I. Introduction
Thermal interface material (TIM) has a wide application in electronic package divides. With the rapid technological development, the increasing level of function integration and the fast introduction of new materials, the thermal dissipation problem is becoming one of the major concerns of the packaging module [1]. Due to outstanding physical properties with high electron mobility, thermal conductivity, mechanical stiffness, strength and elasticity, graphene is attracting much interest. Then the graphene composite material becomes a candidate material as thermal interface material in future electronic devices [2]. There is the obvious sintering behavior of Ag nanoparticles at low-temperature than the Tm of silver with 960 °C. The sintering of the nanoparticle pellet led to a significant increase in density and electrical conductivity which thermal behavior can be used interconnects applications for packaging module [3]. Silver nanoparticles assembled on graphene oxide sheets have been exploited as a novel thermal interface material. In this paper, we attempt to investigate the thermal performance of micron grade nano-silver /Graphene composite material.