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200 Gb/s Uncooled EML with Single MQW Layer Stack Design | IEEE Conference Publication | IEEE Xplore

200 Gb/s Uncooled EML with Single MQW Layer Stack Design


Abstract:

We demonstrate an EML for 200 Gb/s PAM4 modulation at uncooled conditions. The device has an identical MQW layer stack for the DFB, EAM and SOA section, which allows a si...Show More

Abstract:

We demonstrate an EML for 200 Gb/s PAM4 modulation at uncooled conditions. The device has an identical MQW layer stack for the DFB, EAM and SOA section, which allows a simple fabrication process. The EML is designed for balanced performance from 20°C to 85°C.
Date of Conference: 18-22 September 2022
Date Added to IEEE Xplore: 20 December 2022
ISBN Information:
Conference Location: Basel, Switzerland

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