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Maik Beer - IEEE Xplore Author Profile

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Author details

Maik Beer

Publications

9

Citations

41

Publications by Year

20162018

Co-Authors:

Werner BrockherdeJan F. HaaseBedrich J. HostickaRainer KokozinskiChristian Nitta

Show All Co-Authors (9)

Maik Beer

Affiliation

Fraunhofer Institute for Microelectronic Circuits and Systems (IMS), Duisburg, Germany

Publication Topics

Single-photon Avalanche Diode,
Ambient Light,
Dead Time,
Laser Pulse,
Probability Density Function,
Advanced Driver Assistance Systems,
Photon Detection,
Pulse Width,
Avalanche Diode,
Distancing Measures,
Event Rate,
Exponential Distribution

Biography

Maik Beer was born in Bad Friedrichshall, Germany, in 1987. He received the B.Eng. degree in electrical engineering from Heilbronn University, Germany, in 2013, and the M.Sc. degree in electrical engineering from the University of Stuttgart, Germany, in 2015. He is currently pursuing the Ph.D. degree in electrical engineering with the Department of Optical Sensor Systems, Fraunhofer Institute for Microelectronic Circuits and Systems, Duisburg, Germany.,His research interests include single-photon avalanche diode based time-of-flight sensors.(Based on document published on 3 October 2017).

Publications

9

Citations

41

Publications by Year

20162018

Co-Authors:

Werner Brockherde
Jan F. Haase
Bedrich J. Hosticka
Rainer Kokozinski
Christian Nitta

Show All Co-Authors (9)

Author's Published Works

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Showing 1-25 of 26 results

Conferences (21)

Journals (4)

Early Access Articles (1)

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Bin-Chyi Tseng(26)
Hank Lin(15)
Jackson Yen(7)
Chulsoon Hwang(6)
Li-Chun Liao(4)
ASUSTek Computer Inc., Taipei, Taiwan(3)
Department of Electrical Engineering, Feng Chia University FCU, Taichung, Taiwan(3)
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA(2)
Department of Computer Science and Information Engineering, Chao Yang University of Technology, Taichung, Taiwan(2)
Advanced Electromagnetics & Wireless Communication R&D Center, ASUSTek Computer Inc., Taipei(2)
2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)(3)
IEEE Transactions on Electromagnetic Compatibility(3)
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)(2)
2019 Electrical Design of Advanced Packaging and Systems (EDAPS)(2)
2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)(2)
IEEE(26)
Suntec City, Singapore(3)
Kaohsiung, Taiwan(2)
Long Beach, CA, USA(2)
New Orleans, LA, USA(2)
Austin, TX, USA(1)
Printed Circuit Board(15)
Differential Pair(6)
Electromagnetic Interference(6)
Simulation Results(6)
Common-mode Current(5)

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Transfer Learning Framework for 3-D Electromagnetic Applications

Oluwaseyi Akinwande;Xiaofan Jia;Andries Deroo;Yang Lu;Hank Lin;Bin-Chyi Tseng;Madhavan Swaminathan

IEEE Transactions on Microwave Theory and Techniques

Year: 2025 | Early Access Article |

In the realm of machine-learning (ML)-based electronic design automation (EDA), several factors contribute to inefficiency, posing various challenges. Initially, the lack of flexibility in input structures hinders the sharing of information across different circuit topologies. In addition, substantial costs are incurred in terms of simulation run times during the data generation process due to the...Show More

Transfer Learning Framework for 3-D Electromagnetic Applications

Oluwaseyi Akinwande;Xiaofan Jia;Andries Deroo;Yang Lu;Hank Lin;Bin-Chyi Tseng;Madhavan Swaminathan

IEEE Transactions on Microwave Theory and Techniques

Year: 2025 | Early Access Article |

Comparison of Radio Frequency Interference (RFI) Issue between Differential and Common Modes in USB Channel

Liang-Yen Wu;Chih-Yu Fang;Bin-Chyi Tseng;Jackson Yen;Tzong-Lin Wu

2024 International Symposium on Electromagnetic Compatibility – EMC Europe

Year: 2024 | Conference Paper |

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This study addresses the rising concern of radio frequency interference (RFI) issue in high-speed connectors, particularly focus on comparing the radiation noise generated from differential-mode (DM) signals and common-mode (CM) noise. While prior research has concentrated on CM noises and their suppression methods due to their strong radiation efficiency, DM noises, despite possessing weaker radi...Show More

Comparison of Radio Frequency Interference (RFI) Issue between Differential and Common Modes in USB Channel

Liang-Yen Wu;Chih-Yu Fang;Bin-Chyi Tseng;Jackson Yen;Tzong-Lin Wu

2024 International Symposium on Electromagnetic Compatibility – EMC Europe

Year: 2024 | Conference Paper |

Modeling of a Voltage Regulator Module for Power Integrity: Power Supply Induced Jitter

Junho Joo;Daniel L. Commerou;Hayden Huang;Chun-Yi Yeh;Jiaming Kang;Hank Lin;Bin-Chyi Tseng;Chulsoon Hwang

IEEE Transactions on Signal and Power Integrity

Year: 2024 | Volume: 3 | Journal Article |

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This article analyzes different methods for modeling a buck regulator among the variety of voltage regulator modules from the perspective of power integrity and assesses the accuracy of power supply induced jitter (PSIJ) predictions for each buck regulator model. To compare the buck regulator modeling approaches, methods for conventional passive component modeling and behavior modeling are introdu...Show More

Modeling of a Voltage Regulator Module for Power Integrity: Power Supply Induced Jitter

Junho Joo;Daniel L. Commerou;Hayden Huang;Chun-Yi Yeh;Jiaming Kang;Hank Lin;Bin-Chyi Tseng;Chulsoon Hwang

IEEE Transactions on Signal and Power Integrity

Year: 2024 | Volume: 3 | Journal Article |

Analysis of Ground Void Patterns for Differential Microstrip Impedance Matching on Surface Mount Pads

Kuan-Ting Wu;Hank Lin;Bin-Chyi Tseng;Jackson Yen

2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

Year: 2021 | Conference Paper |

Cited by: Papers (2)

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The mounting pads of surface mount device introduce transmission line discontinuities and cause signal integrity degradation. To compensate for the excess parasitic capacitance, ground void may be utilized on the ground plane underneath the pads. In this paper, conventional patterns of plane cutout are presented and analyzed using a 3-D full wave solver. In addition, new void patterns with circula...Show More

Analysis of Ground Void Patterns for Differential Microstrip Impedance Matching on Surface Mount Pads

Kuan-Ting Wu;Hank Lin;Bin-Chyi Tseng;Jackson Yen

2021 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

Year: 2021 | Conference Paper |

A Behavior Model of Voltage Regulator Module with Adaptive Voltage Positioning and PCB Parasitics for Power Distribution Network Design

Junho Joo;Anfeng Huang;Runbing Hua;Bin-Chyi Tseng;Hank Lin;Chulsoon Hwang

2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

Year: 2021 | Conference Paper |

Cited by: Papers (4)

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In this paper, a behavior modeling method of a buck converter with adaptive voltage positioning (AVP) and PCB parasitics for power distribution network design (PDN) is introduced. The behavior model of voltage regulator module (VRM) is previously proposed for the power integrity modeling and analysis. The proposed behavior model is applied to the buck VRM in a practical high-speed digital board. F...Show More

A Behavior Model of Voltage Regulator Module with Adaptive Voltage Positioning and PCB Parasitics for Power Distribution Network Design

Junho Joo;Anfeng Huang;Runbing Hua;Bin-Chyi Tseng;Hank Lin;Chulsoon Hwang

2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium

Year: 2021 | Conference Paper |

Via Design Optimization for Server Applications

Jin Ning Hu;Nick K. H. Huang;Bin-Chyi Tseng

2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE

Year: 2020 | Conference Paper |

Cited by: Papers (3)

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As the technology continues scaling down and the data rate is increasing dramatically, PCB design has become more challenging than ever. Keeping track of signal and power integrity becomes a requirement for PCB designers in order to meet the product development time and reduce the overall cost. In high speed IO signals, vias play a critical role for the signal integrity quality. It is important to...Show More

Via Design Optimization for Server Applications

Jin Ning Hu;Nick K. H. Huang;Bin-Chyi Tseng

2020 International Symposium on Electromagnetic Compatibility - EMC EUROPE

Year: 2020 | Conference Paper |

An Enhanced Deep Reinforcement Learning Algorithm for Decoupling Capacitor Selection in Power Distribution Network Design

Ling Zhang;Wenchang Huang;Jack Juang;Hank Lin;Bin-Chyi Tseng;Chulsoon Hwang

2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2020 | Conference Paper |

Cited by: Papers (22)

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The selection of decoupling capacitors (decap) is a critical but tedious process in power distribution network (PDN) design. In this paper, an improved decap-selection algorithm based on deep reinforcement learning (DRL), which seeks the minimum number of decaps through a self-exploration training to satisfy a given target impedance, is presented. Compared with the previous relevant work: the calc...Show More

An Enhanced Deep Reinforcement Learning Algorithm for Decoupling Capacitor Selection in Power Distribution Network Design

Ling Zhang;Wenchang Huang;Jack Juang;Hank Lin;Bin-Chyi Tseng;Chulsoon Hwang

2020 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2020 | Conference Paper |

Mechanism and Validation of USB 3.0 Connector Caused Radio Frequency Interference

Yin Sun;Hank Lin;Bin-Chyi Tseng;David Pommerenke;Chulsoon Hwang

IEEE Transactions on Electromagnetic Compatibility

Year: 2020 | Volume: 62, Issue: 4 | Journal Article |

Cited by: Papers (17)

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The mechanism of a universal serial bus 3.0 connector caused radio frequency interference (RFI) to a nearby antenna is studied. The connector radiation is modeled by an equivalent stripline-fed slot antenna, based on the analysis of the common mode current path on the connector structure. With the proposed connector model, the original connector radiation source can be replaced by an equivalent ma...Show More

Mechanism and Validation of USB 3.0 Connector Caused Radio Frequency Interference

Yin Sun;Hank Lin;Bin-Chyi Tseng;David Pommerenke;Chulsoon Hwang

IEEE Transactions on Electromagnetic Compatibility

Year: 2020 | Volume: 62, Issue: 4 | Journal Article |

Signal Integrity Analysis for Dual-Stripline Design

Nick K. H. Huang;Bin-Chyi Tseng

2019 Electrical Design of Advanced Packaging and Systems (EDAPS)

Year: 2019 | Conference Paper |

Cited by: Papers (2)

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In today's PCB design, dual-stripline is gaining more popular as it provides more density for signal routing of little PCB thickness therefore thinner products. However, it is becoming more important to keep track of signal and power integrity issues brought by the convenience of dual-stripline structure. It is well known dual-stripline crosstalk would cause severe problems for signals, in additio...Show More

Signal Integrity Analysis for Dual-Stripline Design

Nick K. H. Huang;Bin-Chyi Tseng

2019 Electrical Design of Advanced Packaging and Systems (EDAPS)

Year: 2019 | Conference Paper |

Self-Decoupled, 5G NR77/78/79 Two-Antenna System for Notebook Computers

Wei-Hsuan Chang;Saou-Wen Su;Bin-Chyi Tseng

2019 Electrical Design of Advanced Packaging and Systems (EDAPS)

Year: 2019 | Conference Paper |

Cited by: Papers (6)

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In this paper, we demonstrate that two antennas not only share the same radiator but also are decoupled using the same. The design consists of two driven coupling strips and one parasitic loop. The common parasitic loop is shared by two antennas and coupled-fed by both coupling strips. The driven strip is able to generate a monopole mode at about 4.6 GHz while the parasitic loop provides a 1.0-λ l...Show More

Self-Decoupled, 5G NR77/78/79 Two-Antenna System for Notebook Computers

Wei-Hsuan Chang;Saou-Wen Su;Bin-Chyi Tseng

2019 Electrical Design of Advanced Packaging and Systems (EDAPS)

Year: 2019 | Conference Paper |

Power & Ground Bridging Trace Design for Improved Power Integrity

Hank Lin;Bin-Chyi Tseng;Jackson Yen

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

Year: 2019 | Conference Paper |

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Nowadays, demand for slimmer and better performance consumer electronics increases dramatically. As PCB size keeps shrinking, power integrity issues such as high voltage drop and power loss arise due to lack of power and ground planes and broken power and ground shapes caused by densely-populated signal vias. In this paper, a novel design of power and ground bridging trace, placed between anti-pad...Show More

Power & Ground Bridging Trace Design for Improved Power Integrity

Hank Lin;Bin-Chyi Tseng;Jackson Yen

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

Year: 2019 | Conference Paper |

Decoupling Capacitor Selection Algorithm for PDN Based on Deep Reinforcement Learning

Ling Zhang;Zhongyang Zhang;Chenxi Huang;Han Deng;Hank Lin;Bin-Chyi Tseng;James Drewniak;Chulsoon Hwang

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

Year: 2019 | Conference Paper |

Cited by: Papers (28)

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Selection of decoupling capacitors (decaps) is important for power distribution network (PDN) design in terms of lowering impedance and saving cost. Good PDN designs typically mean satisfying a target impedance with as less decaps as possible. In this paper, an inductance-based method is utilized to calculate the port priority fist, and afterwards deep reinforcement learning (DRL) with deep neural...Show More

Decoupling Capacitor Selection Algorithm for PDN Based on Deep Reinforcement Learning

Ling Zhang;Zhongyang Zhang;Chenxi Huang;Han Deng;Hank Lin;Bin-Chyi Tseng;James Drewniak;Chulsoon Hwang

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

Year: 2019 | Conference Paper |

Optimization of Far-End Crosstalk Equations and Parameters for Single-Ended Dual-Stripline

Hank Lin;Bin-Chyi Tseng;Jackson Yen

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)

Year: 2018 | Conference Paper |

Cited by: Papers (1)

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As technology advances rapidly, the demand for smaller form factor and higher performance consumer electronics also increases drastically. Dual-stripline design is becoming more and more popular on account of the fact that it reduces the number of layers and cost of PCB which ultimately helps achieving smaller form factor. However, due to the fact that dual-stripline design does not have an extra ...Show More

Optimization of Far-End Crosstalk Equations and Parameters for Single-Ended Dual-Stripline

Hank Lin;Bin-Chyi Tseng;Jackson Yen

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)

Year: 2018 | Conference Paper |

RFI Noise Source Quantification Based on Reciprocity

Yin Sun;Bin-Chyi Tseng;Hank Lin;Chulsoon Hwang

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)

Year: 2018 | Conference Paper |

Cited by: Papers (14)

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In modern mobile electronic systems, several high speed digital ICs often working simultaneously and can cause interference issues with nearby antennas at the same time. In this paper, a method to quantify the contribution of multiple noise sources radiating simultaneously is proposed. The reciprocity theorem based radio frequency interference (RFI) estimation can be decomposed into forward and re...Show More

RFI Noise Source Quantification Based on Reciprocity

Yin Sun;Bin-Chyi Tseng;Hank Lin;Chulsoon Hwang

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)

Year: 2018 | Conference Paper |

Small-sized, printed 2.4/5-GHz WLAN notebook antenna aimed for 4×4 multiple transmit/receive antennas in future Gbps communications

Saou-Wen Su;Bin-Chyi Tseng

2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)

Year: 2018 | Conference Paper |

Cited by: Papers (3)

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To embrace Gbps data rate with higher through-put performance, 4×4 wireless local area network (WLAN) antennas embedded in the notebook computers can be foreseen in the near future. This will create more challenges for antenna engineers because antenna real estate is already a very limited commodity for current large screen-to-body-ratio notebooks. To deploy more antennas, the single antenna itsel...Show More

Small-sized, printed 2.4/5-GHz WLAN notebook antenna aimed for 4×4 multiple transmit/receive antennas in future Gbps communications

Saou-Wen Su;Bin-Chyi Tseng

2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)

Year: 2018 | Conference Paper |

Optimized FPC design with EMI film

Liang-Yu Shih;Hank Lin;Chung-Han Tsai;Bin-Chyi Tseng

2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)

Year: 2018 | Conference Paper |

In this paper, an optimized FPC structure design method is proposed to maintain good signal integrity with EMI film. The proposed FPC design could achieve better insertion loss, return loss, and impedance control compared to common FPC designs with no extra cost.Show More

Optimized FPC design with EMI film

Liang-Yu Shih;Hank Lin;Chung-Han Tsai;Bin-Chyi Tseng

2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)

Year: 2018 | Conference Paper |

Comprehensive signal and power co-investigation on DDR4 simulation and measurement

Nick K. H. Huang;Chih-Yao Hsieh;Bin-Chyi Tseng;Liang-Yu Shih

2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)

Year: 2018 | Conference Paper |

Cited by: Papers (2)

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As the technology continues to scale down and the data rate is increasing dramatically, PCB design has become more challenging than ever. Keeping track of signal and power integrity becomes a requirement for PCB designers in order to meet the product development time and reduce the overall cost. Memory is always the first component to check in a system, thus it is important to make full use of cir...Show More

Comprehensive signal and power co-investigation on DDR4 simulation and measurement

Nick K. H. Huang;Chih-Yao Hsieh;Bin-Chyi Tseng;Liang-Yu Shih

2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC)

Year: 2018 | Conference Paper |

Systematic Evaluation of Soft Failures in System-Level ESD Transient Events

Abhishek Patnaik;Wei Zhang;Runbing Hua;Lucas Chuang;Andrew Huang;Hank Lin;Bin-Chyi Tseng;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2018 | Volume: 60, Issue: 5 | Journal Article |

Cited by: Papers (3)

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A system such as a human-assisting robot consists of many subsystems such as sensors, display, motors, and control. When an electrostatic discharge (ESD) occurs, it can disrupt the normal operation of any subsystem. This paper analyzes such events beginning at the tribo-charging down to the sensor disruption. The rolling wheels charge the robot, and a discharge occurs when it reaches the charging ...Show More

Systematic Evaluation of Soft Failures in System-Level ESD Transient Events

Abhishek Patnaik;Wei Zhang;Runbing Hua;Lucas Chuang;Andrew Huang;Hank Lin;Bin-Chyi Tseng;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2018 | Volume: 60, Issue: 5 | Journal Article |

Novel design with minimized far-end crosstalk on single-ended striplines

Hank Lin;Bin-Chyi Tseng;Jackson Yen

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2017 | Conference Paper |

Cited by: Papers (3)

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As technology advances, the demand for slim size and higher performance consumer electronics also increases drastically. Stripline is one of the layout designs that is becoming more and more popular on account of the fact that its homogenous characteristics could effectively decrease the interference from both the environmental and material factors. However, far-end crosstalk (FEXT) still exists d...Show More

Novel design with minimized far-end crosstalk on single-ended striplines

Hank Lin;Bin-Chyi Tseng;Jackson Yen

2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)

Year: 2017 | Conference Paper |

Noise reduction between high speed differential pairs and ground shape

Chung-Han Tsai;Hank Lin;Shih-Keng Chuang;Bin-Chyi Tseng

2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

Year: 2017 | Conference Paper |

Cited by: Papers (4)

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Electromagnetic interference (EMI) issue is usually caused by mutual coupled signal or coupling between signal trace and power/ground shapes which consequently creates radiations in the air. The way to solve this problem is to increase the distance between them. By comparing their S-parameter and current density, a real EMI issue is being discussed and two solutions are studied in this paper. Firs...Show More

Noise reduction between high speed differential pairs and ground shape

Chung-Han Tsai;Hank Lin;Shih-Keng Chuang;Bin-Chyi Tseng

2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)

Year: 2017 | Conference Paper |

Study of frequency offset behavior for artificial magnetic structure in compact mobile device

Chung-Yuan Liu;Chi-Kai Shen;Shih-Yuan Chen;Tzong-Lin Wu;Jinjia Chang;Bin-Chyi Tseng;Jackson Yen

2016 IEEE International Symposium on Antennas and Propagation (APSURSI)

Year: 2016 | Conference Paper |

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Frequency offset behavior of artificial magnetic structure (AMC) with finite size in real applications is investigated in this paper. A simplified model of wireless mobile device is adopted to observe this behavior. Two important features of AMC with finite size, number of unit-cells and total size of AMC structure, are analyzed to find main root cause of frequency offset behavior. A design sugges...Show More

Study of frequency offset behavior for artificial magnetic structure in compact mobile device

Chung-Yuan Liu;Chi-Kai Shen;Shih-Yuan Chen;Tzong-Lin Wu;Jinjia Chang;Bin-Chyi Tseng;Jackson Yen

2016 IEEE International Symposium on Antennas and Propagation (APSURSI)

Year: 2016 | Conference Paper |

Effect of power noise coupling between power via and signal via and its relationship with distance

Hank Lin;Bin-Chyi Tseng;Jackson Yen

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)

Year: 2016 | Conference Paper |

Cited by: Papers (9)

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The power switching noise caused by rapid charging and discharging has always been an issue in PDN (Power Delivery Network) design. This noise would not only deteriorate the stability of the power profile, it would also couple to signal transition via if the power via is placed nearby, resulting in deterioration of the overall system signal integrity. Therefore, the relative placement between powe...Show More

Effect of power noise coupling between power via and signal via and its relationship with distance

Hank Lin;Bin-Chyi Tseng;Jackson Yen

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)

Year: 2016 | Conference Paper |

Design and implementation of a quadruped robot insect

Li-Chun Liao;Kun-Yen Huang;Bin-Chyi Tseng

2015 IEEE International Conference on Mechatronics and Automation (ICMA)

Year: 2015 | Conference Paper |

Cited by: Papers (3)

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In order to cultivate the comprehensive skills of students to develop a robot system, this paper proposed a low cost and simple robot system. The students designed and implemented a quadruped robot insect_ named robot-K. The electrical parts of robot-K contain servo motors, a DC-brushless motor, one microcontroller, a wireless communication module, an electronic speed control device and one batter...Show More

Design and implementation of a quadruped robot insect

Li-Chun Liao;Kun-Yen Huang;Bin-Chyi Tseng

2015 IEEE International Conference on Mechatronics and Automation (ICMA)

Year: 2015 | Conference Paper |

Analytical Solutions for the Radiated Emission of Parallel Microstrip Traces

Bin-Chyi Tseng;Li-Chun Liao;Lin-Kun Wu;Hui-Tsui Lung

IEEE Transactions on Electromagnetic Compatibility

Year: 2011 | Volume: 53, Issue: 3 | Journal Article |

Cited by: Papers (11)

A closed-form expression of the unintentional electromagnetic radiation of parallel microstrip traces is proposed. Based on transmission line theory, far-field Green's function, and concept of array factor in antenna theory, analytical solutions for the electric field radiated from a pair of parallel microstrip lines are developed. Depending on the printed circuit board material, dimension paramet...Show More

Analytical Solutions for the Radiated Emission of Parallel Microstrip Traces

Bin-Chyi Tseng;Li-Chun Liao;Lin-Kun Wu;Hui-Tsui Lung

IEEE Transactions on Electromagnetic Compatibility

Year: 2011 | Volume: 53, Issue: 3 | Journal Article |

Salt-and-Pepper Noise Elimination by PI-Remover and Modified AMF Noise Detectors

Li-Chun Liao;Shin-Jung Gu;Bin-Chyi Tseng

2009 Fifth International Conference on Intelligent Information Hiding and Multimedia Signal Processing

Year: 2009 | Conference Paper |

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This paper proposes a new filtering scheme _ PI remover for effectively eliminating the salt-and-pepper noise of images. The PI-remover can be created straightforwardly based on the concept of proportional-integral (PI) controller. Similar as the design of PI-controller, the PI-remover also has the proportional parameter kP and integral parameter kI, that are used to weight the noisy pixels. The m...Show More

Salt-and-Pepper Noise Elimination by PI-Remover and Modified AMF Noise Detectors

Li-Chun Liao;Shin-Jung Gu;Bin-Chyi Tseng

2009 Fifth International Conference on Intelligent Information Hiding and Multimedia Signal Processing

Year: 2009 | Conference Paper |

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