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Chi-Kai Shen - IEEE Xplore Author Profile
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Chi-Kai Shen

Publications
14
Citations
92
Publications by Year
20142019
Co-Authors:
Show All Co-Authors (27)
Image of author Chi-Kai Shen

Chi-Kai Shen

Affiliation

Department of Electrical of Engineering
Graduate Institute of Communication Engineering
National Taiwan University, Taipei, Taiwan

Publication Topics

Biography

Chi-Kai Shen (S’14) received the B.S. degree in physics and M.S. degree in electro-optical engineering from National Taiwan University, Taipei, Taiwan, in 2008 and 2010, respectively, where he is currently pursuing the Ph.D. degree at the Graduate Institute of Communication Engineering.,His current research interests include electromagnetic bandgap structure design and power integrity design in advanced package and PCB.,Mr. Shen is currently a member of the Phi Tau Phi Scholastic Honor Society. He was a recipient of the Best Student Paper Award of 2015 APEMC and the President Memorial Award of 2015 Joint ISEMC and EMC Europe.(Based on document published on 19 October 2018).
Publications
14
Citations
92
Publications by Year
20142019
Co-Authors:
Show All Co-Authors (27)
Author's Published Works

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Design and Modeling of a Compact Partially Transmissible Resistor-Free Absorptive Frequency Selective Surface for Wi-Fi Applications

Chun-Wen Lin;Chi-Kai Shen;Cheng-Nan Chiu;Tzong-Lin Wu

IEEE Transactions on Antennas and Propagation
Year: 2019 | Volume: 67, Issue: 2 | Journal Article |
Cited by: Papers (9)
A compact partially transmissible absorptive frequency selective surface (AFSS) which requires neither surface mount device resistors nor resistive ink is proposed in this communication. The resistor-free AFSS utilizes the lossy characteristic of FR-4 substrate material to achieve the absorption property. The method to efficiently model the AFSS based on physical phenomena has been thoroughly disc...Show More

Design and Modeling of a Compact Partially Transmissible Resistor-Free Absorptive Frequency Selective Surface for Wi-Fi Applications

Chun-Wen Lin;Chi-Kai Shen;Cheng-Nan Chiu;Tzong-Lin Wu

Year: 2019 | Volume: 67, Issue: 2 | Journal Article |

An Electromagnetic Bandgap Structure Integrated With RF LNA Using Integrated Fan-Out Wafer-Level Package for Gigahertz Noise Suppression

Pei-Shen Wei;Ming-Hsien Tsai;Sen-Kuei Hsu;Chi-Kai Shen;Tzong-Lin Wu

IEEE Transactions on Microwave Theory and Techniques
Year: 2018 | Volume: 66, Issue: 12 | Journal Article |
Cited by: Papers (16)
This paper presents a periodic electromagnetic bandgap (EBG) structure in the integrated fan-out wafer-level package (InFO-WLP) technology for gigahertz-band noise suppression. The proposed EBG structure consists of an LC resonator with two symmetrical spiral inductors in series and a shunt metal-insulator-metal capacitor between power and ground planes. The third-order equivalent model of the EBG...Show More

An Electromagnetic Bandgap Structure Integrated With RF LNA Using Integrated Fan-Out Wafer-Level Package for Gigahertz Noise Suppression

Pei-Shen Wei;Ming-Hsien Tsai;Sen-Kuei Hsu;Chi-Kai Shen;Tzong-Lin Wu

Year: 2018 | Volume: 66, Issue: 12 | Journal Article |

A Miniature Electromagnetic Bandgap Structure Using Integrated Fan-Out Wafer-Level Package (InFO-WLP) for Gigahertz Noise Suppression

Ming-Hsien Tsai;Sen-Kuei Hsu;Chi-Kai Shen;Pei-Shen Wei;Chan-Honq Chern;Tzong-Lin Wu

2018 IEEE/MTT-S International Microwave Symposium - IMS
Year: 2018 | Conference Paper |
Cited by: Papers (3)
This work presents a periodic electromagnetic bandgap (EBG) structure in integrated fan-out wafer-level package (InFO-WLP) technology for GHz-band noise suppression. The proposed EBG structure consists of an LC resonator with two symmetrical spiral inductors in series and a shunt MIM capacitor between power and ground planes. The EBG arrays with different sizes of unit cell, and the corresponding ...Show More

A Miniature Electromagnetic Bandgap Structure Using Integrated Fan-Out Wafer-Level Package (InFO-WLP) for Gigahertz Noise Suppression

Ming-Hsien Tsai;Sen-Kuei Hsu;Chi-Kai Shen;Pei-Shen Wei;Chan-Honq Chern;Tzong-Lin Wu

Year: 2018 | Conference Paper |

Ultracompact Via-Based Absorptive Frequency-Selective Surface for 5-GHz Wi-Fi With Passbands and High-Performance Stability

Chun-Wen Lin;Chi-Kai Shen;Tzong-Lin Wu

IEEE Transactions on Components, Packaging and Manufacturing Technology
Year: 2018 | Volume: 8, Issue: 1 | Journal Article |
Cited by: Papers (17)
A miniaturized absorptive frequency-selective surface (AFSS) allowing power transmission in other specific band is proposed in this paper. The via-based structure is adopted to make unit-cell size only 0.109λ0 × 0.109λ0, where λ0 is the wavelength in free space at operating frequency. The maximum absorption rate of 99.3% locates at 5.45 GHz and half-power absorption ranges from 5.198 to 5.882 GHz,...Show More

Ultracompact Via-Based Absorptive Frequency-Selective Surface for 5-GHz Wi-Fi With Passbands and High-Performance Stability

Chun-Wen Lin;Chi-Kai Shen;Tzong-Lin Wu

Year: 2018 | Volume: 8, Issue: 1 | Journal Article |

EBG-Based Grid-Type PDN on Interposer for SSN Mitigation in Mixed-Signal System-in-Package

Chi-Kai Shen;Yi-Chang Lu;Yi-Peng Chiou;Hsieh-Hung Hsieh;Ming-Hsien Tsai;Sally Liu;Tzong-Lin Wu

IEEE Microwave and Wireless Components Letters
Year: 2017 | Volume: 27, Issue: 12 | Journal Article |
Cited by: Papers (8)
A novel electromagnetic bandgap (EBG)-based grid-type power distribution network (PDN), or grid-type EBG (GT-EBG), is proposed for interposer PDN. The behavior of the proposed EBG structure at cutoff frequencies is first analyzed, and a simplified circuit model is proposed to help control the bandgap behavior. Then the proposed design is realized with the integrated passive device process and vali...Show More

EBG-Based Grid-Type PDN on Interposer for SSN Mitigation in Mixed-Signal System-in-Package

Chi-Kai Shen;Yi-Chang Lu;Yi-Peng Chiou;Hsieh-Hung Hsieh;Ming-Hsien Tsai;Sally Liu;Tzong-Lin Wu

Year: 2017 | Volume: 27, Issue: 12 | Journal Article |

An efficient partition analysis for electromagnetic interference estimation of high-speed input/output differential interfaces

Chi-Kai Shen;Tzong-Lin Wu;Tze-Min Shen;Chih-Ying Hsiao;Ting-Kuang Wang;Kuan-Yu Chen

2017 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)
Year: 2017 | Conference Paper |
To estimate electromagnetic interference (EMI) results of differential high-speed input/output interfaces more quickly, an partition method is proposed by separating system into source generation part and radiation part. Also, the partition analysis can help find contribution of differential-mode (DM) and common-mode (CM) to the unwanted radiation. A measurement validation on HDMI assesses the com...Show More

An efficient partition analysis for electromagnetic interference estimation of high-speed input/output differential interfaces

Chi-Kai Shen;Tzong-Lin Wu;Tze-Min Shen;Chih-Ying Hsiao;Ting-Kuang Wang;Kuan-Yu Chen

Year: 2017 | Conference Paper |

Design and modeling of an absorptive frequency selective surface with several transmissive bands

Chun-Wen Lin;Chi-Kai Shen;Tzong-Lin Wu

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)
Year: 2016 | Conference Paper |
Cited by: Papers (2)
An absorptive frequency selective surface (AFSS) which allows signals transmitted in some specific bands is proposed. The transmitting characteristic is rare among AFSS design in the past and can be used to shield the whole package of mixed signal systems. The proposed AFSS provides above 97% absorption at 5.6 GHz in the Wi-Fi band and allows at least half power transmission below 1.84 GHz and abo...Show More

Design and modeling of an absorptive frequency selective surface with several transmissive bands

Chun-Wen Lin;Chi-Kai Shen;Tzong-Lin Wu

Year: 2016 | Conference Paper |

Study of frequency offset behavior for artificial magnetic structure in compact mobile device

Chung-Yuan Liu;Chi-Kai Shen;Shih-Yuan Chen;Tzong-Lin Wu;Jinjia Chang;Bin-Chyi Tseng;Jackson Yen

2016 IEEE International Symposium on Antennas and Propagation (APSURSI)
Year: 2016 | Conference Paper |
Frequency offset behavior of artificial magnetic structure (AMC) with finite size in real applications is investigated in this paper. A simplified model of wireless mobile device is adopted to observe this behavior. Two important features of AMC with finite size, number of unit-cells and total size of AMC structure, are analyzed to find main root cause of frequency offset behavior. A design sugges...Show More

Study of frequency offset behavior for artificial magnetic structure in compact mobile device

Chung-Yuan Liu;Chi-Kai Shen;Shih-Yuan Chen;Tzong-Lin Wu;Jinjia Chang;Bin-Chyi Tseng;Jackson Yen

Year: 2016 | Conference Paper |

Compact Cascaded-Spiral-Patch EBG Structure for Broadband SSN Mitigation in WLAN Applications

Chi-Kai Shen;Siang Chen;Tzong-Lin Wu

IEEE Transactions on Microwave Theory and Techniques
Year: 2016 | Volume: 64, Issue: 9 | Journal Article |
Cited by: Papers (20)
A compact cascaded-spiral-patch electromagnetic bandgap (CSP-EBG) structure for wideband simultaneously switching noise suppression is proposed. Instead of using double open stubs to provide dual-band noise suppression for a wireless local area network (WLAN), the proposed CSP-EBG structure offers an even wider bandgap, covering multiple adjacent WLAN bands from 2.4 to 6 GHz. A 1-D equivalent circ...Show More

Compact Cascaded-Spiral-Patch EBG Structure for Broadband SSN Mitigation in WLAN Applications

Chi-Kai Shen;Siang Chen;Tzong-Lin Wu

Year: 2016 | Volume: 64, Issue: 9 | Journal Article |

Post-fabricated EBG tape on electronic devices for RFI mitigation in WLAN bands

Wen-Yi Hsu;Chi-Kai Shen;Tzong-Lin Wu;Chung-Hao Chen;Dong-Ho Han

2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Year: 2015 | Conference Paper |
A thin tape with double-stacked electromagnetic bandgap (EBG) structure is proposed for RFI suppression in this paper. This thin EBG tape sticks on only single side of parallel-plate structure formed by printed-circuit board (PCB) and chassis, which is named as single-sided EBG tape (SS-EBG tape). SS-EBG tape provides a RFI solution in a post-fabricating way and can be fabricated with PCB process....Show More

Post-fabricated EBG tape on electronic devices for RFI mitigation in WLAN bands

Wen-Yi Hsu;Chi-Kai Shen;Tzong-Lin Wu;Chung-Hao Chen;Dong-Ho Han

Year: 2015 | Conference Paper |

Compact hybrid open stub EBG structure for power noise suppression in WLAN band

Chi-Kai Shen;Tzong-Lin Wu

2015 IEEE International Symposium on Electromagnetic Compatibility (EMC)
Year: 2015 | Conference Paper |
Cited by: Papers (4)
A compact hybrid open stub EBG structure for broadband power noise suppression is proposed. With an additional lumped component on proper locations of open stub, the proposed EBG structure could offer a wider bandgap to cover the whole associated WLAN bands or an aggregated bandgap ranging from WLAN band to above 10 GHz. A 1-D equivalent circuit model is also developed with validation by full-wave...Show More

Compact hybrid open stub EBG structure for power noise suppression in WLAN band

Chi-Kai Shen;Tzong-Lin Wu

Year: 2015 | Conference Paper |

Design of on-chip microwave filters in integrated fan-out wafer level packaging (InFO-WLP) technology

Chi-Kai Shen;Ming-Hsien Tsai;Huan-Neng Chen;Chewn-Pu Jou;Sally Liu;Fu-Lung Hsueh;Tzong-Lin Wu

2015 Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC)
Year: 2015 | Conference Paper |
Cited by: Papers (1) | Patents (4)
This paper investigates the microwave lowpass filters in integrated fan-out wafer-level packaging (InFO-WLP) technology. The Chebyshev prototype is adopted to achieve sharp cutoff at the edge of passband. A lumped-LC structure and three different distributed structures, including λ/8 stubs, stepped-impedance, and periodic tapered electromagnetic bandgap (EBG), are employed to find an appropriate m...Show More

Design of on-chip microwave filters in integrated fan-out wafer level packaging (InFO-WLP) technology

Chi-Kai Shen;Ming-Hsien Tsai;Huan-Neng Chen;Chewn-Pu Jou;Sally Liu;Fu-Lung Hsueh;Tzong-Lin Wu

Year: 2015 | Conference Paper |

Modeling and Analysis of Bandwidth-Enhanced Multilayer 1-D EBG With Bandgap Aggregation for Power Noise Suppression

Chi-Kai Shen;Chung-Hao Chen;Dong-Ho Han;Tzong-Lin Wu

IEEE Transactions on Electromagnetic Compatibility
Year: 2015 | Volume: 57, Issue: 4 | Journal Article |
Cited by: Papers (7)
A circuit model of multilayer electromagnetic bandgap (EBG) structure with application on bandgap aggregation design is investigated in this paper. A design concept for bandgap aggregation is merging the lowest two bandgaps into an equivalent wide bandgap by narrowing central passband. This goal could be achieved by optimizing pitch and arrangement of power/ground vias. The theoretical circuit mod...Show More

Modeling and Analysis of Bandwidth-Enhanced Multilayer 1-D EBG With Bandgap Aggregation for Power Noise Suppression

Chi-Kai Shen;Chung-Hao Chen;Dong-Ho Han;Tzong-Lin Wu

Year: 2015 | Volume: 57, Issue: 4 | Journal Article |

Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression

Chi-Kai Shen;Tzong-Lin Wu;Chung-Hao Chen;Dong-Ho Han

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC)
Year: 2014 | Conference Paper |
Cited by: Papers (5)
A one-dimensional multilayer electromagnetic bandgap (EBG) structure is investigated for size reduction and bandwidth enhancement. A design concept for bandwidth enhancement of the multilayer EBG structure focuses on merging multi-bandgap into one wide bandgap by making inner passbands as narrow as possible. Such goal could be achieved by optimizing the arrangement of power/ground vias. It is also...Show More

Miniaturized and bandwidth-enhanced multilayer 1-D EBG structure for power noise suppression

Chi-Kai Shen;Tzong-Lin Wu;Chung-Hao Chen;Dong-Ho Han

Year: 2014 | Conference Paper |

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