshi Fujisawa;Nobuhiro Nunoya;Akira Ohki;Kiyoto Takahata;Hiroaki Sanjoh;Ryuzo Iga;Hiroyuki Ishii

Year: 2014 | Volume: 32, Issue: 1 | Journal Article |

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