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Yanchen Wu

Publications
6
Citations
18
Publications by Year
20192025
Co-Authors:
Show All Co-Authors (14)
Image of author Yanchen Wu

Yanchen Wu

Affiliation

School of Electrical and Automation Engineering
Nanjing Normal University
Nanjing, China

Publication Topics

Biography

Yanchen Wu was born in Jiangsu, China. He received the B.E. degree in electrical engineering from Nanhang Jincheng College, Nanjing, China, in 2022. He is currently pursuing the master’s degree in electrical engineering with Nanjing Normal University, Nanjing.,His research interests include the design of permanent magnet machines and thermal analysis.(Based on document published on 13 June 2024).
Publications
6
Citations
18
Publications by Year
20192025
Co-Authors:
Show All Co-Authors (14)
Author's Published Works

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A Fast and Accuracy 3-D Transient Thermal Modeling for Surface Water Cooling Permanent Magnet Machine

Yanchen Wu;Baocheng Guo;Yunlu Du;Chenglong Chu;Fei Peng

IEEE Transactions on Transportation Electrification
Year: 2025 | Volume: 11, Issue: 1 | Journal Article |
This article proposes a network-based 3-D thermal network (TN) model for permanent magnet (PM) machines with the surface-attached cooling structure (SACS). This model is developed based on the network topology method. It combines detailed radial and axial thermal information and discretizes the motor structure into highly discrete thermal components. In this way, highly accurate results are obtain...Show More

A Fast and Accuracy 3-D Transient Thermal Modeling for Surface Water Cooling Permanent Magnet Machine

Yanchen Wu;Baocheng Guo;Yunlu Du;Chenglong Chu;Fei Peng

Year: 2025 | Volume: 11, Issue: 1 | Journal Article |

Simulation Study on Thermal Characteristics and Thermal Stress of Semiconductor Laser Package

Weibin Ye;Yanchen Wu;Jing Wang;Yi Duan;Jiangwen Liu;Daoguo Yang

2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Year: 2020 | Conference Paper |
Cited by: Papers (3)
In semiconductor lasers, chip heat dissipation is a hot topic in current research. The increase in chip temperature will not only affect the service life of the laser, but also the thermal stress will reduce the reliability of the laser. To solve this problem, this research starts with the bonding layer between the laser chip and the substrate, uses nano-silver solder paste with high thermal condu...Show More

Simulation Study on Thermal Characteristics and Thermal Stress of Semiconductor Laser Package

Weibin Ye;Yanchen Wu;Jing Wang;Yi Duan;Jiangwen Liu;Daoguo Yang

Year: 2020 | Conference Paper |

Mechanical behavior analysis of heterogeneous interface in stretchable electronics packaging

Yanchen Wu;Dongjing Liu;Daoguo Yang;Xiyou Wang;Haojie Wang;Yasong Fan

2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Year: 2020 | Conference Paper |
Stretchable electronics can be summarized as an emerging electronic technology that manufactures electronic devices on flexible substrates, and has broad application prospects due to its unique ductility. In order to improve product reliability, it has become critical to understand all the failure modes that caused it to fail. Interface delamination is an important factor leading to its failure, e...Show More

Mechanical behavior analysis of heterogeneous interface in stretchable electronics packaging

Yanchen Wu;Dongjing Liu;Daoguo Yang;Xiyou Wang;Haojie Wang;Yasong Fan

Year: 2020 | Conference Paper |

Mold Flow Analysis of a SiP Package for Power Management

Yi Duan;Xiyou Wang;Daoguo Yang;Jing Wang;Weibin Ye;Yanchen Wu

2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Year: 2020 | Conference Paper |
Cited by: Papers (5)
At present, System in Package (SiP) is getting more and more applications in power packages. Due to the complexity of the packages, the molding process becomes crucial for the yield and reliability of the products. During the transfer molding process, the packaging processes of the packages may introduce assembly defects, such as void, wire sweep, warping, etc. To determine the main factors is one...Show More

Mold Flow Analysis of a SiP Package for Power Management

Yi Duan;Xiyou Wang;Daoguo Yang;Jing Wang;Weibin Ye;Yanchen Wu

Year: 2020 | Conference Paper |

Modal analysis of IGBT power devices based on ANSYS

Haojie Wang;Dongjing Liu;Yasong Fan;Yanchen Wu;Tieliang Qiao;D.G. Yang

2019 20th International Conference on Electronic Packaging Technology(ICEPT)
Year: 2019 | Conference Paper |
Cited by: Papers (7)
This paper addresses the stability and reliability of IGBT operation under vibration conditions. Firstly, the structure of the module is built by soildworks; secondly, the ANSYS finite element analysis software is used as a platform to perform random vibration analysis on the structure; finally, a reasonable fatigue life calculation model is constructed based on the Conffin-Manson equation and the...Show More

Modal analysis of IGBT power devices based on ANSYS

Haojie Wang;Dongjing Liu;Yasong Fan;Yanchen Wu;Tieliang Qiao;D.G. Yang

Year: 2019 | Conference Paper |

Thermal Performance Analysis for Multiple Heat Source Power Devices

Yasong Fan;Dongjing Liu;Xiyou Wang;Haojie Wang;Yanchen Wu;D.G. Yang

2019 20th International Conference on Electronic Packaging Technology(ICEPT)
Year: 2019 | Conference Paper |
Cited by: Papers (3)
In this paper, the thermal performance analysis and optimization of the package of a specific multi-heat source power device is carried out. Firstly, the finite element analysis software ANSYS Icepak is used as a tool to build a simplified model of the array type multi-power device package module. Secondly, the impact of five variable parameters on thermal performance of multi-heat source power de...Show More

Thermal Performance Analysis for Multiple Heat Source Power Devices

Yasong Fan;Dongjing Liu;Xiyou Wang;Haojie Wang;Yanchen Wu;D.G. Yang

Year: 2019 | Conference Paper |

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