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Solder Bump Maker with coining process on TSV chips for 3D packages
Ki-Jun Sung;Kwang-Seong Choi;Byeong-Ok Lim;Hyun-Cheol Bae;Sun-Woo Choo;Jong-Tae Moon;Yong Hwan Kwon;Eun Soo Nam;Yong-Sung Eom
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
Year: 2010 | Conference Paper |
Cited by: Papers (2)
The electroplating and screen printing are widely used in the micro-electric industry but they have disadvantages of a complicated series of bumping process, equipments and materials. Furthermore, they are not suitable for the fine pitch bumping technology. To overcome these weak points, a maskless bumping technology using SBM has been developed. Solder Bump Masker (SBM) technology does not need a...Show More
Novel solder-on-pad (SoP) technology for fine-pitch flip chip bonding
Kwang-Seong Choi;Sun-Woo Choo;Jong-Jin Lee;Ki-Jun Sung;Hyun-Chel Bae;Byeong-Ok Lim;Jong-Tae Moon;Yong-Sung Eom
2010 11th International Conference on Electronic Packaging Technology & High Density Packaging
Year: 2010 | Conference Paper |
Solder-on-pad (SoP) technology gives the fine-pitch flip chip bonding manufacturability and reliability. For the SoP technology with pitch equal to or less than 150 μm pitch, there are many candidates. The cost-effectiveness will be one of the major criteria determining the industry preference. A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been de...Show More
60 GHz band RF/RoF Link characteristics of enhanced optical transmitter SoP module
Kwang-Seong Choi;Yong-Duck Chung;Jae-Sik Sim;Dong-Suk Jun;Dong-Soo Shin;Jong-Tae Moon;Hyun-Kyu Yu;Jeha Kim
An optical transmitter system-on-packaging (SoP) with an electro-absorption modulator (EAM) was developed for 60 GHz band radio-over-fiber (RoF) uplink. An analysis to develop the SoP module with small noise figure was performed, so that the noise figure of the RF/RoF link with the SoP module was measured 8.445 dB at 500 MHz. The SNR and EVM of the link were measured and the corresponding BER was ...Show More
System-on-packaging with electro-absorption modulator for 60 GHz band radio-over-fiber link
Kwang-Seong Choi;Yong-Duck Chung;Dong-Suk Jim;Young-Shik Kang;Byoung-Tae Ahn;Kyoung-Ik Cho;Jong-Tae Moon;Jeha Kim
56th Electronic Components and Technology Conference 2006
Year: 2006 | Conference Paper |
Cited by: Papers (2)
We developed a system-on-packaging (SoP) with an electro-absorption modulator (EAM) for a 60 GHz band radio-over-fiber (RoF) link. It consists of an EAM device, a microstrip filter, and a low noise amplifier (LNA). The microstrip filter was used to achieve the impedance matching between the EAM device and the LNA and to reject the local oscillator (LO) frequency of the heterodyne system. The frequ...Show More
Fabrication and characteristics of 40 Gb/s traveling-wave electroabsorption modulator-integrated DFB laser modules
Ho-Gyeong Yun;Kwang-Seong Choi;Yong-Hwan Kwon;Joong-Seon Choe;Jong-Tae Moon
56th Electronic Components and Technology Conference 2006
Year: 2006 | Conference Paper |
We developed 40 Gb/s traveling wave electroabsorption modulator-integrated DFB laser (TW-EML) modules using several advanced technologies. This 40 Gb/s EML device adopted traveling wave electrode structures and showed the result that the measured 3 dB bandwidth of the electrical-to-optical (E/O) response reached about 45 GHz and the return loss (S/sub 11/) was kept below -10 dB up to 50 GHz. For t...Show More
Impedance Matching Approach to 60 GHz Band Analog Traveling Wave Electro-Absorption Modulator (TWEAM) Module
Kwang-Seong Choi;Yong-Duck Chung;Young-Shik Kang;Dong-Suk Jun;Byoung-Tae Ahn;Jong-Tae Moon;Jeha Kim
2005 International Topical Meeting on Microwave Photonics
Year: 2005 | Conference Paper |
A traveling wave electro-absorption modulator (TWEAM) module for 60 GHz band radio-over fiber link was developed. The fractional bandwidth at the operating frequency can be controlled with the termination resistance and it was shown that to estimate the fractional bandwidth, the model should contain the effect of packaging parasitics. Impedance matching in the module was achieved with the double s...Show More
Fabrication and characteristics of traveling-wave electro-absorption modulator (TWEAM) modules for millimeter-wave radio-over-fiber link
Kwang-Seong Choi;Jong-Hyun Lee;Yong-Duck Chung;Young-Shik Kang;Byoung-Tae Ahn;Jong-Tae Moon;Jeha Kim
Proceedings Electronic Components and Technology, 2005. ECTC '05.
Year: 2005 | Conference Paper |
Cited by: Papers (5)
TWEAM modulator modules optimized in 40 GHz and 60 GHz band, respectively, were developed. The bandwidth at the operating frequency can be controlled with the termination resistance. Impedance matching of the modules was achieved using the double stub design and the laser trimming process. The measured Electrical-to-optical (E/O) response showed the increase in the response near 40 GHz and 60 GHz,...Show More
Effects of packaging design on the performance of TWEAM module for digital and analog applications
Kwang-Seong Choi;Jong-Hyun Lee;Jiyoun Lim;Young-Shik Kang;Yong-Duck Chung;Jong-Tae Moon;Jeha Kim
The 17th Annual Meeting of the IEEELasers and Electro-Optics Society, 2004. LEOS 2004.
Year: 2004 | Conference Paper |
Thermally controlled wavelength locker integrated in widely tunable SGDBR-LD module
Jongdeog Kim;Byung Seok Choi;Hogyeong Yun;Su Hwan Oh;Jong-Hyun Lee;Hyunsung Ko;Kwang-Seong Choi;Sahnggi Park;Jong Tae Moon;Moon-Ho Park
IEEE Photonics Technology Letters
Cited by: Papers (2)
A sampled-grating distributed Bragg reflector laser module having an integrated multiwavelength locker has been developed and evaluated. The uniquely designed wavelength locker made of thermally controlled etalon has provided uniform wavelength monitoring and very stable wavelength locking in the 188-ITU grid channels (37 nm) with 25-GHz spacing. Over the case temperature from -5/spl deg/C to 65/s...Show More
Electrical crosstalk analysis for gigabit optical transceiver module
Sung-Il Kim;Yong-Seong Eom;Byung-Seok Choi;Kwang-Seong Choi;Ho-Gyeong Yun;Jong-Hyun Lee;Jun-Hee Park;Jong-Deok Kim;Jong-Tae Moon
CLEO/Pacific Rim 2003. The 5th Pacific Rim Conference on Lasers and Electro-Optics (IEEE Cat. No.03TH8671)
Year: 2003 | Conference Paper |
Packaging technology for wavelength tunable filter based on optical MEMS
Yong-Sung Eom;Jong-Hyun Lee;Byung-Suk Choi;Jong-Deog Kim;Ho-Gyeong Yun;Kwang-Seong Choi;Jong-Tae Moon;Myung-Lae Lee;Chang-Auck Choi;Chi-Hoon Jun
2003 IEEE/LEOS International Conference on Optical MEMS (Cat. No.03EX682)
Year: 2003 | Conference Paper |
One of the key components for the WDM optical communication is a wavelength tunable filter. The packaging technology of the tunable filter with Fabry-Perot cavity based on optical MEMS is investigated for the low power consumption and mass production. The flip chip process with Au-20(wt.%)Sn solder was conducted to integrate two DBR mirrors in parallel with a constant distance for the simple desig...Show More
Fabrication process of copper lead frame chip scale package (LF-CSP)
Jong Tae Moon;Sung Hak Hong;Seung Wook Yoon;Chang Jun Park;Yoon Hwa Choi;Jae Myun Kim;Jong Hyun Lee;Ja Ryoung Kim;Yo Hwan Koh
1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)
Year: 1999 | Conference Paper |
In this study, a new packaging technique employing the copper LF-CSP was developed for memory devices. The technique is expected to be lower in production cost and better electrical performance compared with conventional packaging technique. In this paper, the simulation results on the electrical and thermal performance of the package, assembly process, selection of the UBM materials, and reliabil...Show More
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