Hiroaki Sanjoh - IEEE Xplore Author Profile

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We fabricated a Hi-FIT LE-EADFB laser module. Hi-FIT, which is a wire-free interconnection technique, provides a higher modulation bandwidth and a flatter frequency response than a conventional wire interconnection technique. The fabricated module has a 3-dB bandwidth of about 59 GHz and a sufficiently flat frequency response of less than 45 GHz. Using this module, we demonstrated a single-wavelen...Show More
We fabricated a flip-chip interconnection lumped-electrode EADFB laser module and an optical receiver that includes a broadband electrical amplifier. Both have a 3-dB bandwidth of more than 50 GHz. Under 53.2-Gbaud 4-PAM (107 Gb/s) operation, clear eye openings were obtained without an equalizer even after a 2-km SMF transmission, and we obtained a BER of less than 2 × 10-4 under error-free condit...Show More
High-speed optical transmitters with a flip-chip interconnection were developed. The flip-chip interconnection technique can provide a high modulation bandwidth and low electrical crosstalk. We achieved 8 × 50-Gbit/s simultaneous operation with an EADFB laser array module and 100-Gbit/s operation with an EADFB laser module.Show More
We have developed a flip-chip interconnection technique to solve the problem of the degradation of the modulation bandwidth of an optical transmitter due to the parasitic inductance of bonding wire. And we have fabricated an LE-EA-DFB laser module that has a 3-dB bandwidth of 59 GHz thanks to our flip-chip interconnection technique. The fabricated optical receiver, which includes a wideband electr...Show More
We fabricated the first compact 100-gigabit Ethernet (100GbE) transmitter optical sub-assembly (TOSA) using a directly modulated DFB laser (DML) array monolithically integrated with an optical multiplexer. Specially designed InGaAlAs/InGaAlAs multiple quantum wells make it possible to obtain a large gain in the 1295-1310-nm wavelength range and to operate at a high temperature of 55 °C. The four-c...Show More
We have developed a compact hybrid-integrated four-lane $\times 25.8$ Gb/s transmitter optical sub-assembly (TOSA) for a 100 Gb/s transceiver for 40-km transmission. The TOSA has a simple configuration in which a four-channel electroabsorption modulator integrated distributed feedback (EADFB) laser array is directly attached to the input waveguide end-faces of a silica-based arrayed waveguide gr...Show More
A compact hybrid-integrated 100 Gb/s (4 lane × 25.78125 Gb/s) transmitter optical sub-assembly (TOSA) has been developed for a 100 Gb/s transceiver for 40-km transmission over a single-mode fiber. The TOSA has a simple configuration in which four electro-absorption modulator-integrated distributed feedback (EADFB) lasers are directly attached to the input waveguide end-face of a silica-based array...Show More
We developed a flip-chip interconnection technique that is suitable for an EADFB laser array transmitter operating at more than 100 Gb/s (4 × 25 Gb/s). The flip-chip interconnection technique provides a good thermal flow comparable to that of the conventional wire interconnection technique but with a higher modulation bandwidth and lower electrical crosstalk. For a flip-chip interconnection 112-Gb...Show More
We demonstrate the first 4 × 28 Gbaud PAM4 data reception with an integrated APD-ROSA. A minimum receiver sensitivity of ™21.2dBm OMA of the inner-eye was obtained, which enable us to achieve 30-km transmission, assuming a SSMF.Show More
The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 × 50-Gb/s simultaneous operation.Show More
We have achieved the 100-Gb/s/λ operation of a flip-chip interconnection 1.3-μm lumped-electrode electroabsorption modulator integrated with a distributed feedback laser module for the first time. The flip-chip interconnection provides a flatter frequency response characteristic and a higher modulation bandwidth. Clear eye opening was achieved for 103-Gb/s nonreturn to zero and equalizer-free 56-G...Show More
We have developed a novel electroabsorption modulator (EAM)-integrated distributed feedback laser (EA-DFB laser), in which an EAM functioning as an external modulator is integrated in a Mach-Zehnder interferometer (MZI). The MZI-type EAM (MZEA) modulates light intensity by both optical absorption and interferometric extinction. As a result, it improves the extinction ratio (ER) of a conventional E...Show More
We fabricated a 400-G flip-chip interconnection eight-channel EADFB laser array module. The flip-chip interconnection technique provides a higher modulation bandwidth and lower electrical crosstalk than the wire interconnection technique. The 3-dB bandwidth of the flip-chip interconnection subassembly was about 50 GHz. And the electrical crosstalk of the flip-chip interconnection module was suppre...Show More
A transmitter optical subassembly (TOSA) has been developed for a 100-Gbit/s Ethernet system for a long optical transmission distance over a 40-km single-mode fiber (SMF). To obtain a high optical output power and a high dynamic extinction ratio, the TOSA consists of two two-channel distributed feedback laser diode array chips integrated with electro-absorption modulators (EADFB laser array chips)...Show More
We fabricated an eight-channel EADFB laser array sub-assembly using a flip-chip interconnection technique that provided a low crosstalk. We achieved clear eye openings for all eight lanes with 8 × 50-Gb/s simultaneous operation.Show More
We developed a new type of EAM-integrated DFB laser that employs both optical absorption and interferometric extinction. And, we achieve a 25.8-Gbit/s 40Gbit/s 40-km transmission with the km novel laser at a modulation voltage of 1 Vpp.Show More
We demonstrate 40-Gbit/s operation by chirp control and increased output power employing an EADFB laser integrated with short-cavity SOA. We achieved 5-km SMF transmission in the 1.55-μm wavelength with lower power consumption than a stand-alone EADFB.Show More
The first compact and high-performance optical transmitter using flip-chip interconnects has been developed for a 112-Gbit/s transceiver. The flip-chip interconnects provide lower crosstalk and a higher modulation bandwidth than wire interconnects. The flip-chip interconnection module has 3-dB frequency bandwidths of over 30 GHz. This value is up to 5 GHz better than that of a wire interconnection...Show More