Introduction
To advance miniaturization and improve functional performance of high-speed electronics, there is growing need for dielectric films with high permittivity. Such materials can be used to construct integrated passive devices embedded within chip substrates and printed circuit sub-assemblies. Recently, high dielectric constant polymer-ferroelectric ceramic composites have shown promise for embedded decoupling capacitance and power planes with desirable, low impedance characteristics over a broad frequency range, including the microwave [1]. However, the dielectric relaxation behavior and the origin of the high frequency dispersion in polymer-ceramic composites is still poorly understood [2] and typically attributed to the domain structure of the ceramic component [3].