400-Gb/s operation of flip-chip interconnection EADFB laser array module

The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 × 50-Gb/s simultaneous operation.

1. Introduction

The exponential growth of wireless applications and cloud service has created a pressing need to handle enormous amounts of data traffic for datacom and telecom services. The Ethernet data rate is increasing rapidly to cope with this demand. The 100-gigabit Ethernet (100GbE) was standardized in 2010 [1]. For single-mode fiber (SMF) applications, it employs a multi-lane interface with a data rate of . The four lanes are allocated on an 800-GHz spacing LAN-WDM grid at .