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Mechanical behavior analysis of heterogeneous interface in stretchable electronics packaging
Yanchen Wu;Dongjing Liu;Daoguo Yang;Xiyou Wang;Haojie Wang;Yasong Fan
2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Year: 2020 | Conference Paper |
Stretchable electronics can be summarized as an emerging electronic technology that manufactures electronic devices on flexible substrates, and has broad application prospects due to its unique ductility. In order to improve product reliability, it has become critical to understand all the failure modes that caused it to fail. Interface delamination is an important factor leading to its failure, e...Show More
Modal analysis of IGBT power devices based on ANSYS
Haojie Wang;Dongjing Liu;Yasong Fan;Yanchen Wu;Tieliang Qiao;D.G. Yang
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
Year: 2019 | Conference Paper |
Cited by: Papers (7)
This paper addresses the stability and reliability of IGBT operation under vibration conditions. Firstly, the structure of the module is built by soildworks; secondly, the ANSYS finite element analysis software is used as a platform to perform random vibration analysis on the structure; finally, a reasonable fatigue life calculation model is constructed based on the Conffin-Manson equation and the...Show More
Analysis of Temperature Response Characteristics of Voltage RMS Sensor Packaging Based on Diode
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
Year: 2019 | Conference Paper |
Voltage is the most basic and important electrical parameter of circuit and signal. Voltage RMS (Root Mean Square) is an important parameter reflecting the size of active power, and its monitoring is very important. In this paper, based on the principle that the junction voltage of the PN junction of the diode varies with temperature, the packaging design of the AC voltage RMS conversion sensor ba...Show More
Thermal Performance Analysis for Multiple Heat Source Power Devices
Yasong Fan;Dongjing Liu;Xiyou Wang;Haojie Wang;Yanchen Wu;D.G. Yang
2019 20th International Conference on Electronic Packaging Technology(ICEPT)
Year: 2019 | Conference Paper |
Cited by: Papers (3)
In this paper, the thermal performance analysis and optimization of the package of a specific multi-heat source power device is carried out. Firstly, the finite element analysis software ANSYS Icepak is used as a tool to build a simplified model of the array type multi-power device package module. Secondly, the impact of five variable parameters on thermal performance of multi-heat source power de...Show More
Preparation and Thermal Analysis of the nano-silver /Graphene composite material for packaging module
Dongjing Liu;Haiying Lin;Yasong Fan;Haidong Zhu;Haidong Yan;D.G. Yang
2018 19th International Conference on Electronic Packaging Technology (ICEPT)
Year: 2018 | Conference Paper |
In recent years, all kinds of heat dissipation method are carried out for high-power high-density packaging devices such as an air forced convection heat sink, single phase liquid-cooled cold plate, two-phase cold plate and so on. With the nanotechnology development, high conductivity, low thermal resistance material and sintering connect technology was developed for Micro/Nanoelectromechanical Sy...Show More
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