I. Introduction
Low temperature co-fired ceramic (LTCC) technology is a multilayer technology for the production of RF and microwave components, it is based on combination of ceramic and metal layers, therefore, it is suitable for passive component realization. Depending on the configuration, passive inner structure occupies several layers where the connection between them is through via hole to the top layer. LTCC technology has several advantageous: high thermal conductivity, low resistance, dielectric losses and multilayer integration of passive components. These advantages can be utilized in systemin-package (SiP) developments where passive and active components are integrated into a single package. But the realization of compact RF SiPs, are limited due to the large size of the highly selective higher-order filter.
Proposed bpf.