I. Introduction
Electrochemical migration is a reliability problem in the electronics industry, which is nowadays very relevant mainly due to the trend of miniaturization of electronic components and the spacing between them. If the components are exposed to a harsh environment, the probability of failure caused by ECM increases [1, 2]. To improve the lifetime of the products and their reliability, which is important, especially in medical, automotive, or aerospace fields, it is necessary to consider all the factors influencing ECM [3]. The most critical factors include electrode material, temperature, relative humidity, contamination, substrate type, and voltage magnitude. Other factors affecting ECM are electrode solubility, metal ion migration rate, PCB absorbency, flux residue, evaporation, or electrode spacing [4].