I. Introduction
The performance of most commercially available, high-frequency silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) strongly depends on the vertical scaling of the doping profile [1]. The base width, , is a critical parameter when optimizing the maximum transit () and oscillation () frequencies. As technology scaling progresses, values necessarily decrease, enabling higher operational frequencies for SiGe HBTs [2]. However, these narrower base widths pose added challenges to the manufacturing processes, as the required tolerances and thermal processing constraints become more stringent.