Error and Correction in Capacitance–Voltage Measurement Due to the Presence of Source and Drain | IEEE Journals & Magazine | IEEE Xplore

Error and Correction in Capacitance–Voltage Measurement Due to the Presence of Source and Drain


Abstract:

MOS capacitor with highly leaky gate dielectric requires source and drain to support the inversion charges. This transistor-like capacitor for capacitance-voltage ( -) me...Show More

Abstract:

MOS capacitor with highly leaky gate dielectric requires source and drain to support the inversion charges. This transistor-like capacitor for capacitance-voltage ( -) measurement has become popular due to the need of accurately measuring inversion capacitance. The source and drain overlap capacitance is an unavoidable error and must be quantified. Although it is possible to measure the overlap capacitance directly, conventional method is not reliable due to high leakage. Here, we show that this error can be corrected in the new time-domain-reflectometry - measurement method introduced recently for highly leaky capacitors.
Published in: IEEE Electron Device Letters ( Volume: 28, Issue: 7, July 2007)
Page(s): 640 - 642
Date of Publication: 25 June 2007

ISSN Information:

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Since MOSFET operates at inversion, the inversion capacitance is an important parameter to be measured accurately. The extraction of oxide thickness also depends on accurate knowledge of the inversion capacitance. When the gate oxide is very thin, the traditional MOS capacitor test structure for capacitance–voltage (– ) measurement can no longer be used for inversion capacitance extraction because the generation-limited inversion charges are leaked across the thin oxide layer [1]. As a result, the transistor-like capacitor structure with source and drain to provide inversion charge has become popular for obtaining low-frequency-like – curve using high-frequency measurement [2]–[5].

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1.
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2.
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4.
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5.
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7.
J. Schmitz, F. N. Cubaynest, R. J. Havens, R. De Kort, A. J. Scholten and L. F. Tiemeijer, "Test structure design considerations for RF-CV measurements on leaky dielectrics", Proc. ICMTS, pp. 181-185, 2003.
8.
G. A. Brown, "Capacitance characterization in integrated circuit development: The intimate relationship of test structure design equivalent circuit and measurement methodology", Proc. ICMTS, pp. 213-217, 2005.
9.
Y. Wang, K. P. Cheung, R. Choi, G. A. Brown and B.-H. Lee, "Time domain reflectometry for capacitance—Voltage measurement with very high leakage current", IEEE Electron Device Lett., vol. 28, no. 1, pp. 51-53, Jan. 2006.
10.
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11.
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12.
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