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Lucas Chuang

Publications

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Publications by Year

20182018

Co-Authors:

Runbing HuaAndrew HuangHank LinAbhishek PatnaikDavid Pommerenke

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Lucas Chuang

Affiliation

ASUSTeK Computer Inc., Taiwan

Publication Topics

Charging Voltage,
Combination Of Materials,
Common-mode Current,
Common-mode Noise,
Contact Surface,
Current Probe,
Current-clamp,
Discharge Current,
Electrostatic Discharge,
Failure Threshold,
Fast Changes,
Field Coupling

Biography

Lucas (Shih-Keng) Chuang received the M.S. degree from the Graduate Institute of Communication Engineering, National Taiwan University, Taipei, Taiwan, in 2014.,From 2015 to 2017, he was an Engineer with the Advanced EM Technical Department, ASUSTek Computer INC., Taipei, Taiwan, working on signal and power integrity in high-speed digital systems.(Based on document published on 19 April 2018).

Publications

Citations

Publications by Year

20182018

Co-Authors:

Runbing Hua
Andrew Huang
Hank Lin
Abhishek Patnaik
David Pommerenke

Show All Co-Authors (7)

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ASUSTeK Computer Inc., Taiwan(1)
EMC Laboratory, Missouri University of Science and Technology, Rolla, USA(1)
IEEE Transactions on Electromagnetic Compatibility(1)
IEEE(1)
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Combination Of Materials(1)
Common-mode Current(1)
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Systematic Evaluation of Soft Failures in System-Level ESD Transient Events

Abhishek Patnaik;Wei Zhang;Runbing Hua;Lucas Chuang;Andrew Huang;Hank Lin;Bin-Chyi Tseng;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2018 | Volume: 60, Issue: 5 | Journal Article |

Cited by: Papers (3)

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A system such as a human-assisting robot consists of many subsystems such as sensors, display, motors, and control. When an electrostatic discharge (ESD) occurs, it can disrupt the normal operation of any subsystem. This paper analyzes such events beginning at the tribo-charging down to the sensor disruption. The rolling wheels charge the robot, and a discharge occurs when it reaches the charging ...Show More

Systematic Evaluation of Soft Failures in System-Level ESD Transient Events

Abhishek Patnaik;Wei Zhang;Runbing Hua;Lucas Chuang;Andrew Huang;Hank Lin;Bin-Chyi Tseng;David Pommerenke

IEEE Transactions on Electromagnetic Compatibility

Year: 2018 | Volume: 60, Issue: 5 | Journal Article |

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