I. Introduction
Fiber optic technology has become a leading approach in the areas of communication [1], [2], data transmission [3], [4], and sensors [5]–[7]. For communication and data transmission, fiber optic signals are faster than electrical signals and are not subject to distortion from external noise and electro-magnetic interference [8]. Fiber optics also have size and weight advantages compared to copper wire due to the much higher bandwidth [9]. In addition, fiber optics such as sensors are increasingly common from temperature [10] and pressure sensors [11] to crack detection and other applications. Many applications for fiber optics require coupling the endface of a fiber to an integrated optoelectronic component (IOC). This coupling is a necessary operation and is the dominant cost of producing an optical device. However, existing research can not achieve the attachment automatically, resulting to the expensive cost and low efficiency of production.