Issues of Dual Connectivity and Carrier Aggregation enhancement for low latency EMBB | IEEE Conference Publication | IEEE Xplore

Issues of Dual Connectivity and Carrier Aggregation enhancement for low latency EMBB

Publisher: IEEE

Abstract:

Carrier aggregation is one of the technologies that could utilize the bandwidth effectively and remedies the lack of high-capacity processing electronic components for wi...View more

Abstract:

Carrier aggregation is one of the technologies that could utilize the bandwidth effectively and remedies the lack of high-capacity processing electronic components for wide bandwidth support on the very high frequency band. This paper describes the research of carrier aggregation that can be utilized in very high frequency band and facilitates large-capacity transfers with the advantages of large bandwidth.
Date of Conference: 20-22 October 2021
Date Added to IEEE Xplore: 07 December 2021
ISBN Information:
Print on Demand(PoD) ISSN: 2162-1233
Publisher: IEEE
Conference Location: Jeju Island, Korea, Republic of

Funding Agency:


I. Introduction

Very high frequency band, which includes the ranges of teraherz, provides advantages such as wide, continuous bandwidth, increased inherent directivity, and the ability to support minimized antenna. Although the terahertz band is especially attractive in that it can provide a far wider bandwidth than the communication bandwidth provided by the millimeter wave, technologies related to the parts and devices needed to fully utilize this type of wide bandwidth are undeveloped or currently under development[1] [2]. In addition, the terahertz band has the radio wave characteristics of becoming strongly absorbed to atmospheric moisture such as vapor, penetrating non-ionized substances such as plastic and wood, and reflecting on metal, which are the features that cause signal attenuation and path loss, resulting in short radio wave reach and vulnerability to interference or blockage by obstacles[3].

References

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