3D nonlinear thermal stress analysis of VCSEL (vertical-cavity surface-emitting laser) assemblies with lead-free flip-chip interconnects | IEEE Conference Publication | IEEE Xplore
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3D nonlinear thermal stress analysis of VCSEL (vertical-cavity surface-emitting laser) assemblies with lead-free flip-chip interconnects

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Yida Zou; J. Lau; S. Catnerlo
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Published in: 53rd Electronic Components and Technology Conference, 2003. Proceedings.
Date of Conference: 27-30 May 2003
Date Added to IEEE Xplore: 04 August 2003
Print ISBN:0-7803-7791-5
Print ISSN: 0569-5503
DOI: 10.1109/ECTC.2003.1216528
Conference Location: New Orleans, LA, USA

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1. Introduction

In the midnight of October 10, 2002, the EU Parliament and the EU Council of Ministers reached an agreement on a text for the WEEE (Waste Electrical and Electronic Equipment) and RoHS (Restriction of Hazardous Substances) directives, One of the items in the text is to ban Pb (lead) from July 1, 2006.

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