Preparation and Thermal Analysis of the nano-silver /Graphene composite material for packaging module

In recent years, all kinds of heat dissipation method are carried out for high-power high-density packaging devices such as an air forced convection heat sink, single phase liquid-cooled cold plate, two-phase cold plate and so on. With the nanotechnology development, high conductivity, low thermal resistance material and sintering connect technology was developed for Micro/Nanoelectromechanical Systems (MEMS/NEMS). In this background, nano silver/graphene composite paste material was prepared to study thermal transport performance for the demand of electronic product under high temperature condition. Firstly, the different ratio of nano silver/graphne composite material was prepared by a third step method. The morphology feature of the sample was observed and the thermogravimetry (TG) curve and differential scanning calorimetry (DSC) were studied to analyze the thermal properties and crystallization behaviors, respectively. Secondly, the two kinds of finite element models of chip/substrate and LED device and heat sink are established by using ANSYS software. Thirdly, the temperature distribution and equivalent stress of three thermal interface materials such as thermal grease, solder and composite material for two models were investigated. The obtained results are important for the application of TIM in high power device.

I. Introduction

Thermal interface material (TIM) has a wide application in electronic package divides. With the rapid technological development, the increasing level of function integration and the fast introduction of new materials, the thermal dissipation problem is becoming one of the major concerns of the packaging module [1]. Due to outstanding physical properties with high electron mobility, thermal conductivity, mechanical stiffness, strength and elasticity, graphene is attracting much interest. Then the graphene composite material becomes a candidate material as thermal interface material in future electronic devices [2]. There is the obvious sintering behavior of Ag nanoparticles at low-temperature than the T_m of silver with 960 °C. The sintering of the nanoparticle pellet led to a significant increase in density and electrical conductivity which thermal behavior can be used interconnects applications for packaging module [3]. Silver nanoparticles assembled on graphene oxide sheets have been exploited as a novel thermal interface material. In this paper, we attempt to investigate the thermal performance of micron grade nano-silver /Graphene composite material.