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Study of the HPM Interference Effect on Integrated Circuit in a TEM Cell
Xue-Cheng Xu;Chun-Yong Han;E Shao;Xiang-Jun Lu;Wen-Xiao Fang;Rong-Quan Chen;Heng-Zhou Liu;Wei-Heng Shao;Yun-Lei Shi
2019 International Conference on Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE)
Year: 2019 | Conference Paper |
Cited by: Papers (1)
In this paper, HPM is used as the source of interference to affect the working state of an integrated circuit. The effect of the injected power and the orientation of the studied integrated circuit (FPGA) is investigated. In the experiment, it is found that the induced voltage of the I/O pin can reach 70.3 V under the electromagnetic field high to 1257.44 V/m. In spite of this, the working state o...Show More
Spatial resolution measurement of near-field probe by using two adjacent microstrip lines
Meizhen Xiao;Weiheng Shao;Wenxiao Fang;Rongquan Chen;Xinxin Tian;Zeyi Li;Lei Wang;Hengzhou Liu;Yulong Wang;Xuecheng Xu;Zhiyuan He;Heng Zhang
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Year: 2019 | Conference Paper |
Cited by: Papers (1)
In this paper, an experiment to distinguish the spatial resolution of different magnetic probes is executed. Different from traditional measuring method of spatial resolution by using one microstrip line, we measured the spatial resolution by changing two adjacent microstrip lines with space distances from 3 mm to 0.6 mm. By analyzing the test results, we can distinguish the spatial resolution of ...Show More
Electromagnetic Pattem Extraction and Classification of Integrated Circuit under Different Operation State
Rongquan Chen;Weiheng Shao;Wenxiao Fang;Meizhen Xiao;Lei Wang;Xinxin Tian;Zhiyuan He;Hengzhou Liu;Xuecheng Xu;Yulong Wang;Hang Zhang;Zeyi Li
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Year: 2019 | Conference Paper |
Cited by: Papers (2)
Extracting electromagnetic patterns by near field scanning can provide concrete information about a device under test (DUT), which benefits a lot when locating EMI sources. In this paper, we extracted the electromagnetic pattern of DUT under different operation state and classify the pattern with a machine learning algorithm for simplifying post-process procedure and better EMC engineering. The re...Show More
Study of Fields Above Differential Microstrip lines for Probe Characterization Application
Xinxin Tian;Zeyi Li;Rongquan Chen;Meizhen Xiao;Weiheng Shao;Wenxiao Fang;Duolong Wu;Lei Wang;Hengzhou Liu;Yulong Wang;Xuecheng Xu;Zhiyuan He;Heng Zhang
2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)
Year: 2019 | Conference Paper |
The spatial resolution of probe is defined for a 6-dB level drop point from the peak point close to the edge of the microstrip line. However, this definition is not clear for strongly coupled traces. If the spacing between adjacent traces is small enough, the probe may not detect multiple sources. In this paper, near fields above differential microstrip lines are investigated numerically and theor...Show More
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