Abstract:
In this letter, we propose a new high-sensitivity differential composite probe that is capable of measuring the electric- and magnetic fields simultaneously. First, the c...Show MoreMetadata
Abstract:
In this letter, we propose a new high-sensitivity differential composite probe that is capable of measuring the electric- and magnetic fields simultaneously. First, the conventional differential composite probe is theoretically analyzed and studied. Second, a pair of additional loops are introduced into the differential composite probe to enlarge its detection area and improve the frequency response of the proposed probe, which can enhance the detection sensitivity. The proposed probe is etched on a high-frequency, six-layer, printed circuit board. The correspondingly simulated and measured results are given. A standard microstrip line with 50 Ω is utilized to characterize the key parameters of the probe, including the transmission coefficient and calibration factor. Compared with the conventional single-component probe, the proposed probe has a higher detection sensitivity, and it can simultaneously measure electric and magnetic fields.
Published in: IEEE Antennas and Wireless Propagation Letters ( Volume: 22, Issue: 12, December 2023)
School of Microelectronics, Xidian University, Xi'an, Shaanxi, China
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, CEPREI, Guangzhou, China
School of Microelectronics, Xidian University, Xi'an, Shaanxi, China
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, CEPREI, Guangzhou, China
School of Microelectronics, Xidian University, Xi'an, Shaanxi, China
School of Microelectronics, Xidian University, Xi'an, Shaanxi, China
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, CEPREI, Guangzhou, China
School of Microelectronics, Xidian University, Xi'an, Shaanxi, China
Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, CEPREI, Guangzhou, China
School of Microelectronics, Xidian University, Xi'an, Shaanxi, China